JPS60183716A - Method of producing resin sheathed electronic component - Google Patents
Method of producing resin sheathed electronic componentInfo
- Publication number
- JPS60183716A JPS60183716A JP4008484A JP4008484A JPS60183716A JP S60183716 A JPS60183716 A JP S60183716A JP 4008484 A JP4008484 A JP 4008484A JP 4008484 A JP4008484 A JP 4008484A JP S60183716 A JPS60183716 A JP S60183716A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin
- exterior
- producing resin
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は樹脂外装型電子部品の製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a resin-clad electronic component.
従来、コンデンナや抵抗等の電子部品を複数個一体化す
る場合、通常、金属バンド等の取付脚を用いているが、
作業が困難である欠点があった。Conventionally, when integrating multiple electronic components such as condensers and resistors, mounting legs such as metal bands are usually used.
The disadvantage was that it was difficult to work with.
本発明は、以上の欠点を改良し、複数個の電子部品を容
易に一体化しうる樹脂外装型電子部品の製造方法の提供
を目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned drawbacks and provide a method for manufacturing a resin-clad electronic component that can easily integrate a plurality of electronic components.
本発明は、上記の目的を達成づるために、複数個の電子
部品を樹脂外装により一体化した樹脂外装型電子部品の
製造方法において、゛電子部品にモールド外装を設【ノ
るとともに該モールド外装と一体的に収納部をモールド
成形し、その接法収納部に他の電子部品を収納部ること
を待ｉ′ｉどＪる樹脂夕１装型電子部品の製造方法を提
１共するものである。In order to achieve the above object, the present invention provides a method for manufacturing a resin-clad electronic component in which a plurality of electronic components are integrated with a resin exterior. This invention provides a method for manufacturing a resin-mounted electronic component in which a storage portion is molded integrally with the mold, and other electronic components are stored in the joint storage portion. It is.
以下、本発明の実施例を図面に基づいて説明する。Embodiments of the present invention will be described below based on the drawings.
先づ゛、第１図に示’？Ｉ−通り、＝１ンデンＩＪ′素
子や抵抗等の電子部品１にエポキシ樹脂智をモールドし
く＋：−ルド外装２を設（プるとともに、同時に、収ボ
キシ等の樹脂５を収納部３内に充１眞して硬化さＵ、電
子部品４を固定する。First, as shown in Figure 1. As shown in Fig. 1, an epoxy resin is molded onto electronic parts 1 such as IJ' elements and resistors, and a +:- mold exterior 2 is installed (at the same time, a resin 5 such as a storage box is placed inside the storage section 3). The electronic component 4 is then hardened and fixed.
すなわら、本発明によれば、２個の電子部品１及び４を
一体化りるのに、モールド外装２をへ形する際に同時に
八めされた収納部３を利用しているだめに、従来の取イ
→脚を用いた場合に比べて、ぞの作業が容易になる。ま
た、電子部品４の種類によっτはモールド成形時の１品
度にＪ、リバしく劣化づるムのもあり、このような場合
、収納部３をクースどしで用いることにより劣化が防１
にされる。In other words, according to the present invention, in order to integrate the two electronic components 1 and 4, the storage portion 3 which is formed simultaneously when the mold exterior 2 is shaped into a shape is used. This makes the work easier than when using conventional handles. In addition, depending on the type of electronic component 4, τ may deteriorate considerably during molding, and in such cases, deterioration can be prevented by using the housing section 3 in a coos-like manner.
be made into
なお、電子部品４が収納部３に嵌合しつる形状のどきは
、Ｊ−ボキシ樹脂等を充填覆る必要はない。Note that there is no need to fill and cover the temple-shaped opening where the electronic component 4 fits into the housing portion 3 with J-boxy resin or the like.
また、収納部は、し−ルト外装のハ側た（）ではなく、
両側に設（プるようにしてもよい。Also, the storage compartment is not located on the C side of the trunk exterior,
It may be installed on both sides.
以上の通り、本発明によれば、複数個の電子部品を容易
に一体化てさかつ外装成形１１．１にｄ３ＬＪる劣化を
防止しうる樹脂外装型電子部品の製造方法か１９らねる
、。As described above, according to the present invention, there is a method for manufacturing a resin-clad electronic component that can easily integrate a plurality of electronic components and prevent deterioration of the exterior molding.
第１図は本発明の実施例のモールド成形１１．１の…１
１図、第２図は本発明の実施例の２個の電子部品を一体
化した状態の断面図を承り。
１．４・・・°電子部品、 ２・・・七−ルド外装、３
・・・収納部。
第１図
第２図Figure 1 shows mold forming 11.1 of the embodiment of the present invention.
Figures 1 and 2 are cross-sectional views of two electronic components integrated into one embodiment of the present invention. 1.4...°electronic parts, 2...7-hard exterior, 3
...Storage department. Figure 1 Figure 2
Claims (1)
樹脂外装型電子部品の製造方法にｄ３いて、電子部品に
−Ｅ−ルド外装を段りるとともに該モールド外装と一体
的に収納部をモールド成形し、その接法収納部に他の電
子部品を収納することを特徴とＪる樹脂外装型電子部品
の製造方法。(1) In d3 of the method for manufacturing a resin-clad electronic component in which a plurality of electronic components are integrated with a resin exterior, an -E-old exterior is layered on the electronic component and a storage portion is integrally formed with the mold exterior. A method for manufacturing a resin-clad electronic component, characterized in that it is molded and other electronic components are stored in the joint storage section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4008484A JPS60183716A (en) | 1984-03-02 | 1984-03-02 | Method of producing resin sheathed electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4008484A JPS60183716A (en) | 1984-03-02 | 1984-03-02 | Method of producing resin sheathed electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60183716A true JPS60183716A (en) | 1985-09-19 |
Family
ID=12571027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4008484A Pending JPS60183716A (en) | 1984-03-02 | 1984-03-02 | Method of producing resin sheathed electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183716A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018198527A1 (en) * | 2017-04-26 | 2018-11-01 | パナソニックＩｐマネジメント株式会社 | Capacitor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57154817A (en) * | 1981-03-19 | 1982-09-24 | Matsushita Electric Ind Co Ltd | Dry metallized film capacitor |
-
1984
- 1984-03-02 JP JP4008484A patent/JPS60183716A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57154817A (en) * | 1981-03-19 | 1982-09-24 | Matsushita Electric Ind Co Ltd | Dry metallized film capacitor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018198527A1 (en) * | 2017-04-26 | 2018-11-01 | パナソニックＩｐマネジメント株式会社 | Capacitor |
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