JPS60195901A - Dustproof wall for electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a dustproof wall for electronic components used in variable resistors and the like.

Conventional configurations and their problems In recent years, various improvements have been made to dustproof walls to improve the safety and reliability of electronic components.

Hereinafter, the conventional dustproof wall for electronic components as described above will be explained with reference to the drawings.

FIGS. 1 and 2 are cross-sectional views of conventional dust-proof walls for electronic components. In FIGS. 1 and 2, 1 is an electronic component body, and 2 is a shaft portion rotatably attached to the electronic component body 1. In FIG. 1a is a caulking part. 3 is the electronic component body 1
The cover is caulked and joined. 4 is a cover joined to the electronic component main body 1 by adhesive or press fitting. 4 is a space created by joining the covers 3 and 4.

A resistor, a brush (not shown), etc. are provided in this space 4.

However, in the above-mentioned configuration, it is necessary to provide a place for joining by caulking or the like, and there are disadvantages in that it is difficult to provide such a place and parts such as a cover are required.

The present invention aims to provide a dustproof wall for electronic components with a simple structure that does not require any parts.

Structure of the Invention In order to achieve this object, the dust-proof wall for an electronic component of the present invention is constructed by bending an upright wall and forming a space surrounded by the bent upright wall. This allows a simple structure that does not require separate parts such as a cover.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 3 illustrates a dustproof wall for electronic components in the first embodiment. In FIG. 3, A is a perspective view of an electronic component on which an upright wall is formed, and B is a cross-sectional view. Figure 4A
1 is a perspective view of an electronic component in which a dust-proof wall is formed by bending an upright wall, and FIG. 1B is a sectional view. FIG. 6 is a top sectional view of the upright wall of the electronic component in the second embodiment. 6th
The figure is for explaining a dustproof wall for electronic components constructed thereby.

FIG. 7 illustrates a dustproof wall for electronic components in the third embodiment. FIG. 8 is a sectional view of an electronic component in which an upstanding wall is formed in the fourth embodiment. FIG. 9 illustrates a dustproof wall for electronic components constructed thereby. Figures 6 and 7.

In FIG. 9, A is a perspective view of an electronic component in which a dustproof wall is formed by bending an upright wall, and B is a cross-sectional view. In Figures 3 to 9, 6 is the main body of the electronic component;
is a shaft portion rotatably attached to the main body 4. 6a is an arbitrary point on the electronic component. 7 is a space surrounded by a bent upright wall 8a. 8 is an upright wall formed around an arbitrary point 6a of the electronic component. 9 is the tip of the upright wall 6. Reference numeral 8a indicates an upright wall in which the tip portion 9 is bent in a direction toward an arbitrary point 6a of the electronic component. 9a is the tip of the bent upright wall 8a. 11 and 12 are thick portions and thin portions that are alternately formed in the circumferential direction of the standing wall 10, respectively. 11a and 12a are a thick part and a thin part, respectively, of the bent upright wall 10a. Here, in FIG. 6, the thick part 11a is the thin part 12.
A is formed toward the outside of the electronic component, and the opposite is shown in FIG. 14 and 16 are high portions and low portions that are alternately formed in the circumferential direction of the standing wall 130, respectively. 14a, 1
High portions 14 of the upright walls 13a each bent by 5a
This is the location where the lower portion 16 was after being bent.

As described above, according to this embodiment, since the upright wall is bent in the direction in which the tip of the upright wall approaches an arbitrary point on the electronic component, the structure is simple and does not require separate parts such as a cover. It can be used as a dustproof wall for electronic components.

Effects of the Invention As described above, the present invention bends the upright wall formed around an arbitrary point of an electronic component in a direction in which the tip of the upright wall approaches the arbitrary point of the electronic component, and By forming a space surrounded by a processed standing wall, it is possible to create a dustproof wall for electronic components with a simple structure that does not require separate parts such as a cover or a place for joining. The practical effects are significant.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views showing the dust-proof wall of a conventional electronic component, and FIGS. 3A and 3B are perspective views of an electronic component on which an upright wall is formed according to the first embodiment of the present invention. 4A and 4B are a perspective view and a sectional view of an electronic component on which a dust-proof wall is formed in the first embodiment, and FIG. 6 is a top cross-section of an upright wall of an electronic component in the second embodiment. Figures 6A and 6B are a perspective view and a sectional view of an electronic component on which a dustproof wall is formed in this second embodiment, and Figures 7A and B are dustproofing diagrams showing a modification of this second embodiment. A perspective view and a sectional view of an electronic component in which a wall is formed. FIG. 8 is a perspective view and a sectional view of a component in a third embodiment. 6...Electronic component body, 6a...Arbitrary point of electronic component, 7...Space part, 8, 10.13
... Standing wall, 9... Tip of standing wall 8, 8a, 10a, 13a... Bent standing wall (dust-proof wall), 11.12... ...Thick wall part and thin wall part of the standing wall 10, 11a, 12a... Thick wall part and thin wall part of the bent standing wall 10a, 14.15.
...High and low parts of the standing wall 13, 14a, 16a,
...Bending standing wall 13. The parts that were the high and low parts of a. Name of agent Patent attorney Toshi Nakao #1 or 1 name 1 Figure 2 (! 1 1 to 3511 (A) (B) 4th @ (＾) ζβnh 箆 6 Figure (C) (B)

Claims (1)

[Scope of Claims] (1) Bending the standing wall formed around an arbitrary point of the electronic component in a direction in which the tip of the standing wall approaches the arbitrary point of the electronic component, and performing the bending process. A dust-proof wall for electronic components, characterized in that a space is surrounded by a vertical wall. (→ The upright wall is bent so that thick and thin parts are alternately formed in the local direction of the upright wall, and the thick part of the bent upright wall is bent toward the outside of the electronic component from the thin part. A dust-proof wall for an electronic component according to claim (1), which is formed in the following: (3) The upright wall is curved so that thick portions and thin wall portions are alternately formed in the direction of the upright wall. The dustproof wall for an electronic component according to claim (1), wherein the thick wall portion of the bent upstanding wall is formed inward from the thin wall portion of the smear component. (4) A dustproof wall for an electronic component according to claim (1), wherein the upright wall has high parts and low parts alternately formed in one direction of the upright wall.