JPS60190060U - Flexible printed circuit board with moisture-resistant conductor pattern - Google Patents
Flexible printed circuit board with moisture-resistant conductor patternInfo
- Publication number
- JPS60190060U JPS60190060U JP7588884U JP7588884U JPS60190060U JP S60190060 U JPS60190060 U JP S60190060U JP 7588884 U JP7588884 U JP 7588884U JP 7588884 U JP7588884 U JP 7588884U JP S60190060 U JPS60190060 U JP S60190060U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- moisture
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図〜第３図は本考案に係るフレキシブルプリント回
路板の実施例の断面図、第４図は従来のフレキシブルプ
リント回路板の断面図である。
１・・・可撓性フィルム、２・・・電気伝導性に優れた
金属の蒸着薄膜、３・・・クロムあるいはクロムを含有
する耐蝕性金属の蒸着薄膜、４・・・カーボン粉末から
なる塗膜。1 to 3 are cross-sectional views of an embodiment of a flexible printed circuit board according to the present invention, and FIG. 4 is a cross-sectional view of a conventional flexible printed circuit board. 1... Flexible film, 2... Vapor-deposited thin film of metal with excellent electrical conductivity, 3... Vapor-deposited thin film of chromium or corrosion-resistant metal containing chromium, 4... Coating made of carbon powder film.
Claims (1)
キシブルプリント回路板において、該導電体に高導電性
金属と、クロムあるいはクロムを含有する耐蝕性金属の
２層以上の交互多層積層体を使用し、さらにその上にカ
ーボン層を積層したことを特徴とする耐湿性導電体パタ
ーンを有するフレキシブルプリント回路板。In a flexible printed circuit board in which a metal thin film conductor is provided on a flexible film, an alternating multilayer laminate of two or more layers of a highly conductive metal and chromium or a corrosion-resistant metal containing chromium is used for the conductor. A flexible printed circuit board having a moisture-resistant conductor pattern, further comprising a carbon layer laminated thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7588884U JPS60190060U (en) | 1984-05-25 | 1984-05-25 | Flexible printed circuit board with moisture-resistant conductor pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7588884U JPS60190060U (en) | 1984-05-25 | 1984-05-25 | Flexible printed circuit board with moisture-resistant conductor pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60190060U true JPS60190060U (en) | 1985-12-16 |
| JPH0423341Y2 JPH0423341Y2 (en) | 1992-05-29 |
Family
ID=30617524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7588884U Granted JPS60190060U (en) | 1984-05-25 | 1984-05-25 | Flexible printed circuit board with moisture-resistant conductor pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60190060U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50146869A (en) * | 1974-05-15 | 1975-11-25 | ||
| JPS5328295A (en) * | 1976-08-27 | 1978-03-16 | Hitachi Ltd | Constructing nicr-au-sio2 conductor |
| JPS53138060A (en) * | 1977-05-06 | 1978-12-02 | Sharp Kk | Thin film wiring |
| JPS5548469A (en) * | 1978-09-29 | 1980-04-07 | Toshiba Corp | Soldering unit |
-
1984
- 1984-05-25 JP JP7588884U patent/JPS60190060U/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50146869A (en) * | 1974-05-15 | 1975-11-25 | ||
| JPS5328295A (en) * | 1976-08-27 | 1978-03-16 | Hitachi Ltd | Constructing nicr-au-sio2 conductor |
| JPS53138060A (en) * | 1977-05-06 | 1978-12-02 | Sharp Kk | Thin film wiring |
| JPS5548469A (en) * | 1978-09-29 | 1980-04-07 | Toshiba Corp | Soldering unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423341Y2 (en) | 1992-05-29 |
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