JPS60202935A - X-ray exposure device - Google Patents
X-ray exposure deviceInfo
- Publication number
- JPS60202935A JPS60202935A JP59058357A JP5835784A JPS60202935A JP S60202935 A JPS60202935 A JP S60202935A JP 59058357 A JP59058357 A JP 59058357A JP 5835784 A JP5835784 A JP 5835784A JP S60202935 A JPS60202935 A JP S60202935A
- Authority
- JP
- Japan
- Prior art keywords
- deflection electrode
- target
- rays
- heat shielding
- heat shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】 を内蔵するX線管球を使用するX線露光装置に関する。[Detailed description of the invention] The present invention relates to an X-ray exposure apparatus that uses an X-ray tube with a built-in X-ray tube.
従来、半導体デバイスの製造工程において、微細回路パ
ターン転写技術の1つにX線露光装置が開発され、活用
されている。この種の装置に使用されているX線管球は
、一般に、第1図のX線管球の電気系略図に示すように
、ウエネルトl,フィラメント2及び偏向電極4に高圧
電源5から負の高電圧をかけ、かつターゲット3をアー
ス電位にするように構成されていた。偏向電極4は、タ
ーゲット3からのイオンボンバードメントによるフィラ
メント2の損傷を防止するために、電子線7の軌道を曲
げてターゲット8の所望位置に照射させ、X線を発生せ
しめている。微細回路パターンを転写する技術に属する
X線露光装置は、サブミクロンの転写を目的とする技術
であるので熱変動には極めて敏感である。しかし上述の
ように、偏向電極には負の高電圧が印加されているので
、該電極部は耐高電圧用絶縁物、例えばセラミックスな
どを用いて絶縁されなければならず、また接部の冷却に
際しては、使用する冷媒に過電流が流れないように、抵
抗値の高い純水の使用に限定されるなど、X線露光装置
用のX線管球として種々の問題点を含んでいる。2. Description of the Related Art Conventionally, in the manufacturing process of semiconductor devices, an X-ray exposure apparatus has been developed and utilized as one of fine circuit pattern transfer techniques. The X-ray tube used in this type of device generally has a high-voltage power supply 5 connected to the Wehnelt l, filament 2, and deflection electrode 4, as shown in the electrical system diagram of the X-ray tube in Figure 1. It was configured to apply a high voltage and bring the target 3 to ground potential. In order to prevent damage to the filament 2 due to ion bombardment from the target 3, the deflection electrode 4 bends the trajectory of the electron beam 7 to irradiate a desired position on the target 8, thereby generating X-rays. X-ray exposure equipment, which belongs to the technology of transferring fine circuit patterns, is a technology aimed at submicron transfer, and is therefore extremely sensitive to thermal fluctuations. However, as mentioned above, since a negative high voltage is applied to the deflection electrode, the electrode part must be insulated using a high voltage resistant insulator, such as ceramics, and the contact part must be cooled. In this case, there are various problems as an X-ray tube for an X-ray exposure apparatus, such as being limited to the use of pure water with a high resistance value in order to prevent excessive current from flowing into the refrigerant used.
一方、工業用分析(螢光分析)X線管球として、第2図
の電気系路を有するX線管球が提案されてイル。このX
線管球においては、ターゲット3に正の高電圧を印加し
、ウェネルト1と偏向電極4を接地電位にするように構
成されている。X線の発生プロセスは第1図と同じであ
るが、ターゲット8からの反跳電子による熱の発生を軽
減でき、偏向電極に対する冷却手段が第1図のX線管球
に比べて容易に実施できる。On the other hand, as an X-ray tube for industrial analysis (fluorescence analysis), an X-ray tube having the electrical circuit shown in Figure 2 has been proposed. This X
The radiation tube is configured to apply a high positive voltage to the target 3 and bring the Wehnelt 1 and deflection electrode 4 to ground potential. The X-ray generation process is the same as in Figure 1, but the generation of heat due to recoil electrons from the target 8 can be reduced, and cooling means for the deflection electrode can be implemented more easily than in the X-ray tube in Figure 1. can.
しかし、第2図のX線管球においても、X線露光装置用
のX線管球としては、熱遮蔽の点ではなお問題を残して
いる。However, even in the X-ray tube shown in FIG. 2, there still remains a problem in heat shielding as an X-ray tube for an X-ray exposure apparatus.
本発明は、上述従来例の欠点を除去することを目的とし
、熱遮蔽効率が高く、シかも簡易な構造のX線露光装置
用のX線管球を提供する。SUMMARY OF THE INVENTION The present invention aims to eliminate the drawbacks of the above-mentioned conventional examples, and provides an X-ray tube for an X-ray exposure apparatus that has high heat shielding efficiency and a simple structure.
本発明の実施例を示す第8図〜第5図を参照しつつ、以
下に本発明を説明する。The present invention will be described below with reference to FIGS. 8 to 5 showing embodiments of the present invention.
