JPS60206052A - Glass-sealed type diode - Google Patents

Glass-sealed type diode

Info

Publication number
JPS60206052A
JPS60206052A JP5933084A JP5933084A JPS60206052A JP S60206052 A JPS60206052 A JP S60206052A JP 5933084 A JP5933084 A JP 5933084A JP 5933084 A JP5933084 A JP 5933084A JP S60206052 A JPS60206052 A JP S60206052A
Authority
JP
Japan
Prior art keywords
electrode
chip
hole
smaller diameter
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5933084A
Other languages
Japanese (ja)
Inventor
Shigeru Kawada
川田　茂
Yoshimi Watanabe
渡辺　好美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP5933084A priority Critical patent/JPS60206052A/en
Publication of JPS60206052A publication Critical patent/JPS60206052A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent the displacement of a chip during pressure-pinching with electrodes by a method wherein the opposite surface of an electrode is provided with a part of positioning a diode chip. CONSTITUTION:The periphery of the opposite surface 12 of one electrode 1 is projected out to the side of the opposite electrode 2 to a degree smaller than the thickness of the chip 3, and its inside is made inclined, resulting in the production of an annular projection 14 triangular in cross-section. At the time of assembly, the electrode 1 is inserted to the hole 51 of the lower mold 5 of carbon with the smaller diameter part 11 upward, and the chip 3 is inserted to the hole 51 and mounted inside the projection 14; then, a glass tube 4 is inserted to the hole 51 and fitted to the electrode smaller diameter part 11. The electrode 2 is inserted to the hole 61 of the upper mold 6 of carbon with the smaller diameter part 21 upward, and the upper mold 6 is reversed and stacked on the lower mold 5, when the smaller diameter part 21 penetrates into the glass tube 4 and abuts against the chip 3. On heating by imposing a load P on the electrode 2 with a rod 7 through the hole, the tube 4 reduces in diameter and welds to the smaller diameter parts 11 and 21. At this time, the chip 3 does not displace, but is pinched by pressure contact with the electrodes 1 and 2 under the shrinkage of the tube 4 on cooling.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明はダイオードチップの変位を防止したガラス封止
形ダイオードに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a glass-sealed diode in which displacement of a diode chip is prevented.

〔発明の技術的背景〕[Technical background of the invention]

たとえばリードレスガラス封止形ダイオードは１対の釘
形電極小径部端面な対向させて、端面間ってダイオード
チップを密封したものである。For example, a leadless glass-sealed diode has a pair of nail-shaped electrodes facing each other with their small-diameter end faces facing each other, and a diode chip sealed between the end faces.

〔背景技術の問題点〕[Problems with background technology]

電極間でダイオードチップを挾圧しながらガラスチュー
ブを封着するとき、ダイオードチップが電極端面の周辺
方向に変位し、その状態で挾持固定されることがある。When the glass tube is sealed while the diode chip is clamped between the electrodes, the diode chip may be displaced toward the periphery of the electrode end face, and may be clamped and fixed in that state.

このようなチップの位置不良品は特性が不安定で使用で
きず、その発生率は従来的０．０５　％にも達していた
。Products with such defective chips have unstable characteristics and cannot be used, and the incidence of such defects has reached as high as 0.05% in the past.

〔発明の目的〕[Purpose of the invention]

本発明はダイオードチップが変位するおそれのないガラ
ス封止形ダイオードを提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a glass-sealed diode in which there is no fear that the diode chip will be displaced.

〔発明の概要〕[Summary of the invention]

電極の対向面にダイオードチップの変位を防止する位置
決め部を設けたことにより、両電極でダイオードチップ
を挾圧してもチップが変位しないようにしたことである
。By providing a positioning portion on the opposing surfaces of the electrodes to prevent displacement of the diode chip, the chip is prevented from being displaced even if the diode chip is clamped between the two electrodes.

