JPS60203434A - Manufacture of transparent conductive film - Google Patents

Manufacture of transparent conductive film

Info

Publication number
JPS60203434A
JPS60203434A JP5950984A JP5950984A JPS60203434A JP S60203434 A JPS60203434 A JP S60203434A JP 5950984 A JP5950984 A JP 5950984A JP 5950984 A JP5950984 A JP 5950984A JP S60203434 A JPS60203434 A JP S60203434A
Authority
JP
Japan
Prior art keywords
film
transparent conductive
coating
parts
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5950984A
Other languages
Japanese (ja)
Other versions
JPH0112664B2 (en
Inventor
節夫 鈴木
高須 信孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP5950984A priority Critical patent/JPS60203434A/en
Publication of JPS60203434A publication Critical patent/JPS60203434A/en
Publication of JPH0112664B2 publication Critical patent/JPH0112664B2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は溶融押出法により得られたポリエーテルスルホ
ンまたはポリスルホンフィルムを用いた透明導電性フィ
ルムの製造法に係るものでおり、更に詳しくはフィルム
上の少くとも片面に、ビニル基を有するシラン化合物お
よび多官能ビニル化合物光増感剤、および溶剤を主要成
分とする塗布液を塗布し乾燥後紫外線照射により反応硬
化せしめ然る後該硬化物層上に透明導電層を形成して透
明導電性フィルムを製造する方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a transparent conductive film using a polyethersulfone or polysulfone film obtained by a melt extrusion method, and more specifically, on at least one side of the film, A coating solution containing a silane compound having a vinyl group, a polyfunctional vinyl compound photosensitizer, and a solvent as main components is applied, dried, and then reacted and cured by ultraviolet irradiation. After that, a transparent conductive layer is formed on the cured product layer. The present invention relates to a method for manufacturing a transparent conductive film.

近年液晶を用いる表示累子の伸長は著しるしいものがお
り、このため透明電極のl装柱が増しつつある。従来液
晶聚示累子に用いられる電極は、薄いガラス板上に導電
性薄膜を形成した鯖ゆるネサガラスが用いられ、該導電
性薄膜をエツチングすることにより電極回路を形成する
という方法が広く行なわれて来た。然しながら素子の簿
記化、軽量化、it量産化要求され透明高分子フィルム
上に導電性薄膜を形成した透明電極の検討が広範に行な
われる様になり、一部実用化され始めている。
In recent years, there has been a remarkable growth in display elements using liquid crystals, and as a result, the number of transparent electrodes is increasing. Conventionally, the electrodes used in liquid crystal display devices are made of Saba glass, which is made by forming a conductive thin film on a thin glass plate, and the electrode circuit is formed by etching the conductive thin film. I came. However, in response to demands for device bookkeeping, weight reduction, and IT mass production, transparent electrodes in which a conductive thin film is formed on a transparent polymer film have become widely studied, and some of them have begun to be put into practical use.

一方高分子フイルムを用いた透明導性フィルムは薄激化
、軽量化、量産化、高強展化の観点からは優れてはいる
ものの直接フィルム上に導電層を形成しfc場合、ガラ
スに比較して問題点を有していることも事実である。即
ち ■ 液晶の配向処理を目的とした電極歯の2ビン死・ グ処理工程での導電薄膜の耐摩耗性が気く表面抵抗が増
大する。
On the other hand, although transparent conductive films using polymeric films are superior from the viewpoints of thinning, weight reduction, mass production, and high strength, they are not as good as glass in the case of fc, in which a conductive layer is formed directly on the film. It is also true that there are problems. That is, (2) the abrasion resistance of the conductive thin film during the double-bottoming process of the electrode teeth for the purpose of aligning the liquid crystal increases, and the surface resistance increases.

