JPS60204370A - Wiring pattern - Google Patents

Wiring pattern

Info

Publication number
JPS60204370A
JPS60204370A JP6059584A JP6059584A JPS60204370A JP S60204370 A JPS60204370 A JP S60204370A JP 6059584 A JP6059584 A JP 6059584A JP 6059584 A JP6059584 A JP 6059584A JP S60204370 A JPS60204370 A JP S60204370A
Authority
JP
Japan
Prior art keywords
wiring
recording head
resistance
distance
short
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6059584A
Other languages
Japanese (ja)
Other versions
JPH0510229B2 (en
Inventor
Hisanori Tsuda
津田 尚徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP6059584A priority Critical patent/JPS60204370A/en
Publication of JPS60204370A publication Critical patent/JPS60204370A/en
Publication of JPH0510229B2 publication Critical patent/JPH0510229B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for

Abstract

PURPOSE:To provide a wiring pattern having uniform wiring resistance and high reliability, enabled in miniaturization and used in an ink jet recording head, constituted by bypassing wirings having a short wiring distance among a large number of wirings. CONSTITUTION:In an ink jet recording head, n-pieces of energy generators 5 are provided and a common electrode 6 is provided so as to be connected to one terminal of said energy generator 5 while wiring patterns are formed onto a flexible substrate 7 to be respectively connected to other terminals of the energy generators 5 as indivisual electrodes. The wiring patterns are connected to a connector part P3 through P1 and P2 parts. The wiring W1 having a short wiring distance of the P2 part is formed in a bent form to prolong the length of wiring even if the wiring distance is same to enhance wiring resistance and the wiring length is adjusted to obtain wiring patterns having uniform wiring resistance.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は配線パターンに係り、特に配線抵抗の均一化を
企図した配線ノJ?ターンに関する。
[Detailed Description of the Invention] [Technical Field] The present invention relates to wiring patterns, and particularly to wiring patterns intended to equalize wiring resistance. Regarding turns.

〔従来技術〕[Prior art]

以下、−例としてインクジェット記録ヘッドの場合を説
明する。
The case of an inkjet recording head will be described below as an example.

第1図は従来のインクジェット記録ヘッドの配線基板の
部分的な平面図である。
FIG. 1 is a partial plan view of a wiring board of a conventional inkjet recording head.

同図において、基板1上には複数本の配線がエツチング
によって形成され、配線・ぐターンを構成している。
In the figure, a plurality of wires are formed on a substrate 1 by etching to form wires/guts.

従来、インクジェットヘッドの配線は、ヘッド部分の線
密度が細かく(8本/w以上)、コネクト部の配線密度
が大きく(1本/、、以下)なっている。
Conventionally, in the wiring of an inkjet head, the line density of the head portion is fine (more than 8 lines/w), and the line density of the connection part is higher (1 line/w or less).

そのために、ノ臂ターン上で配線を引き回す場合、第1
図に示したように、直線に近い配線(たとえば配線2)
と、おシまげて配線を引き回さなければならない配線(
たとえば配線3)とでは、配線の長さが異なっていた。
For this reason, when routing wiring on the arm turn,
As shown in the diagram, the wiring is close to a straight line (for example, wiring 2)
And the wiring that has to be routed around (
For example, wiring 3) and wiring 3) had different lengths.

またインクジェットヘッドのインク吐出限界電圧が配線
抵抗に影響を大きく受けることも従来かられかっていた
It has also been known for some time that the ink ejection limit voltage of an inkjet head is greatly affected by wiring resistance.

そこで従来は、第1図に示したように、配線の長さが短
い配線(たとえば配線2)は巾を細く、長さの長い配線
(たとえば配線3)は巾を広くして配線抵抗を均一化す
る必要があった。
Conventionally, as shown in Figure 1, wires with short lengths (for example, wire 2) are narrowed in width, and long wires (for example, wire 3) are made wide in order to equalize the wire resistance. There was a need to change it.

しかしながら、配線のノ4ターン巾を細くしすぎると(
50μm以下)、断線する確率が高くなシ、まfc、配
線パターンのエツチング精度が吐出限界電圧に与える影
響が大きくなるという欠点があった。
However, if the width of the four turns of wiring is made too thin (
50 μm or less), the probability of wire breakage is high, and the etching precision of the wiring pattern has a large influence on the ejection limit voltage.

