JPS6018281B2 - Thin film creation device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for forming a thin film on a substrate by a coating method.

Such devices are used, for example, when creating ceramic thin films during the manufacturing process of multilayer ceramic capacitors and ceramic filters.

Conventionally, in this type of thin film forming apparatus, as shown in FIG. A thin film 40 having a thickness corresponding to the gap between the film thickness setting plate 38 and the substrate 34 on the support plate 39 adjusted by the micrometer head 37.
After forming the thin film 40, the thin film 40 is dried with a sheathed heater 42 in a drying oven 41, and after being wound up together with the base 34 on a winding roller 43, the thin film 40 is peeled off from the base 34 to obtain only the thin film 40. There are other methods.

However, in this conventional method, some of the slurry that is rolled up with the film gets trapped in the film surface and remains as air bubbles, and when the slurry dries in that state, the air bubbles form. Thermal expansion may result in the formation of minute protrusions or pinholes in the thin film. Also,
Since the film thickness is set using a single film thickness setting plate, the film thickness of the thin film becomes non-uniform, which significantly obscures the characteristics of the product and has drawbacks such as poor product productivity. The purpose of the present invention is to
It is an object of the present invention to provide a thin film forming apparatus that eliminates the above-mentioned drawbacks and efficiently produces thin films with high quality.

That is, the present invention includes a roll wound with a film-like substrate;
A winding section that winds up the prepared film together with the substrate; a substrate feeding section that is located between these and that feeds out the substrate; a slurry supply section that applies slurry onto the substrate between the roll and the substrate feeding section; A drying oven for drying the thin film produced by the slurry, a mechanism for applying appropriate tension to the substrate, and a mechanism for removing air bubbles adhering to the surface of the substrate between the roll and the slurry container. This thin film forming apparatus has a mechanism, and the slurry supply V supply section is equipped with two adjustable film thickness setting plates.

Next, an embodiment of the thin film forming apparatus of the present invention will be described with reference to the drawings.

2 is a perspective view showing the configuration of an embodiment of the thin film forming apparatus of the present invention, FIG. 3 is a sectional view of the base guide block in FIG. 2, and FIG. 4 is a sectional view of the slurry V supply section in FIG. It is a main sectional view.

1 is a film-like substrate that is fed out from a roll 2;

Reference numeral 3 denotes a tension control section that constantly detects the winding diameter of the roll 2 with a detection section 4, and applies a constant tension to the base 1 based on a signal from this detection section.

Reference numeral 5 indicates a rotating roller that changes the direction in which the substrate 1 is fed.

Reference numeral 6 denotes a slurry supply V supply section, which has a structure for removing air bubbles adhering to the surface of the substrate 1, for example, by using a vacuum pump (not shown) or the like to remove a large amount of air drawn in together with the substrate 1. The labyrinth structure 7 is removed by creating a negative pressure inside the labyrinth structure 7. The labyrinth structure 7 is integrally provided on the front surface of the supply box 8 on the base roll side, and is slid up and down within the supply box 8 to remove powdery objects. A first film thickness setting plate 11 that sets the film thickness of the thin film 10 of the slurry 9 made of a solvent and a binder, and has a barb 12 to prevent the slurry 9 from overflowing and a pass hole 13 to drain the slurry 9. and a second film thickness setting plate 14 which, like the first film thickness setting plate 11, slides up and down in the supply box 8 to set the film thickness of the thin film 10;
It is comprised of a micrometer head 15 that adjusts the vertical position of the film thickness setting plate 14, and a support stand 16 that holds the supply box 8 via the base 1.

A drying oven 17 efficiently dries the thin film 10 using a heater 18 (for example, a far-infrared heater).

) to dry. 19 is a base guide block, and the thin film 10
Both ends of the substrate 1 (portions to which the thin film 10 is not applied) after being coated are guided to prevent meandering of the substrate 1 and sagging of the thin film 10.

Reference numeral 20 denotes a lighting lamp for monitoring the state of the thin film 10, which is illuminated from the bottom of the substrate 1 after the thin film 10 has been coated in the slurry coating section 6 and dried in the drying oven 17.