第3図において、ウェネルト1.フィラメント2、ター
ゲット3偏向電極4′などの配置は、第1図及び第2図
に示す従来例と類似しているが、本実施例における偏向
電極板4′は、偏向電極を兼ねた熱シールド板である。In FIG. 3, Wehnelt 1. The arrangement of the filament 2, target 3, deflection electrode 4', etc. is similar to the conventional example shown in FIGS. 1 and 2, but the deflection electrode plate 4' in this embodiment is a heat shield that also serves as a deflection electrode. It is a board.
7は電子線、8はX線を示し、9は本発明に係る熱シー
ルド板に配設された冷却パイプ、lOはX線を取り出す
開口部である。7 is an electron beam, 8 is an X-ray, 9 is a cooling pipe disposed on the heat shield plate according to the present invention, and IO is an opening for taking out the X-ray.
上記構成において、ウェネルト1と偏向電極を兼ねた熱
シールド板4′を接地電位にし、ターゲット8に正の高
電圧を印加する。この状態でフィラメント電源6により
フィラメント2を加熱すると\電子線7が発生し、ウェ
ネルト1の作用で集束されつつターゲット3に向って加
速される。この電子線7の軌道を、接地電位の熱シール
ド板を兼ねた偏向電極4′の幾何学形状やその配設位置
を適切に設計、配列して電子線7の軌道を曲げ、ターゲ
ット3の所望位置に電子線7を照射し、X線8を発生さ
せる。X線8が発生すると同時に、大量の熱も発生する
。この発生熱を、偏向電極を兼ねた熱シールド板4′の
適切な位置に配設された1つ以上の冷却パイプ9に冷却
媒体を流通させ、図示しない冷却装置により、X線装置
外に熱を搬出、冷却、再循環させて冷却作用を継続する
。熱シールド板41の形状はその基本機能である偏向作
用を確保した上で、熱遮蔽効果が得られれば、必ずしも
板状に限定されず、任意形態のものを用いることができ
る。発生されたX線は、開口部10を通シ露光室のマス
ク11に達しウェハ12を露光する。In the above configuration, the Wehnelt 1 and the heat shield plate 4', which also serves as a deflection electrode, are set to ground potential, and a positive high voltage is applied to the target 8. In this state, when the filament 2 is heated by the filament power source 6, an electron beam 7 is generated, which is accelerated toward the target 3 while being focused by the action of the Wehnelt 1. The trajectory of the electron beam 7 is bent by appropriately designing and arranging the geometrical shape and placement position of the deflection electrode 4', which also serves as a heat shield plate at ground potential. The position is irradiated with an electron beam 7 to generate X-rays 8. At the same time as the X-rays 8 are generated, a large amount of heat is also generated. A cooling medium is passed through one or more cooling pipes 9 disposed at appropriate positions on the heat shield plate 4' which also serves as a deflection electrode, and a cooling device (not shown) transfers the generated heat to the outside of the X-ray apparatus. is removed, cooled, and recirculated to continue the cooling action. The shape of the heat shield plate 41 is not necessarily limited to a plate shape, and any arbitrary shape can be used as long as the heat shielding effect can be obtained while ensuring its basic function of deflection. The generated X-rays pass through the opening 10 and reach the mask 11 in the exposure chamber to expose the wafer 12.
偏向電極を兼ねた熱シールド板4′は、既述のように接
地電位にされているから、それに冷却手段を付設するに
際し、該偏向電極に高電位が印加された場合のように冷
媒に過電流が流れるのを防止するだめの使用冷媒の限定
を要せずに、流体であれば、水、油、空気などいずれを
用いてもよく、また冷却パイプ9の材質も、銅、アルミ
ニウム、ステンレス鋼などを、安全性、雰囲気、冷却効
率などを考慮し、用途に応じて選択使用する。Since the heat shield plate 4', which also serves as a deflection electrode, is set to the ground potential as described above, when attaching a cooling means to it, the heat shield plate 4', which also serves as a deflection electrode, is placed at a ground potential. There is no need to limit the refrigerant used to prevent current flow; any fluid such as water, oil, or air may be used, and the material of the cooling pipe 9 may be copper, aluminum, or stainless steel. Materials such as steel are selected and used depending on the purpose, taking safety, atmosphere, cooling efficiency, etc. into consideration.
偏向電極を兼ねた熱シールド板4′の冷却は、第3図の
実施例ではパイプ9を使用しているが、冷却効果が得ら
れればどのような形状及び構造も用いることができ、例
えば、第4図に示すように、冷却路9′を偏向電極を兼
ねた熱シールド板4′と一体構造にすることもできる。In the embodiment shown in FIG. 3, a pipe 9 is used to cool the heat shield plate 4' which also serves as a deflection electrode, but any shape and structure can be used as long as a cooling effect can be obtained. For example, As shown in FIG. 4, the cooling path 9' can be integrated with a heat shield plate 4' which also serves as a deflection electrode.