さらに、ヘッドとコネクタ一部が同一面上であっても、
方向が異なっている場合は、第2図に示したように、配
線ノ母ターンを有する長めのフレキシブルプリント基板
4等を用いてひねらなければならなかった・ 〔発明の目的〕 本発明は上記従来の欠点に鑑み成されたものであシ、そ
の目的は均一な配線抵抗を有するとともに、信頼性が高
く小形化が可能な配線パターンを提供することにある。
Furthermore, even if the head and part of the connector are on the same surface,
If the directions are different, as shown in FIG. 2, it would be necessary to twist the wiring using a longer flexible printed circuit board 4 or the like having a main turn. This was created in view of the conventional drawbacks, and its purpose is to provide a wiring pattern that has uniform wiring resistance, is highly reliable, and can be miniaturized.

〔発明の要旨〕[Summary of the invention]

上記目的を達成するために、本発明による配線パターン
は複数本の配線のうち配線距離の短い配線を迂回させた
ことを特徴とする。
In order to achieve the above object, the wiring pattern according to the present invention is characterized in that among the plurality of wirings, a wiring having a short wiring distance is detoured.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第3図は本発明による配線パターンの一実施例の平面図
である。ただし本実施例では、インクジェット記録ヘッ
ドの場合が示される〇 同図において、インクジェット記録ヘッドにはn個のエ
ネルギ発生体5(たとえば圧電素子、電気熱変換体等)
と、その一端に共通電極6とが設けられている。また、
フレキシブル基板7上には本実施例である配線・リーン
が形成され、それぞれ個別電極としてエネルギ発生体5
の他端に接続されている。
FIG. 3 is a plan view of one embodiment of the wiring pattern according to the present invention. However, in this embodiment, the case of an inkjet recording head is shown. In the figure, the inkjet recording head has n energy generating bodies 5 (for example, piezoelectric elements, electrothermal transducers, etc.).
and a common electrode 6 is provided at one end thereof. Also,
On the flexible substrate 7, the wiring and lean circuits of this embodiment are formed, and the energy generators 5 are connected as individual electrodes.
connected to the other end.

本実施例において、エネルギ発生体5側の配線幅40μ
m+ 密度16 V闘の/?ターンは、PlおよびP、
部を介してコネクタ接続部P3につながっている。
In this embodiment, the wiring width on the energy generating body 5 side is 40 μm.
m+ density 16 V fight/? The turn is Pl and P,
It is connected to the connector connection part P3 via the section.

コネクタ接続部P3の配線幅は1.2 rtsまで広げ
ることが可能であるが、22部における最短配線距離a
と最長配線距離すとの比が1=5となるために、配線抵
抗の均一化対策が必要となる。従来の対策では、直線状
の配線W1の幅を150趣、配線W2O幅を30μmと
して配線抵抗を均一化していたが、すでに述べたように
、50μm以下の配線幅の場合、エツチング精度等が抵
抗値に大きく影響するという欠点があった。たとえば、
21部の配線がすべて直線状であると仮定すると、配線
幅を2μmオーバーエツチングした場合、配線抵抗は約
5.7チ変化してしまう。
The wiring width of the connector connection part P3 can be increased to 1.2 rts, but the shortest wiring distance a in the 22nd part
Since the ratio between the maximum wiring distance and the longest wiring distance is 1=5, it is necessary to take measures to equalize the wiring resistance. In the conventional countermeasure, the wiring resistance was made uniform by setting the width of the straight wiring W1 to 150 mm and the width of the wiring W2O to 30 μm. However, as already mentioned, in the case of a wiring width of 50 μm or less, the etching accuracy etc. The drawback was that it greatly affected the value. for example,
Assuming that all the wiring in section 21 is straight, if the wiring width is over-etched by 2 μm, the wiring resistance will change by about 5.7 inches.

そこで本実施例では、配線距離の短い配線Wi(第3図
では1≦i≦4)を折り曲げて形成する。
Therefore, in this embodiment, the wiring Wi having a short wiring distance (1≦i≦4 in FIG. 3) is formed by bending.