Reference numeral 21 denotes a substrate feeding section, which is equipped with a drive roller 22 and a servo motor 23 that drives it, and is installed at a constant interval.
It consists of a pinch roller 24 that feeds the substrate.

Reference numeral 25 denotes a winding control section, in which a detection section 27 detects the winding diameter of the substrate 1 and thin film 10 wound around a winding roller 26, and a signal from this detection section is used to maintain a constant tension between the substrate 1 and the thin film 1. give.

Next, the operation of the present invention will be explained with reference to the drawings.

As shown in FIGS. 2, 3, and 4, the base 1 is sent out from the roll 2 by a drive roller 22 rotated by a servo motor 23 and a pinch roller 24. As shown in FIGS.

At this time, a constant tension is applied to the base body 1 by a tension control section 3 that receives a signal from a detection section 4 that detects the winding diameter of the roll 2. The feeding direction of the substrate 1 taken out from the roll 2 is changed by the rotating roller 5. Next, air bubbles adhering to the surface of the substrate 1 are removed by the labyrinth structure 7 of the supply box 8 on the support stand 6, and then the slurry 9 is applied to form the thin film 10. At this time, the slurry 9 is not applied to both ends of the base 1 that are guided by the base guide block 19 and come into contact with the pinch rollers 24. In addition, thin film 1
The film thickness of 0 is set up to the gap between the first thickness setting plate 11 and the second film thickness setting plate 14, which are respectively adjusted by the micrometer head 15, and the substrate 1 on the flat support stand 16. After setting with the first film thickness setting plate 11, the final setting is made with the second film thickness setting plate 14. In addition, the first film thickness setting plate 11
If there is a difference between the gap between the first film thickness setting plate 11 and the second film thickness setting plate 14, and the slurry 9 has accumulated between the first film thickness setting plate 11 and the second film thickness setting plate 14, Film thickness setting plate 11
The return 12 prevents it from overflowing from the supply box 8 and returns it to the hole 13. Next, the thin film coated on the surface of the substrate 1 is guided by substrate guide blocks 19 that guide both ends of the substrate 1 and dried by a heater 18 in a drying oven 17 . In addition, the state of the thin film 10 after coating and after drying can be monitored by illuminating it from the lower part of the substrate 1 with an illumination lamp 20. Next, the dried thin film 10 passes through a dry roller 22 and a pinch roller 24 and is wound up together with the substrate 1 onto a winding roller 26. At this time, a certain tension is applied to the base body 1 and the thin film 10 by the winding control unit 25 which receives a signal from the detection unit 27 that detects the winding diameters of the base body and the thin film. After winding is completed, the thin film 10 can be peeled off from the base 1 to obtain only the thin film. As described above, in the present invention, no air bubbles remain between the substrate and the slurry when the slurry is applied, so pinholes in the thin film caused by air bubbles are eliminated. Further, in the present invention, the thin film is set in two stages by two film thickness setting plates, so that the film thickness becomes uniform.

In this embodiment, the rotating roller 5 is used to change the feeding direction of the substrate. By changing the direction in this way, it becomes easier to measure the tension applied to the substrate. In addition, in this embodiment, a labyrinth structure 7 is used as a mechanism for removing air bubbles adhering to the substrate surface.
is provided integrally with the slurry supply section. In order to remove air bubbles, it is preferable to have a structure in which the slurry is integrated with the slurry supply groove to prevent air from entering. Furthermore, in this embodiment, a substrate guide block is provided, and the width of the film thickness setting plate is made narrower than the width of the substrate, so that a thin film is not formed on both ends of the substrate, and a pinch roller is used in the substrate feeding section to form a thin film. This is done so that both ends of the base are held down. By doing so, the formed thin film is not stained by the rollers as compared to the case where the formed thin film is pressed by the support roller 32 shown in FIG. 1, so that a thin film of excellent quality can be obtained. Further, by providing the base guide block, there is no sagging of the thin film and the thin film is kept uniform, which is particularly effective when the film is thick. Further, in this embodiment, the condition of the thin film can be monitored from below using an illumination lamp after the thin film has been applied and dried.

