JPS60196929A - Electronic part and method of producing same - Google Patents
Electronic part and method of producing sameInfo
- Publication number
- JPS60196929A JPS60196929A JP5302484A JP5302484A JPS60196929A JP S60196929 A JPS60196929 A JP S60196929A JP 5302484 A JP5302484 A JP 5302484A JP 5302484 A JP5302484 A JP 5302484A JP S60196929 A JPS60196929 A JP S60196929A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin
- heat
- cap
- resistant elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（技術分野）
本発明は、電子部品およびその製造方法に関し、特に外
装絶縁部の構造および外装方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to an electronic component and a method for manufacturing the same, and more particularly to a structure of an exterior insulation part and an exterior packaging method.
（従来技術）
一般に自立型固体電解コンデンサなどの電子部品素子の
外装絶縁部は、陽極体１から導出した陽極外部リード５
と陽極体１の外側に設けた陰極導ｉ層３から引出した陰
極外部リード６とが平行に突設して形成されたコンデン
サ素子８の外側にエポキシなどの液状又は粉体状の熱硬
化性の樹脂ｌＯを浸漬などの手段で塗布したのち硬化さ
せて形成している。このような従来電子部品ｉ１１．．
次のような欠点を有している。(Prior art) Generally, the exterior insulation part of an electronic component element such as a free-standing solid electrolytic capacitor is an anode external lead 5 led out from an anode body 1.
A liquid or powder thermosetting material such as epoxy is applied to the outside of the capacitor element 8, which is formed by protruding in parallel with the cathode external lead 6 drawn out from the cathode conductive i-layer 3 provided on the outside of the anode body 1. The resin IO is applied by dipping or other means and then cured. Such conventional electronic components i11. ．．
It has the following drawbacks.
（イ） 外装の絶縁層の厚さが不均一で製品寸法のばら
つきが大きい。(b) The thickness of the insulation layer on the exterior is uneven and the product dimensions vary widely.
（ロ）液状の樹脂は、ポットライフが短いため樹脂の無
駄が多い。(b) Liquid resin has a short pot life, so there is a lot of resin waste.
ｅ９ また粉体状の樹脂では、１回の浸漬で被着する樹
脂量が少ないため樹脂厚を得るために数回の浸漬を必要
とする・
（発明の目的）
不発明の目的は、このような従来欠点を解消・した電子
部品およびその製造方法全提供することにある。e9 In addition, with powdered resin, the amount of resin that can be deposited in one immersion is small, so several immersions are required to obtain the resin thickness. (Objective of the invention) The purpose of the invention is to The object of the present invention is to provide an electronic component that eliminates the conventional drawbacks and a method for manufacturing the same.
（発明の構成）
不発明によれば犠；子部品素子から同一方間に導出した
複数のリード線を外装の絶縁層から突設した電子部品に
おいて、−上記絶縁層が耐熱性弾性キャップと熱硬化型
樹脂とで形成されたことを特徴とする電子部品が得られ
る。また本発明によれば導出するリード線側會除いた電
子部品素子を耐熱性弾性キャップ内に挿入嵌着させる工
程と、上記素子と耐熱性弾性キャップを加熱させた後、
粉体状の樹脂内に浸漬した後、上記粉体状の樹脂全硬化
させる工程とを含むことを特徴とする電子部品の製造方
法をも得られる。(Structure of the Invention) According to the invention, there is an electronic component in which a plurality of lead wires led out from the same side from a child component element are protruded from an insulating layer of the exterior, - the insulating layer is connected to a heat-resistant elastic cap and a heat-resistant elastic cap; An electronic component characterized in that it is formed of a curable resin is obtained. Further, according to the present invention, the step of inserting and fitting the electronic component element from which the lead wire side is removed into the heat-resistant elastic cap, and after heating the element and the heat-resistant elastic cap,
There is also obtained a method for manufacturing an electronic component, which comprises the steps of immersing the electronic component in a powdered resin and then completely curing the powdered resin.
（実施例）
以下、不発明の一実施例を自立型固体電解コンデンサに
より第１図と第３図〜第６図で説明する。陽極体１０表
面に図示省略した誘電体層の陽極酸化皮膜を介して形成
した二酸化マンガン層およびカーボン層の半導体陰極層
２上に銀ペーストのような導電性ペーストラ塗布・乾燥
−させた陰極導電層３と陰極外部リード６とを半田層７
で被覆して接続し、陽極リード４に溶接した陽極外部リ
ード５と陰極外部リード６とを同一方向に平行に突設さ
せたコンデンサ素子８を形成する０次に粉体樹脂１０の
硬化温度（８０”０〜２００℃）と同等以上の耐熱性を
有するシリコーンゴムなどの成形材料でコンデンサ素子
８の外径寸法より２〜ｂ
るキャップ９にコンデンサ素子８を挿入する・次に、キ
ャップ９′ｔ−挿入したコンデンサ素子８ｆｔｉｏｏ〜
１８０℃で１０〜６０秒間予備加熱した後、第４図の如
く流動浸漬槽１１内で流動させているエポキシなどの粉
体状の樹脂ｌＯがキャップ９の内部に入るレベルまで浸
漬する。(Example) Hereinafter, an example of the invention will be explained using a self-supporting solid electrolytic capacitor with reference to FIG. 1 and FIGS. 3 to 6. A cathode conductive layer is formed by coating and drying a conductive paste such as silver paste on the semiconductor cathode layer 2, which is a manganese dioxide layer and a carbon layer formed on the surface of the anode body 10 through an anodic oxide film of a dielectric layer (not shown). 3 and the cathode external lead 6 with a solder layer 7.