@ 実用化もしくは実用化に近い高分子フィルムとして
一軸配向ポリエステルフイルムを用いた透明導電フィル
ムが有るが耐熱性が劣るのに加えて光学異方性を有する
支持体であるため光学軸を偏光板軸と厳密に一致させる
ことが非富に困難である。また軸方向の揃ったフィルム
を得ることも同様困難である。
@ A transparent conductive film using a uniaxially oriented polyester film is a polymer film that has been put into practical use or is close to being put into practical use, but in addition to having poor heat resistance, the optical axis is the polarizing plate axis because the support has optical anisotropy. It is difficult for non-wealth to match strictly. It is also difficult to obtain a film with uniform axial directions.

θ 非旋光性フィルムとして謂ゆるキャストフィルムが
考えられるが非富に生産性に劣る。
θ A so-called cast film can be considered as a non-optically active film, but its productivity is extremely low.

、O導電層薄膜との密層性が悪く耐湿熱信頼性に劣シ、
回路加工時に断線が生じ易い。
, O has poor closeness with the conductive layer thin film, and has poor moisture and heat resistance reliability.
Disconnection easily occurs during circuit processing.

等である。etc.

これら欠点を除去するため本願発明者らは種々の高分子
フィルム類を検討し、耐熱性を有し非旋光性フィルムで
め9且つ透明性の良好な押出し法で得られるポリエーテ
ルスルホン、およびポリスルホンフィルムが優れている
ことを見いだし選択した。しかしながらポリエーテルス
ルホンおよびポリスルホンフィルム上に単純に導電性薄
膜を形成した場合該薄膜とフィルムの密着性が着しるし
く劣ることに起因して導電性の耐湿劣化が大きく使用に
耐えない、耐摩耗性が悪く断線が生じ易い、折り曲げ性
が悪く回路加工時、素子組立時に断線不良が生じ易いと
いった欠点が生じた。
In order to eliminate these drawbacks, the inventors of the present invention investigated various polymer films, and developed polyether sulfone, which is a heat-resistant, non-optically active film, and which can be obtained by extrusion and has good transparency. I chose this film because I found it to be excellent. However, when a conductive thin film is simply formed on a polyethersulfone or polysulfone film, the adhesion between the thin film and the film is significantly poor, and the moisture resistance of the conductivity deteriorates significantly, making it unusable and abrasion resistant. There were disadvantages such as poor bendability and easy disconnection during circuit processing and element assembly.

本発明者らは密着性に起因するこれら欠点を解消する方
法として常法によりビニルシラン、アクリルシラン処理
を試みた。この結果スパッター法で形成せしめる導電膜
との密着性は著しるしく向上することを見い出した。し
かしながらこれら化合物は単官能モノマーである為加熱
等の処理によって重合固定せしめようとした場合直鎖構
造の謂ゆる熱可塑性樹脂しか得られないために処理皮膜
は低融点の皮膜にならざるを得す、スパッタ一時、ラビ
ング剤の加熱処理等の熱工程時に不安定であp変形をき
たし導電膜層に微細なシワを生ずると微細なりランクが
生じるといった現象を見い出した。本願発明者らは本現
象、欠点を克服すべく鋭意検討を行ない本願発明に到達
した。即ち塗膜自体を3次元架橋せしめ変形し難い安定
な塗膜を形成せしめるという方法を見い出したものであ
る。
The present inventors attempted vinyl silane and acrylic silane treatment using conventional methods as a method to eliminate these defects caused by adhesion. As a result, it has been found that the adhesion to the conductive film formed by sputtering is significantly improved. However, since these compounds are monofunctional monomers, when attempting to polymerize and fix them through treatments such as heating, only a so-called thermoplastic resin with a linear structure can be obtained, and the treated film must be a film with a low melting point. We have discovered a phenomenon in which fine wrinkles are generated in the conductive film layer due to instability during thermal processes such as sputtering and heat treatment of rubbing agent, resulting in p-deformation and fine wrinkles in the conductive film layer. The inventors of the present application have conducted intensive studies to overcome this phenomenon and its drawbacks, and have arrived at the present invention. That is, a method has been discovered in which the coating film itself is three-dimensionally crosslinked to form a stable coating film that is difficult to deform.

