JPS60183447U - 沸騰冷却装置 - Google Patents
沸騰冷却装置Info
- Publication number
- JPS60183447U JPS60183447U JP7129784U JP7129784U JPS60183447U JP S60183447 U JPS60183447 U JP S60183447U JP 7129784 U JP7129784 U JP 7129784U JP 7129784 U JP7129784 U JP 7129784U JP S60183447 U JPS60183447 U JP S60183447U
- Authority
- JP
- Japan
- Prior art keywords
- airtight
- terminal
- cooling device
- support means
- boiling cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7129784U JPS60183447U (ja) | 1984-05-16 | 1984-05-16 | 沸騰冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7129784U JPS60183447U (ja) | 1984-05-16 | 1984-05-16 | 沸騰冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60183447U true JPS60183447U (ja) | 1985-12-05 |
| JPH0328515Y2 JPH0328515Y2 (enExample) | 1991-06-19 |
Family
ID=30608657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7129784U Granted JPS60183447U (ja) | 1984-05-16 | 1984-05-16 | 沸騰冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183447U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572555A (en) * | 1980-06-05 | 1982-01-07 | Toshiba Corp | Cooling device for semiconductor element |
| JPS57170558A (en) * | 1981-04-14 | 1982-10-20 | Mitsubishi Electric Corp | Boiling cooling type semiconductor device |
-
1984
- 1984-05-16 JP JP7129784U patent/JPS60183447U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572555A (en) * | 1980-06-05 | 1982-01-07 | Toshiba Corp | Cooling device for semiconductor element |
| JPS57170558A (en) * | 1981-04-14 | 1982-10-20 | Mitsubishi Electric Corp | Boiling cooling type semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328515Y2 (enExample) | 1991-06-19 |