The curing temperature of the zero-order powder resin 10 ( Insert the capacitor element 8 into a cap 9 made of a molding material such as silicone rubber that has a heat resistance equivalent to or higher than 80" (0 to 200 degrees Celsius), and which is 2 to 2 b larger than the outer diameter of the capacitor element 8. Next, the cap 9' T-inserted capacitor element 8ftio~
After preheating at 180 DEG C. for 10 to 60 seconds, the cap 9 is immersed to a level where the powdered resin lO such as epoxy fluidized in the fluidized immersion tank 11 enters the inside of the cap 9, as shown in FIG.
次に、この樹脂１０の硬化温度（８０〜２００℃入例え
ば１５０’Ｏに保持した恒温乾燥炉（図示省略）Ｐ３で
硬化時間（３０分〜３時間）−例えば１時間放置して硬
化させて、ｉ！！５図で示すような自立型の固体電解コ
ンデンサを形成する・ ・なお、立方体状の陽極体から
なるコンデンサ素子と断面形状が四角形のキャップとを
組合わせて用いることにより第６図のような立方体状の
固体電解コンデンサを形成することもできる。Next, the resin 10 is cured at a curing temperature (80 to 200° C., for example, in a constant temperature drying oven (not shown) P3 maintained at 150° C.) for a curing time (30 minutes to 3 hours), for example, 1 hour. , i!!A self-supporting solid electrolytic capacitor as shown in Fig. 5 is formed. ・In addition, by using a capacitor element consisting of a cubic anode body in combination with a cap having a square cross-sectional shape, Fig. 6 is formed. It is also possible to form a cubic solid electrolytic capacitor like this.
（発明の効果） 以上、不発明によ９次の効果が得られる。(Effect of the invention) As described above, the ninth effect can be obtained by non-invention.
（１）外装された製品の外形寸法はキャップの大きさで
ほば決るので均一にできる。(1) The external dimensions of the packaged product are largely determined by the size of the cap, so they can be made uniform.
（１：）キャップの厚さによる絶縁層が内在するので少
ない浸漬回数で樹脂厚が得られる・（１１０キャップが
素子に密着している部分では。(1:) Since there is an insulating layer depending on the thickness of the cap, the resin thickness can be obtained with a small number of immersions (110 In the part where the cap is in close contact with the element).
樹脂硬化時に発生する機械的ストレスを緩和することが
できるなどの利点を有する。It has the advantage of being able to alleviate mechanical stress generated during resin curing.
第１図は固体電解コンデンサ素子の側断面図。
第２図は従来例の固体電解コンデンサの側断面図。
第３図〜第４図は不発明による固体電解コンデンサの製
造工程の側断面図、第５図は不発明笑施例による同体電
解コンデンサの断面図、Ｎ６図は不発明の他の実施例に
よる固体電解コンデンサの斜視図。
、１・・・・・・陽極体、２・・・・・・半導体陰極層
、３・・・・・・陰極導電層、４・・・・・・陽極リー
ド、５・・・・・・陽極外部リード、６・・・・・・陰
極外部リード、７・・・・・・半田層％８・・・・・・
コンデンサ素子、９・山・・キャップ、１０・・印・樹
脂、１１・・・・・・流動浸漬槽。FIG. 1 is a side sectional view of a solid electrolytic capacitor element. FIG. 2 is a side sectional view of a conventional solid electrolytic capacitor. Figures 3 to 4 are side sectional views of the manufacturing process of a solid electrolytic capacitor according to the invention, Figure 5 is a sectional view of a monolithic electrolytic capacitor according to an embodiment of the invention, and Figure N6 is another embodiment of the invention. A perspective view of a solid electrolytic capacitor. , 1... Anode body, 2... Semiconductor cathode layer, 3... Cathode conductive layer, 4... Anode lead, 5... Anode external lead, 6...Cathode external lead, 7...Solder layer%8...
Capacitor element, 9. Cap, 10. Mark, resin, 11. Fluid immersion tank.
Claims (2)
ド融を外装の絶縁層から突設した電子部品において、前
記絶縁層が耐熱性弾性キャップと熱恢化型樹脂とで形成
されたことを特徴とする電子部品。(1) In an electronic component in which a plurality of lead melts led out at the same time from an electronic component element are provided protruding from an insulating layer on the exterior, the insulating layer is formed of a heat-resistant elastic cap and a heat-curable resin. An electronic component characterized by:
性弾性キャップ内に挿入低層させる工程と、前記素子と
耐熱性弾性キャップを加熱させた後、粉体状の樹脂内に
浸漬した後、前記粉体状の樹脂を硬化させる工程とを含
むこと盆特徴とする電子部品の製造方法。(2) A process of inserting the electronic component element excluding the lead wire side to be led out into a heat-resistant elastic cap, and heating the element and the heat-resistant elastic cap, and then immersing it in powdered resin. and curing the powdered resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5302484A JPS60196929A (en) | 1984-03-19 | 1984-03-19 | Electronic part and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5302484A JPS60196929A (en) | 1984-03-19 | 1984-03-19 | Electronic part and method of producing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60196929A true JPS60196929A (en) | 1985-10-05 |
Family
ID=12931320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5302484A Pending JPS60196929A (en) | 1984-03-19 | 1984-03-19 | Electronic part and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60196929A (en) |
-
1984
- 1984-03-19 JP JP5302484A patent/JPS60196929A/en active Pending
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