JPS60185354U - Parts mounting structure - Google Patents
Parts mounting structureInfo
- Publication number
- JPS60185354U JPS60185354U JP7182784U JP7182784U JPS60185354U JP S60185354 U JPS60185354 U JP S60185354U JP 7182784 U JP7182784 U JP 7182784U JP 7182784 U JP7182784 U JP 7182784U JP S60185354 U JPS60185354 U JP S60185354U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- parts mounting
- circuit board
- printed circuit
- crushed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案部品の取付構造の一実施例を示し、aは
一部切欠正面図、b図はa図のA−A断面図、第2図、
第3図は従来の取付構造を示しa図は一部切欠正面図、
b図はa図のA−A断面図である。
1・・・内部素子、2・・・リード端子、2 ’@11
@樹脂付着のり、−ド端子、3・・・樹脂、4・・・プ
リント基板、5・・・スルーホール、6・・・リード端
子のつぶし部。
b) −第3図 (a)Fig. 1 shows an embodiment of the mounting structure for the parts of the present invention, in which Fig. a is a partially cutaway front view, Fig. b is a sectional view taken along line A-A in Fig. A, and Fig. 2;
Figure 3 shows the conventional mounting structure, and Figure a is a partially cutaway front view.
Figure b is a sectional view taken along line A-A in figure a. 1...Internal element, 2...Lead terminal, 2'@11
@Resin adhesive glue, negative terminal, 3... resin, 4... printed circuit board, 5... through hole, 6... crushed part of lead terminal. b) -Figure 3 (a)
Claims (1)
2本のリード端子は、互いに同一方向に引き出されてお
り、その後、内部素子を保護するために絶縁性の樹脂に
てコーティングが施されるプリント基板搭載用の部品に
おいて、引き出された前記2本のリード端子の一部をプ
レス等によりつぶし加工し、このつぶし部はプリント基
板のスルーホール径より大きくしたことを特徴とする部
品の取付構造。 (a) 第1図 ( 一部 rA[Claims for Utility Model Registration] Two lead terminals that are soldered to the internal elements of a component are connected by welding, etc., and are pulled out in the same direction, and then insulated to protect the internal elements. In a part for mounting on a printed circuit board that is coated with a resin, a part of the two lead terminals pulled out is crushed using a press, etc., and this crushed part is made larger than the diameter of the through hole in the printed circuit board. A parts mounting structure characterized by: (a) Figure 1 (partially rA
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7182784U JPS60185354U (en) | 1984-05-18 | 1984-05-18 | Parts mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7182784U JPS60185354U (en) | 1984-05-18 | 1984-05-18 | Parts mounting structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60185354U true JPS60185354U (en) | 1985-12-09 |
Family
ID=30609666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7182784U Pending JPS60185354U (en) | 1984-05-18 | 1984-05-18 | Parts mounting structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60185354U (en) |
-
1984
- 1984-05-18 JP JP7182784U patent/JPS60185354U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS60185354U (en) | Parts mounting structure | |
JPS5952687U (en) | Mounting structure of electronic components | |
JPS5936273U (en) | Structure of lead wire fixing part of flexible circuit board with reinforcing plate | |
JPS60124069U (en) | Printed board | |
JPS58131654U (en) | Thick film electrode structure | |
JPS58142958U (en) | Printed board | |
JPS59187163U (en) | chip parts | |
JPS58135875U (en) | wiring terminal | |
JPS60176569U (en) | Mounting structure of chip parts | |
JPS5834727U (en) | Electronic components for printed circuit boards | |
JPS594661U (en) | printed wiring board | |
JPS6142882U (en) | Double-sided printed wiring body | |
JPS6037272U (en) | Chip component mounting structure | |
JPS5931223U (en) | Chip-shaped circuit components | |
JPS59195752U (en) | hybrid integrated circuit | |
JPS5820542U (en) | Structure of electronic components with printed board mounted terminals | |
JPS58103164U (en) | Printed circuit board component connection device | |
JPS5848098U (en) | magnetic bubble memory package | |
JPS5932919U (en) | magnetic encoder | |
JPS58138273U (en) | connection structure | |
JPS6083273U (en) | Component mounting structure | |
JPS58134872U (en) | printed wiring board | |
JPS6085867U (en) | chip parts | |
JPS60167366U (en) | hybrid integrated circuit | |
JPS58190741U (en) | electronic circuit package |