〔発明の実施例〕[Embodiments of the invention]

本発明の詳細を図示のリードレスガラス封止形ダイオー
ドを例にして説明する。（１）、（２）は対向した１対
のジュメット線から成る電極、（３）はこれらダイオー
ドチップ（３）を密封したガラスチューブである。The details of the present invention will be explained using the illustrated leadless glass-sealed diode as an example. (1) and (2) are electrodes consisting of a pair of Dumet wires facing each other, and (3) is a glass tube in which these diode chips (3) are sealed.

上記電極（１）、（２）は第２図および第８図に拡大し
て示すように、ジュメット線をプレス成形して釘形に形
成したもので、小径部（１１）、ＣＩ！Ｉ）を対向させ
ててガラスチューブ（４）が溶着している。そうして、
大径ｓｔ＋も（ハ）が露出し、要すれば大径部（１３，
ＣＩ！３の端面には接続用のはんだ被覆を施してもよい
。The electrodes (1) and (2) are press-molded dumet wires and formed into a nail shape, as shown in enlarged view in FIGS. 2 and 8, and have a small diameter portion (11), a CI! A glass tube (4) is welded to the glass tubes (I) facing each other. Then,
The large diameter st+ (c) is also exposed, and if necessary, the large diameter part (13,
CI! The end face of 3 may be coated with solder for connection.

しかして、本実施例の特徴とするところは１方の電極（
１）の対向面（１３にダイオードチップ（３）が変位し
ないように突起などの位置決め部を設けたことである。However, the feature of this embodiment is that one electrode (
1) A positioning portion such as a protrusion is provided on the opposing surface (13) to prevent the diode chip (3) from being displaced.

たとえば第２図および第８図に示すよりに、対向面（Ｌ
４の周縁をダイオードチップ（３）の厚さより小さい範
囲で対向電極（２）方向に突出し、かつ内側を斜面にし
て断面三角形の環状突起（２）からなる位置決め部を形
成し、この突起住養に囲まれた平面にダイオードチップ
（３）（破線で示す。）を位置させる。このような環状
突起は電極（１）を釘形にプレス成形するとき、押し屋
の縁に還状切欠きｔ設けておけばよい。For example, as shown in FIGS. 2 and 8, the opposite surface (L
A positioning part is formed by an annular protrusion (2) having a triangular cross-section, with the peripheral edge of the diode chip (3) protruding toward the counter electrode (2) within a range smaller than the thickness of the diode chip (3), and with the inner side sloped. A diode chip (3) (indicated by a broken line) is positioned on a plane surrounded by. Such an annular projection may be provided by providing an annular notch t on the edge of the pusher when press-molding the electrode (1) into a nail shape.