X線を取り出すだめの偏向電極を兼ねた熱シールド板4
′に形成される開口部10は、第5図に示すように、必
要に応じて目的に適合した位置を選び複数箇所に設ける
ことができる。Heat shield plate 4 that also serves as a deflection electrode for extracting X-rays
As shown in FIG. 5, the openings 10 formed in ' can be provided at a plurality of locations, selecting positions suitable for the purpose as required.
以上述べたように、本発明に係る偏向電極を兼ねた熱シ
ールド板は、接地電位にされるならば、耐高電圧用の絶
縁対策を要せず、冷却媒体も純水に限ることがなく、さ
らに熱シールド板は出射電子線の軌道を自由に偏向させ
うる偏向電極を兼ねるので、構造簡単、低価格のコンパ
クトな効率の高いX線管球の使用により、X線露光装置
の性能向上に顕著な効果を奏する。As described above, the heat shield plate that also serves as a deflection electrode according to the present invention does not require insulation measures for high voltage resistance, and the cooling medium is not limited to pure water, if it is set to the ground potential. Furthermore, since the heat shield plate also serves as a deflection electrode that can freely deflect the trajectory of the emitted electron beam, the performance of X-ray exposure equipment can be improved by using a compact, highly efficient X-ray tube with a simple structure and low cost. It has a remarkable effect.
第1図は、X線露光装置に用いられる従来型X線管球の
電気系路図、第2図は、工業用分析(螢光分析)用X線
管球の電気系路図、第8図は本発明に係る偏向電極を兼
ねた熱シールド板の実施例の原理図、第4図は偏向電極
を兼ねた熱シールド板の冷却路の他の実施例の断面図、
第5図は偏向電極を兼ねだ熱シールド板の開口部の実施
例を示す断面図である。
1・・・ウェネルト
2・・・フィラメント
8・・・ターゲット
4・・・偏向電極
4′・・・偏向電極を兼ねた熱シールド板5・・・高圧
電源
6・・・フィラメント電源
7・・・電子線
8・・・X線
9・・・冷却パイプ
9′・・・冷却路
10・・・X線取シ出し用開口部
11・・・マスク 12・・・ウエノ1特許出願人 キ
ャノン株式会社
第1図
第2図Fig. 1 is an electrical system diagram of a conventional X-ray tube used in an X-ray exposure device, Fig. 2 is an electrical system diagram of an X-ray tube for industrial analysis (fluorescence analysis), and Fig. 8 The figure is a principle diagram of an embodiment of a heat shield plate that also serves as a deflection electrode according to the present invention, and FIG. 4 is a sectional view of another embodiment of a cooling path of a heat shield plate that also serves as a deflection electrode.
FIG. 5 is a sectional view showing an embodiment of an opening in a heat shield plate that also serves as a deflection electrode. 1... Wehnelt 2... Filament 8... Target 4... Deflection electrode 4'... Heat shield plate that also serves as a deflection electrode 5... High voltage power source 6... Filament power source 7... Electron beam 8...X-ray 9...Cooling pipe 9'...Cooling path 10...X-ray extraction opening 11...Mask 12...Ueno 1 patent applicant Canon Corporation Figure 1 Figure 2
Claims (2)
を特徴とするX線露光装置。(1) An X-ray exposure apparatus characterized by comprising an X-ray tube having a heat shield means.
から出射される熱電子の軌道を制御する機能をもつこと
を特徴とする特許請求の範囲第1項記載のX線露光装置
。(2) The X-ray exposure apparatus according to claim 1, wherein the heat shield means of the X-ray tube has a function of controlling the trajectory of thermoelectrons emitted from the filament.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59058357A JPS60202935A (en) | 1984-03-28 | 1984-03-28 | X-ray exposure device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59058357A JPS60202935A (en) | 1984-03-28 | 1984-03-28 | X-ray exposure device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60202935A true JPS60202935A (en) | 1985-10-14 |
Family
ID=13082062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59058357A Pending JPS60202935A (en) | 1984-03-28 | 1984-03-28 | X-ray exposure device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60202935A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1124161A2 (en) * | 2000-02-10 | 2001-08-16 | Asm Lithography B.V. | Lithographic projection apparatus having a temperature controlled heat shield |
-
1984
- 1984-03-28 JP JP59058357A patent/JPS60202935A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1124161A2 (en) * | 2000-02-10 | 2001-08-16 | Asm Lithography B.V. | Lithographic projection apparatus having a temperature controlled heat shield |
EP1124161A3 (en) * | 2000-02-10 | 2004-01-07 | ASML Netherlands B.V. | Lithographic projection apparatus having a temperature controlled heat shield |
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