以下に本発明の詳細につき述べる。The details of the present invention will be described below.

本発明に用いられるフィルムは溶融押出し法で得られた
ポリエーテルスルホン(以下PESフィルムと称する)
またはポリスルホン(以下PSフィルムと称する)フィ
ルムで有り、該フィルムは耐熱性、透明性に優れており
更に旋光性の無い透明電極用フィルムとしては非蕗に優
れたフィルムでらる。次にPES フィルムまたit、
PSフィルム上に塗布する塗液を調整する。まずカップ
リング剤としてはビニルシランおよび/またはアクリル
7ラン等の分子内に反応性炭素−炭素2重結合を有する
謂ゆるビニル系7ランカツプリング剤はすべて使用可能
であり、これらカップリング剤の溶液も適宜使用可能で
ある。
The film used in the present invention is polyether sulfone (hereinafter referred to as PES film) obtained by melt extrusion method.
Alternatively, it is a polysulfone (hereinafter referred to as PS film) film, which has excellent heat resistance and transparency, and is also an excellent film for transparent electrodes without optical rotation. Next, PES film and it,
Adjust the coating liquid to be applied on the PS film. First, as coupling agents, all so-called vinyl-based 7-ran coupling agents having reactive carbon-carbon double bonds in the molecule, such as vinyl silane and/or acrylic 7-ran, can be used, and solutions of these coupling agents can be used. can also be used as appropriate.

次いで該カップリング剤に2ヶ以上の反応性2東結合を
有する多官能ビニル化合物を配合するこれら化合物とし
てはエポキシジアクリレート、ウレタンジアクリレート
、ポリエステルジアクリレート、トリメチロールプロパ
ントリアクリレート、 ゛ポリエチレングリコールジア
クリレート等の多官能アクリレート類、ブチレングリコ
ールジメタクリレート、ネオペンチルグリコールジメタ
クリレート、ヘキサンジオールジメタクリレート、トリ
メチロールプロパントリアクリレート等の多官能メタク
リレート類、ジアリルフタレート、トリアリールイソシ
アヌレート、トリアリールトリメリテート等の多官能ア
リール化合物、等が適宜用いられる。
Next, a polyfunctional vinyl compound having two or more reactive 2-east bonds is added to the coupling agent. Examples of these compounds include epoxy diacrylate, urethane diacrylate, polyester diacrylate, trimethylolpropane triacrylate, and polyethylene glycol diacrylate. Polyfunctional acrylates such as acrylate, polyfunctional methacrylates such as butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, diallyl phthalate, triaryl isocyanurate, triaryl trimellitate, etc. Polyfunctional aryl compounds, etc. are used as appropriate.

またビニル系7ランカツプリング剤に対する多官能ビニ
ル化合物の配合割合が嵐要であり、ビニル系シランカッ
プリング剤100&m部に対して後者は10〜100重
fi部の範囲で配合される。
The ratio of the polyfunctional vinyl compound to the vinyl silane coupling agent is critical, and the latter is blended in an amount of 10 to 100 parts by weight per 100 parts of the vinyl silane coupling agent.

10f[蓋部以下の場合塗層は熱的に軟弱とな9改良効
果が発現せず100重量部以上の場合導電膜に対する密
着性が低下してしまいカップリング剤の効果が半減して
しまう。次いで光増感剤が配合されるが増感剤としては
ベンゾフェノン、ベンゾインメチルエーテル、ベンゾイ
ンエテルエーテル轡一般的光増感剤が単独もしくは併用
使用される。
If the amount is less than 10 parts by weight, the coating layer will be thermally weak and the improvement effect will not be achieved, and if it is more than 100 parts by weight, the adhesion to the conductive film will decrease and the effect of the coupling agent will be halved. Next, a photosensitizer is added, and common photosensitizers such as benzophenone, benzoin methyl ether, and benzoin ether ether are used alone or in combination.

