JPS60181275A - Metal plated molded article of unsaturated polyester resin - Google Patents

Metal plated molded article of unsaturated polyester resin

Info

Publication number
JPS60181275A
JPS60181275A JP59035315A JP3531584A JPS60181275A JP S60181275 A JPS60181275 A JP S60181275A JP 59035315 A JP59035315 A JP 59035315A JP 3531584 A JP3531584 A JP 3531584A JP S60181275 A JPS60181275 A JP S60181275A
Authority
JP
Japan
Prior art keywords
polyester resin
unsaturated polyester
parts
unsatd
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59035315A
Other languages
Japanese (ja)
Inventor
Masamichi Togo
正道 東郷
Shiro Sakai
史郎 酒井
Saburo Kano
狩野 三郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP59035315A priority Critical patent/JPS60181275A/en
Publication of JPS60181275A publication Critical patent/JPS60181275A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To enable metal plating on a molded article of unsatd. polyester resin by incorporating rubber contg. butadiene combined optionally with an inorg. filler into the unsatd. polyester resin. CONSTITUTION:When a molded body of unsatd. polyester resin is coated with metal by chemical plating or electroplating, the molded body is formed by molding a mixture consisting of 100pts.wt. unsatd. polyester resin and 1-40pts.wt. rubber contg. butadiene and having 1,000-200,000 average mol.wt. such as acrylonitrile-butadiene-styrene rubber. To the mixture may be added 30-180pts. wt. inorg. filler of 0.5-20mum average particle size such as calcium carbonate, clay or aluminum hydroxide. Chemical plating or electroplating which is not applicable to a molded body of only unsatd. polyester resin can be carried out.

Description

【発明の詳細な説明】 本発明は金属メッキされた不飽和ポリエステル樹脂成形
品に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal-plated unsaturated polyester resin molded article.

不飽和ポリエステル樹脂成形材料は、その成形加工性、
作業環境などの良さからバスタブ、タンク、浄化槽、建
材、工業部品、自動車部品、電気部品などの分野で広く
使用されている。しかし、成形して得られた不飽和ポリ
エステル樹脂成形品の表面に硬度、耐摩耗性、輻射耐熱
性、導實性、装飾性等を付与すべく金属メッキを施そう
としても、いまだ不飽和ポリエステル樹脂成形品に対す
る金属メッキ技術が確立しておらず、金属メッキされた
成形品が得られないという欠点があり1その開発が強く
望1れている。
Unsaturated polyester resin molding materials are characterized by their moldability,
Because of its good working environment, it is widely used in fields such as bathtubs, tanks, septic tanks, building materials, industrial parts, automobile parts, and electrical parts. However, despite attempts to apply metal plating to the surface of unsaturated polyester resin molded products to impart hardness, abrasion resistance, radiant heat resistance, conductivity, decorative properties, etc., unsaturated polyester resin still remains unsaturated. The metal plating technology for resin molded products has not been established, and there is a drawback that metal-plated molded products cannot be obtained1, so its development is strongly desired1.

本発明者等は、上記の如き実状に鑑み、金属メッキされ
た不飽和ポリエステル樹脂成形品を得るべく鉄量検討し
た結果、ブタジェン成分を含有するゴムを添加した不飽
和ポリエステル樹脂は、無電解メッキ法(化学メッキ法
)あるいは無電解メッキ法と電気メツキ法の併用法を用
いると、密着性の良好な金属メッキが可能となること、
およびブタジェン成分を含有するゴムの他に更に無機質
充填剤を添加すると金属メッキの密着性がより一層向上
することを見い出し、本発明を完成するに至った。
In view of the above-mentioned circumstances, the present inventors investigated the amount of iron in order to obtain a metal-plated unsaturated polyester resin molded product. Metal plating with good adhesion is possible by using a method (chemical plating method) or a combination of electroless plating method and electroplating method.
The present inventors have discovered that the adhesion of metal plating can be further improved by adding an inorganic filler in addition to the rubber containing the butadiene component, and have completed the present invention.

すなわち本発明は、不飽和ポリエステル樹脂と、ブタジ
エン成分を含有するゴムと、更に必要に応じて無機充填
剤とを含有する不飽和ポリエステル樹脂層上に金属メッ
キ層を有することを特徴とする金属メッキされた不飽和
ポリエステル樹脂成形品を提供するものである。
That is, the present invention provides a metal plating characterized by having a metal plating layer on an unsaturated polyester resin layer containing an unsaturated polyester resin, a rubber containing a butadiene component, and further an inorganic filler as necessary. The present invention provides an unsaturated polyester resin molded article.

本発明で使用する不飽和ポリエステル樹脂としては、α
The unsaturated polyester resin used in the present invention includes α
.