つぎに、このダイオードの組立て方法を示し、併せて環
状突起ａ４によってダイオードチップ（３）の変位が防
止できる運出な説明する。第４図に示すように、カーボ
ン製下Ｗ（５）の受け孔（５１）に１方の電極（１）ヲ
小径郡αυを上向きにして挿入し、ついでダイオードチ
ップ（３）を受け孔（５１）に挿入して電極（１）の対
向面Ｑ３の環状突起ａ→の内側に載置し、さらにガラス
チューブ（４）を受け孔（５１）に挿入して電極小径部
（Ｌｌ）に嵌装する。一方力−ボン製上屋（６）の受け
孔（６１）に他方の電極（２）を小径部（２１）を上向
きにして挿入し、この上型（６）を裏返しにして下型（
５）に重合する。すると、他方の電極（２）の小径部Ｉ
２υがガラスチューブ（４）内に進入し、ダイオードチ
ップ（３）に当接する。そこで上型（６）の押し孔（６
２）から棒状押圧具（７）を挿入して他方の電極（２）
に荷重ケ）を加え、この状態で両型（５）　、　（６）
を加熱炉で加熱する。すると、ガラスチューブ（４）は
軟化して縮径し、両電極（１）、（２）ノ小径郡（１１
）、１２υに溶層する。このとき、ダイオードチップ（
３）が小径部αηの径方向に変位しようとしても、環状
突起（Ｉ４）に阻止されて変位することはない。そこで
、両Ｗ（５）、　（６）を冷却すると、ガラスチューブ
（４）が冷却して固化し、さらに常温まで冷却する。こ
のとき、ガラスチューブ（４）が熱収縮し、これに伴っ
て電極間距離が縮少し、ダイオードチップ（３）は両電
極（１）　、　（２）によって圧接挾持される。Next, a method for assembling this diode will be shown, and a method for transporting the diode chip (3) that can be prevented from being displaced by the annular protrusion a4 will be explained. As shown in Fig. 4, one electrode (1) is inserted into the receiving hole (51) of the carbon lower W (5) with the small diameter group αυ facing upward, and then the diode chip (3) is inserted into the receiving hole (51). 51) and place it on the inside of the annular protrusion a→ of the opposing surface Q3 of the electrode (1), and then insert the glass tube (4) into the receiving hole (51) and fit it into the electrode small diameter part (Ll). to wear Insert the other electrode (2) into the receiving hole (61) of the Rikibon shed (6) with the small diameter part (21) facing upward, turn the upper mold (6) over, and turn the lower mold (
5) Polymerize. Then, the small diameter part I of the other electrode (2)
2υ enters the glass tube (4) and abuts the diode chip (3). Then, press holes (6) in the upper die (6).
Insert the rod-shaped pressing tool (7) from 2) to the other electrode (2).
Add a load (Ke) to and in this state both molds (5) and (6)
is heated in a heating furnace. Then, the glass tube (4) softens and reduces its diameter, and the small diameter group (11) of both electrodes (1) and (2)
), molten at 12υ. At this time, the diode chip (
3) attempts to displace in the radial direction of the small diameter portion αη, the annular protrusion (I4) prevents the displacement. Therefore, when both W (5) and (6) are cooled, the glass tube (4) is cooled and solidified, and further cooled to room temperature. At this time, the glass tube (4) is thermally shrunk, the distance between the electrodes is accordingly reduced, and the diode chip (3) is clamped by both electrodes (1) and (2).

このように、本実施例ダイオードは電極（１）の対向面
（１１）に位置決め郡の一例として環状突起（Ｌ４）を
設けたので、組立てにあたり、ダイオードチップ（３）
の変位が防止され、変位に起因する特性不安定が防止で
きる。実験によれば、本実施例において、ダイオードチ
ップ（３）の変位に起因する特性不安定の発生率は１９
８５０個中４個（０，０２チ）に過ぎず、従来の０，０
５％に比較して６０％の歩留向上になった。In this way, the diode of this embodiment is provided with the annular protrusion (L4) as an example of a positioning group on the opposing surface (11) of the electrode (1), so when assembling the diode chip (3)
Displacement is prevented, and characteristic instability caused by displacement can be prevented. According to experiments, in this example, the occurrence rate of characteristic instability due to displacement of the diode chip (3) was 19
Only 4 out of 850 (0.02chi), compared to the conventional 0.0
The yield was improved by 60% compared to 5%.

つぎに、位置決め部の他の例を示す。第５図は電極（１
）の対向面住りの周辺部に８個以上の点状突起←→、住
均・・・を環状配設したもので、これら突起（１９゜ａ
９・・・によってダイオードチップ（３）（破線で示す
。）の変位を防止するものである。また、第６図および
第７図は電極（１）の対向面ａりの中央部に凹孔ｔｉｅ
を設け、との凹孔（Ｌｅにダイオードチップ（３）（破
線で示す。）を収容して変位を防止するものである、な
お、前述の実施例はいずれも１方の電極だけに位置決め
部を設けたが、本発明はこれに限らず位置決め部を設け
た電極を両電極に兼用してもよく、この場合、双方の突
起の高さや凹孔の深さの合計はダイオードチップの厚さ
よりも小さくすることが必要である。Next, another example of the positioning section will be shown. Figure 5 shows the electrode (1
), eight or more point-like protrusions ←→, Jyuhitoshi... are arranged in a ring around the opposite surface of the housing, and these protrusions (19°a
9... prevents the diode chip (3) (indicated by a broken line) from being displaced. In addition, in FIGS. 6 and 7, a recessed hole is formed in the center of the opposing surface a of the electrode (1).
The diode chip (3) (indicated by the broken line) is accommodated in the concave hole (Le) to prevent displacement. However, the present invention is not limited to this, and an electrode provided with a positioning portion may also be used as both electrodes. In this case, the total height of both protrusions and depth of the recess is less than the thickness of the diode chip. It is also necessary to make it smaller.