次いでかくして得られた配合物を溶剤を用いて希釈する
がこの場合配合物に対して良溶媒でおり且つPESフィ
ルムおよびpSフィルムに対しては貧溶媒で且つ親和性
を有する溶媒を選定することが肝要であり、この様な溶
媒としてセロンルプ類、カービトール類に属する溶剤が
好んで用いられる。
The mixture thus obtained is then diluted with a solvent, in which case a solvent that is a good solvent for the formulation, a poor solvent for PES films and pS films, and has an affinity for the mixture should be selected. This is important, and as such solvents, solvents belonging to the Selonerupes and Carbitols are preferably used.

またpgsフィルムに対しても良溶媒である溶剤を若干
添加することも均一塗布達成のための有効な手段である
。また希釈率については塗布厚み、塗布作業性の観点か
ら適宜決定される。また着色防止剤、レベリング剤、消
泡剤、ブルーイング剤、濡れ改良剤等の添加も本発明達
成のため有効な手段でおる。
Furthermore, adding a small amount of a good solvent to the PGS film is also an effective means for achieving uniform coating. Further, the dilution rate is appropriately determined from the viewpoints of coating thickness and coating workability. Further, addition of coloring inhibitors, leveling agents, antifoaming agents, bluing agents, wetting improvers, etc. is also an effective means for achieving the present invention.

かくして得られた塗布液をPESフィルムの少くとも片
面にディップ法、パーコーター法、ロールコータ−法、
スプレー法、スピンコード法等の単性により塗布する。
The coating solution thus obtained is applied to at least one side of the PES film by a dipping method, percoater method, roll coater method,
Apply by a single method such as spray method or spin code method.

塗布厚みは均一塗布を前提として可及的に薄膜であるこ
とが望ましいが1〜5μm程度が本目的のために一般的
である。次いで乾燥によシ溶剤を除去し塗膜を形成した
後塗膜面に紫外線を照射し架橋硬化塗膜とする。得られ
たフィルムの塗膜上に次いで透明導電層を形成する。
The coating thickness is preferably as thin as possible on the premise of uniform coating, but is generally about 1 to 5 μm for this purpose. After drying to remove the solvent and form a coating film, the coating surface is irradiated with ultraviolet rays to form a crosslinked cured coating film. A transparent conductive layer is then formed on the coating of the obtained film.

この場合酸化イ゛ンジウム、酸化錫、酸化カドミウム等
の酸化物を単独もしくは併用使用しスパッタリング法や
イオンブレティング法で形成される。
In this case, oxides such as indium oxide, tin oxide, cadmium oxide, etc. are used alone or in combination and are formed by a sputtering method or an ion bulleting method.

かくして得られた透明導電性フィルムは導電層が支持体
層と強固に一体化しているため耐摩耗性、回路加工性、
耐湿性、耐溶剤性に優れカップリング剤の単独使用の場
合と異なり強固な3次元架橋塗膜が形成されるため耐熱
性に優れた工業的意義の大きい透明導電フィルムであっ
た。以下に実施例を示す。
The thus obtained transparent conductive film has a conductive layer firmly integrated with the support layer, so it has excellent wear resistance, circuit processability,
This transparent conductive film has excellent moisture resistance and solvent resistance, and unlike the case where a coupling agent is used alone, a strong three-dimensionally crosslinked coating film is formed, so it has excellent heat resistance and is of great industrial significance. Examples are shown below.