そのために、配線距離は同一であっても、配線の長さを
長くすることができ、配線抵抗を高めることができる。
Therefore, even if the wiring distance is the same, the length of the wiring can be increased, and the wiring resistance can be increased.

したがって配線幅を50μmより広くすることができる
。このように、各配線Wiの配線距離によシ配線の長さ
を調整し、すべての配線W1〜Wnの幅を50μmよシ
広く、かつ配線抵抗を均一化することができる。
Therefore, the wiring width can be made wider than 50 μm. In this way, the length of each wiring Wi can be adjusted according to the wiring distance, and the widths of all the wirings W1 to Wn can be made wider than 50 μm, and the wiring resistance can be made uniform.

むろん1P1部における配線の長さの長短が配線抵抗に
大きく影響する場合は、その影響を計算に入れて配線W
1〜Wnの長さを決めればよい。
Of course, if the length of the wiring in the 1P1 section has a large effect on the wiring resistance, take that influence into account when determining the wiring W.
The length of 1 to Wn may be determined.

々お、本実施例では、配線密度の異なる部分(Pl部)
と配線の方向が異なる部分(Pg部)とが組み合わされ
ているが、むろんこれに限定されず、どちらか一方であ
ってもよい。要は、配線距離の長短が配線抵抗の変化に
実質的に影響を与える場合に本発明は適用されうる。
In this example, the part with different wiring density (Pl part)
and a portion (Pg portion) with different wiring directions are combined; however, the present invention is not limited to this, and either one may be used. In short, the present invention can be applied when the length of the wiring distance substantially affects the change in wiring resistance.

(5) したがって、本発明はインクジェット記録ヘットタケテ
はなく、他のあらゆる配線ノ臂ターンKJ用されうる。
(5) Therefore, the present invention does not have to be used as an inkjet recording head bracket, but can be applied to any other type of wiring turn KJ.

次に、配線密度の異なる部分(Pl部)のみを有し、方
向をかえることなくコネクタ接続部P3につながってい
る他の実施例をインクジェット式の記録ヘッドに搭載し
た場合を説明する。
Next, a case will be described in which another embodiment, which has only a portion (Pl portion) with a different wiring density and is connected to the connector connection portion P3 without changing the direction, is mounted on an inkjet recording head.

第4図および第5図は記録ヘッド8の斜視図である。記
録ヘッド8のケース9にはオリフィス10が設けられ、
側面に共通電極6が露出している。また裏面にはコネク
タ接続部P、の配線Wi(1≦l≦n)が露出している
4 and 5 are perspective views of the recording head 8. FIG. An orifice 10 is provided in the case 9 of the recording head 8,
A common electrode 6 is exposed on the side surface. Furthermore, the wiring Wi (1≦l≦n) of the connector connection portion P is exposed on the back surface.

第6図は第4図におけるI−1線断面図である。FIG. 6 is a sectional view taken along line I-1 in FIG. 4.

同図において、フレキシブル基板7はケース9内に図示
されるように配置され、エネルギ発生体5はオリフィス
10の位置に設けられる〇インクはインクタンク11か
らエネルギ発生体5とケース9との間に供給され、その
インクはエネルギ発生体5に電圧が印加されるとオリフ
ィス10から吐出する@ (6) 〔発明の効果〕 以上詳細に説明したように、本発明による配線AIエタ
ーμ配線距離の短い配線を迂回させたために各配線の抵
抗値を容易に均一化することができる。
In the same figure, the flexible substrate 7 is arranged as shown in the case 9, and the energy generator 5 is provided at the position of the orifice 10. Ink is supplied from the ink tank 11 between the energy generator 5 and the case 9. The ink is ejected from the orifice 10 when a voltage is applied to the energy generator 5. Since the wiring is detoured, the resistance value of each wiring can be easily made uniform.

しかも配線幅をあtシ狭くする必要がないために、配線
バターニングの歩留りが向上する〇したがって、たとえ
ばインクジェット記録ヘッド等に適用した場合、インク
吐出限界電圧がすべてのノズルについて一定となシ、ヘ
ラPの安定性。
Moreover, since there is no need to narrow the wiring width, the yield of wiring patterning is improved. Therefore, when applied to an inkjet recording head, for example, the ink ejection limit voltage is constant for all nozzles. Stability of Hera P.