また、本発明はリード線付きガラス封止ダイオードにも
適用できることもちろんである。そうして、電極の形状
に限定はない。It goes without saying that the present invention can also be applied to glass-sealed diodes with lead wires. Thus, there are no limitations on the shape of the electrodes.

〔発明の効果〕〔Effect of the invention〕

本発明のガラス封止ダイオードは１対の電極間−ドチッ
プを密封したものにおいて、電極の対向面にダイオード
チップ・の変位を防止する位置決め部を設けたので、ダ
イオードチップの変位に起因する特性不安定を防止でき
る。The glass-sealed diode of the present invention has a sealed chip between a pair of electrodes, and a positioning portion is provided on the opposing surface of the electrodes to prevent displacement of the diode chip. Stability can be prevented.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明のガラス封止ダイオードの一実施例の断
面図、第２図は同じく電極の一例の正面図、第８図は同
じく側面図、第４図は上記実施例ダイオードの製造方法
を示す説明図、第５図は電極の他の例の正面図、第６図
は電極のさらに他の例の正面図、第７図は同じく部分側
面図である。 （１）、（２）・・・電極　αη、　Ｃ１１）・・・電
極小径部ａり、０榎・−・電極対向面　（ＩＬＧ！Ｉ・
・・電極大径ＥｘＱ４）、（１！１９．αｅ・・・位置
決め突起　（３）・・・ダイオード（４）・・・ガラス
チューブ 代理人　弁理士　井　上　−男 第　１　図 第　２　図　第　３　図FIG. 1 is a sectional view of an embodiment of the glass-sealed diode of the present invention, FIG. 2 is a front view of an example of the electrode, FIG. 8 is a side view, and FIG. 4 is a method of manufacturing the diode of the above embodiment. FIG. 5 is a front view of another example of the electrode, FIG. 6 is a front view of yet another example of the electrode, and FIG. 7 is a partial side view of the same. (1), (2)... Electrode αη, C11)... Electrode small diameter part a, 0 Enoki - Electrode opposing surface (ILG!I)
...Electrode large diameter ExQ4), (1!19.αe...Positioning protrusion (3)...Diode (4)...Glass tube representative Patent attorney Mr. Inoue 1st figure 2nd figure 3 figure

Claims (1)

【特許請求の範囲】 プによって上記ダイオードチップを密封し【なるものに
おいて、上記電極の対向面に上記ダイオードチップの変
位を防止する位置決め部を設けたことを特徴とするガラ
ス封止形ダイオード。Claims: A glass-sealed diode, wherein the diode chip is hermetically sealed by a glass sealant, wherein a positioning portion for preventing displacement of the diode chip is provided on a surface facing the electrode.
JP5933084A 1984-03-29 1984-03-29 Glass-sealed type diode Pending JPS60206052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5933084A JPS60206052A (en) 1984-03-29 1984-03-29 Glass-sealed type diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5933084A JPS60206052A (en) 1984-03-29 1984-03-29 Glass-sealed type diode

Publications (1)

Publication Number Publication Date
JPS60206052A true JPS60206052A (en) 1985-10-17

Family

ID=13110217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5933084A Pending JPS60206052A (en) 1984-03-29 1984-03-29 Glass-sealed type diode

Country Status (1)

Country Link
JP (1) JPS60206052A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111316A (en) * 1997-08-29 2000-08-29 Motorola, Inc. Electronic component encapsulated in a glass tube
CN102259247A (en) * 2011-06-14 2011-11-30 许行彪 One-hole welding mould and welding technique of electric element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111316A (en) * 1997-08-29 2000-08-29 Motorola, Inc. Electronic component encapsulated in a glass tube
CN102259247A (en) * 2011-06-14 2011-11-30 许行彪 One-hole welding mould and welding technique of electric element

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