実施例 r−メタクリロキシグロビルトリメトキシシランioo
m童部トリメチロールプロパントリアクリレート 30
重量部ネオペンチルグリコールジアクリレート 20重
量部ベンゾインイソブチルエーテル 5m!Ei部ブチ
ルセロソルブ 500重量部 上記組成物を室温にて混合して均一な溶液を得た。10
0μm厚のPE8フイルムの片面上に前記溶液をロール
コータ−法により均一に塗布し、80℃にて加熱して溶
剤を除去した後80 W/cTnの高圧水銀灯1灯にて
照射距離15ので10秒間照射した。得られた硬化塗膜
の厚みは5μmであった。この塗膜上にスパッター法に
より酸化インジウム、酸化錫の透明導電層を厚み300
スにて形成させた。得られた透明導電性フィルムの諸物
件を第1表に記す。
Example r-methacryloxyglobil trimethoxysilane ioo
m Dobe Trimethylolpropane Triacrylate 30
Parts by weight Neopentyl glycol diacrylate 20 parts by weight Benzoin isobutyl ether 5m! Ei part Butyl cellosolve 500 parts by weight The above composition was mixed at room temperature to obtain a homogeneous solution. 10
The above solution was uniformly applied onto one side of a PE8 film with a thickness of 0 μm using a roll coater method, and the solvent was removed by heating at 80°C. Irradiated for seconds. The thickness of the obtained cured coating film was 5 μm. On this coating film, a transparent conductive layer of indium oxide and tin oxide is applied to a thickness of 300 mm by sputtering.
It was formed in Properties of the obtained transparent conductive film are listed in Table 1.

比較例1 r−メタクリロキシプロピルトリメトキシシラン 10
0重量部ペンゾインインフ゛チルエーテル 3m[置部
上記組成物を室温にて均一に混合した後、該組成物を1
00μm厚のPESフィルムの片面上にロールコータ−
法により均一に塗布して3μm厚のコーティング層を設
けた。
Comparative example 1 r-methacryloxypropyltrimethoxysilane 10
0 parts by weight Penzoin phytyl ether 3 m [1 part] After uniformly mixing the above composition at room temperature,
Roll coater on one side of 00 μm thick PES film
A coating layer with a thickness of 3 μm was provided by uniformly applying the coating layer using a method.

実施例と同様な条件にて紫外線照射によるコーティング
層の硬化及び該コーティング層上にスパッター法による
透明導電層の形成をした。得られ 。
The coating layer was cured by ultraviolet irradiation under the same conditions as in the examples, and a transparent conductive layer was formed on the coating layer by sputtering. Obtained.

7’C透明導電性フイルムの諸物件を第1表に記す。Various properties of the 7'C transparent conductive film are listed in Table 1.

比較例2 r−メタクリロキシプロピルトリメトキシシラン 10
重量部メチルメタクリレ−) 301i[置部2−ヒド
ロキシエチルメタクリレート 20重量部トリメテロー
ルグロバントリアクリレート 30重量部ネオペンチル
グリコールジアクリレート1.01m童部ベンゾインイ
ソブチルエーテル 3重量部プチルセロンルプ 350
 &を部 上記組成物を室温にて混合して均一な溶液を得た。該組
成物を100μ厚のPESフィルムの片面上にロールコ
ータ−法により均一に塗布した仮、80℃にて加熱して
溶剤を除去したところ4μm厚のコーティング層が得ら
れた。
Comparative example 2 r-methacryloxypropyltrimethoxysilane 10
Parts by weight Methyl methacrylate) 301i [Oki part 2-Hydroxyethyl methacrylate 20 parts by weight Trimeterolgloban triacrylate 30 parts by weight Neopentyl glycol diacrylate 1.01 m Dobe Benzoin isobutyl ether 3 parts by weight Butylceronelupe 350
The above composition was mixed at room temperature to obtain a homogeneous solution. The composition was uniformly applied onto one side of a 100 .mu.m thick PES film by a roll coater method, and when the solvent was removed by heating at 80.degree. C., a 4 .mu.m thick coating layer was obtained.