As a result, changes in coating conditions are easily detected and the film thickness setting plate is immediately adjusted to predetermined coating conditions. Furthermore, in this embodiment, when slurry accumulates between the two film thickness setting slopes, it is constructed to be returned to its original state by means of a barb and escape hole, so there is no leakage to the outside, resulting in good workability.

As explained above, according to the present invention, a thin film without pinholes and having a uniform thickness can be achieved by a coating method.

[Brief explanation of the drawing]

Figure 1 is a schematic diagram of a conventional thin film forming apparatus, Figure 2 is a perspective view showing the configuration of an embodiment of the apparatus of the present invention, Figure 3 is a sectional view of the base guide block in Figure 2, and Figure 4 is 3 is a main sectional view of the slurry supply section in FIG. 2. FIG. In the figure, 1 and 34 are base bodies, 2 and 33 are rolls, 3 is a tension control unit, 4 is a detection unit, 5 is a rotating roller, 6 is a slurry supply unit, 7 is a labyrinth structure, 8 and 25 are supply boxes to 9,
36 is a slurry, 10 and 40 are thin films, 11 is a first film thickness setting plate, 12 is a return, 13 is a hollow hole, 14 is a second film thickness setting plate, 15 and 37 are micrometer heads, and 16 and 39 are Support stand, 17 and 41 are drying ovens, 18 and 42 are heaters, 19
2 is a base guide block, 2 is a lighting lamp, 21 is a base feeding section, 22 is a drive loaf, 023 is a servo motor, 2
4 is a pinch roller, 25 is a winding control section, 26, 43
is a take-up roller, 27 is a detection unit, 31 is a feed roller,
32 is a support roller, and 38 is a thickening setting plate. O diagram O 2 diagram Juice 3 diagram O 4 diagram

Claims (1)

[Scope of Claims] 1. A roll around which a film-like substrate is wound, a winding section that winds up the prepared film together with the substrate, a substrate feeding section that is located between these and that feeds out the substrate, and the roll and substrate feeding section. An apparatus comprising: a slurry supply section for applying slurry onto a substrate between the two; and a drying oven for drying the thin film coated there; and a mechanism for removing air bubbles adhering to the surface of the substrate, and the slurry supply section is equipped with two adjustable film thickness equipment plates. Device. 2 The two film thickness setting plates are the first plate for setting the film thickness in advance.
A second film thickness setting plate comprising a film thickness setting plate and a second film thickness setting plate that is located in front of the first film thickness setting plate with respect to the substrate traveling direction and has a smaller gap with the substrate than the first film thickness setting plate. The thin film forming apparatus according to scope 1. 3. The thin film forming apparatus according to claim 2, wherein a bar is provided between the two film thickness setting plates to prevent slurry from overflowing, and a hollow hole is provided in the first film thickness setting plate. 4. The thin film forming apparatus according to claim 1 or 2, wherein the width of the film thickness setting plate is narrower than the width of the substrate. 5. Claim 1 or 4, which includes a substrate guide block in a portion between the slurry supply section and the substrate feeding section.
The thin film forming apparatus described in . 6. The thin film forming apparatus according to claim 1, wherein the mechanism for removing air bubbles adhering to the surface of the substrate has a labyrinth structure. 7. The thin film forming apparatus according to claim 1 or 6, wherein a mechanism for removing air bubbles adhering to the surface of the substrate is integrated with the slurry supply section and provided on the front surface of the slurry supply section on the roll side. 8. The thin film forming apparatus according to claim 1, wherein the mechanism for applying appropriate tension to the substrate comprises a detection section that detects the winding diameter of the roll, and a tension control section that controls the tension of the substrate based on a signal from this detection section. . 9. The thin film forming apparatus according to claim 1, further comprising an illumination lamp provided at the lower part of the substrate in front of the slurry supply section and/or in front of the drying oven with respect to the direction of movement of the substrate. 10. The thin film forming apparatus according to claim 1, wherein a rotating roller is provided between the roll and the slurry supply section to change the direction of the substrate. 11. The thin film forming apparatus according to claim 1, 4 or 5, wherein the support roller of the substrate feeding section is a pinch roller that pinches only both ends of the substrate.