信頼性が向上する。Improved reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のインクジェット記録ヘッドの配線基板の
部分的な平面図、 第2図はフレキシブルプリント基板の取り付は例を示す
斜視図、 第3図は本発明による配線・臂ターンの一実施例を示す
平面図 第4図および第5図は本発明による他の実施例を記録ヘ
ッドに用いた場合の記録へ、ドの斜視図、第6図は第4
図におけるl−1va断面図である。 7・・・フレキシブル基板、8・・・インクジェット記
録ヘッド、10・・・オリフィス、W1〜Wn・・・配
線。 第 4 @5図
FIG. 1 is a partial plan view of a wiring board of a conventional inkjet recording head, FIG. 2 is a perspective view showing an example of mounting a flexible printed circuit board, and FIG. 3 is an implementation of wiring/arm turn according to the present invention. FIGS. 4 and 5 are plan views showing examples, and FIGS.
It is a 1-1va sectional view in the figure. 7... Flexible substrate, 8... Inkjet recording head, 10... Orifice, W1 to Wn... Wiring. Part 4 @Figure 5

Claims (2)

【特許請求の範囲】[Claims] (1)複数本の配線から成る配線・母ターンにおいて、
配線距離の短い配線を迂回させたことを特徴とする配線
パターン。
(1) In wiring/mother turns consisting of multiple wires,
A wiring pattern characterized by detouring wiring with short wiring distances.
(2)上記配線距離の短い配線は他の配線と比較して幅
が狭いことを特徴とする特許請求の範囲第1項記載の配
線ノ4ターン。
(2) The four-turn wiring according to claim 1, wherein the wiring having a short wiring distance is narrower than other wirings.
JP6059584A 1984-03-30 1984-03-30 Wiring pattern Granted JPS60204370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6059584A JPS60204370A (en) 1984-03-30 1984-03-30 Wiring pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6059584A JPS60204370A (en) 1984-03-30 1984-03-30 Wiring pattern

Publications (2)

Publication Number Publication Date
JPS60204370A true JPS60204370A (en) 1985-10-15
JPH0510229B2 JPH0510229B2 (en) 1993-02-09

Family

ID=13146743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6059584A Granted JPS60204370A (en) 1984-03-30 1984-03-30 Wiring pattern

Country Status (1)

Country Link
JP (1) JPS60204370A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107160A (en) * 1996-10-07 1997-04-22 Hokuriku Electric Ind Co Ltd Printed board
US8247627B2 (en) 2008-04-25 2012-08-21 Exxonmobil Chemical Patents Inc. Process for producing phenol and/or cyclohexanone
US8802907B2 (en) 2010-02-05 2014-08-12 Exxonmobil Chemical Patents Inc. Dehydrogenation process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006256152A (en) * 2005-03-17 2006-09-28 Fuji Xerox Co Ltd Piezoelectric element substrate, droplet ejection head, and droplet ejection device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS585754U (en) * 1981-07-06 1983-01-14 ブラザー工業株式会社 Thermal head with wiring pattern
JPS5912643U (en) * 1982-07-14 1984-01-26 アルプス電気株式会社 thermal head

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5912643B2 (en) * 1975-04-03 1984-03-24 和光純薬工業 (株) Production method of phenethyl bromides
JPS585754B2 (en) * 1980-08-28 1983-02-01 株式会社東芝 Laser welding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS585754U (en) * 1981-07-06 1983-01-14 ブラザー工業株式会社 Thermal head with wiring pattern
JPS5912643U (en) * 1982-07-14 1984-01-26 アルプス電気株式会社 thermal head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107160A (en) * 1996-10-07 1997-04-22 Hokuriku Electric Ind Co Ltd Printed board
US8247627B2 (en) 2008-04-25 2012-08-21 Exxonmobil Chemical Patents Inc. Process for producing phenol and/or cyclohexanone
US8802907B2 (en) 2010-02-05 2014-08-12 Exxonmobil Chemical Patents Inc. Dehydrogenation process

Also Published As

Publication number Publication date
JPH0510229B2 (en) 1993-02-09

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