実施例と同様な条件にて紫外巌照射によるコーティング
層の硬化及び該コーティング層上にスパッター法による
透明導電層の形成を行なった。得られた透明導電性フィ
ルムの緒特性を第1表に記す。
The coating layer was cured by ultraviolet irradiation and a transparent conductive layer was formed on the coating layer by sputtering under the same conditions as in the examples. The properties of the obtained transparent conductive film are shown in Table 1.

以上のように、比較例1にて得られた透明導電性フィル
ムはコーティング層と導電層との密着性は良好でおるに
もかかわらず、耐熱性、耐溶剤性に著しく劣り、一方、
比較例2にて得られfc透明導電性フィルムは耐熱性1
耐溶剤性は良好であるにもかかわらず、コーティング層
と導電層との密° 滑性が劣るため、耐湿性、耐摩耗性
が著しく低下した。これに反し、本発明の実施例によっ
て得られた透明導電性フィルムは上記欠点を全て解消し
た優れた特性を有するものであった。
As described above, although the transparent conductive film obtained in Comparative Example 1 had good adhesion between the coating layer and the conductive layer, it was significantly inferior in heat resistance and solvent resistance.
The fc transparent conductive film obtained in Comparative Example 2 had a heat resistance of 1.
Although the solvent resistance was good, the moisture resistance and abrasion resistance were significantly lowered due to poor adhesion between the coating layer and the conductive layer. On the contrary, the transparent conductive films obtained in the Examples of the present invention had excellent properties that eliminated all of the above-mentioned drawbacks.

Claims (1)

【特許請求の範囲】[Claims] 溶融押出法により得られたポリエーテルスルホンまたは
ポリスルホンの非旋光性フィルムの少なくとも片面に、
分子内に反応性2友結合を有するシラン化合物、該カッ
プリング剤100重量部に対して10〜100重量部の
2個以上の反応性性2東結合を有する多官能ビニル化合
物、光増感剤、およびこれらを溶解する溶剤を主成分と
する塗布液を塗布し、乾燥後10μm以下の塗膜を形成
し100℃以下の温度で乾燥後紫外光を照射し硬化せし
め、該塗膜上に蒸着法またはスパッター法により酸化イ
ンジウムを主取分とする導電薄膜を形成することを特徴
とする透明導電性フィルムの製造方法。
On at least one side of a non-optically active polyether sulfone or polysulfone film obtained by melt extrusion,
A silane compound having a reactive divalent bond in the molecule, a polyfunctional vinyl compound having two or more reactive divalent bonds in an amount of 10 to 100 parts by weight per 100 parts by weight of the coupling agent, and a photosensitizer. , and a coating solution whose main components are a solvent that dissolves these is applied, and after drying, a coating film of 10 μm or less is formed, and after drying at a temperature of 100 ° C. or less, it is cured by irradiation with ultraviolet light, and vapor deposited on the coating film. 1. A method for producing a transparent conductive film, which comprises forming a conductive thin film containing indium oxide as a main component by a method or a sputtering method.
JP5950984A 1984-03-29 1984-03-29 Manufacture of transparent conductive film Granted JPS60203434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5950984A JPS60203434A (en) 1984-03-29 1984-03-29 Manufacture of transparent conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5950984A JPS60203434A (en) 1984-03-29 1984-03-29 Manufacture of transparent conductive film

Publications (2)

Publication Number Publication Date
JPS60203434A true JPS60203434A (en) 1985-10-15
JPH0112664B2 JPH0112664B2 (en) 1989-03-01

Family

ID=13115294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5950984A Granted JPS60203434A (en) 1984-03-29 1984-03-29 Manufacture of transparent conductive film

Country Status (1)

Country Link
JP (1) JPS60203434A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63906A (en) * 1986-06-18 1988-01-05 住友ベークライト株式会社 Transparent conducting film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63906A (en) * 1986-06-18 1988-01-05 住友ベークライト株式会社 Transparent conducting film

Also Published As

Publication number Publication date
JPH0112664B2 (en) 1989-03-01

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