β−不飽和二塩基酸またはその酸無水物と、芳香族飽和
二塩基酸またはその酸無水物と、グリコール類の重縮合
によって製造され、場合によっては酸成分として脂肪族
あるいは脂環族飽和二塩基酸を併用して製造された不飽
和ポリエステル30〜80重量部を、α、β−不飽和単
量体70〜20重量部に溶解して得られるものが挙げら
れるが、その他に不飽和ポリエステルの末端をビニル変
性したもの、およびエポキシ骨格の末端をビニル費性し
たビニルエステル等も含まれるものとする。
It is produced by polycondensation of β-unsaturated dibasic acid or its acid anhydride, aromatic saturated dibasic acid or its acid anhydride, and glycols. Examples include those obtained by dissolving 30 to 80 parts by weight of an unsaturated polyester produced in combination with a basic acid in 70 to 20 parts by weight of an α,β-unsaturated monomer; It also includes those with vinyl-modified ends, and vinyl esters with vinyl-modified ends of epoxy skeleton.

本発明で使用するα、β−不飽和二塩基酸またはその酸
無水物としては、マレイン酸、無水マレイン酸、フマル
酸、イタコン酸、シトラコン酸、クロルマレイン酸およ
びこれらのエステル等があり、芳香族飽和二塩基酸まだ
はその酸無水物としては、フタル酸、無水フタル酸、イ
ソフタル酸、テレフタル酸、テトラヒドロ無水フタル酸
、エンドメチレンテトラヒドロ無水フタル酸、ハロゲン
化無水フタル酸およびこれらのエステル等があり、脂肪
族あるいは脂環族飽和二塩基酸としては、コノ・り酸、
アジピン酸、セバシン酸、ヘキサヒドロ無水フタル酸お
よびこれらのエステル等があり、それぞれ単独あるいは
併用して使用される。グリコール類としては、エチレン
グリコール、プロピレングリコール、ジエチレングリコ
ール、ジプロピレングリコール、1゜6−ブタンジオー
ル、1,4−ブタンジオール、ネオペンチルクリコール
、トリエチレングリコール、1.5−ベンタンジオール
、1.6−ヘキサンジオール、ビスフェノールA1水素
化ビスフエノールA、2.2−ジ(4−ヒドロキシプロ
ポキシフェニル±プロパン等が挙げられ、単独あるいは
併用で使用されるが、その他にエチレンオキサイド、プ
ロピレンオキサイド等の酸化物も同様に使用できる。ま
たグリコール類と酸成分の一部としてポリエチレンテレ
フタレート等の重縮金物も使用できる。α、β−不飽和
単量体としては、スチレン、ビニルトルエン、α−メチ
ルスチレン、クロルスチレンなどのスチレン系化合物、
メチルメタアクリレート等のアクリル化合物およびトリ
アリルシアヌレート等のアリル化合物などの不飽和ポリ
エステルと架橋可能なビニルモノマーあるいはビニルオ
リゴマー等が挙げられ、単独あるいは併用で使用される
が、一般的にはスチレンが使用される。
Examples of the α,β-unsaturated dibasic acids or their acid anhydrides used in the present invention include maleic acid, maleic anhydride, fumaric acid, itaconic acid, citraconic acid, chlormaleic acid, and esters thereof. Examples of saturated dibasic acids and their acid anhydrides include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, tetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, halogenated phthalic anhydride, and esters thereof. Examples of aliphatic or alicyclic saturated dibasic acids include cono-phosphoric acid,
Examples include adipic acid, sebacic acid, hexahydrophthalic anhydride, and esters thereof, each of which may be used alone or in combination. Examples of glycols include ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, 1.6-butanediol, 1,4-butanediol, neopentyl glycol, triethylene glycol, 1.5-bentanediol, and 1.6-butanediol. -Hexanediol, bisphenol A1, hydrogenated bisphenol A, 2,2-di(4-hydroxypropoxyphenyl±propane, etc.), which may be used alone or in combination; in addition, oxides such as ethylene oxide, propylene oxide, etc. Also, polycondensed metals such as polyethylene terephthalate can be used as part of the glycols and acid components.As the α,β-unsaturated monomers, styrene, vinyltoluene, α-methylstyrene, chloro Styrenic compounds such as styrene,
Examples include vinyl monomers or vinyl oligomers that can be crosslinked with unsaturated polyesters such as acrylic compounds such as methyl methacrylate and allyl compounds such as triallyl cyanurate, and are used alone or in combination, but styrene is generally used. used.

本発明で使用するブタジェン成分を含有するゴムとして
は、平均分子量が1000〜200,000のアクリロ
ニトリル5− 一フタジエンースチレンゴム、スチレン−ブタジェンゴ
ム、ネオプレン−ブタジェンゴム、ポリブタジェン等が
挙げられ、それぞれ単独あるいは併用して使用される。
Examples of the rubber containing a butadiene component used in the present invention include acrylonitrile 5-monophtadiene-styrene rubber, styrene-butadiene rubber, neoprene-butadiene rubber, and polybutadiene rubber having an average molecular weight of 1,000 to 200,000, each of which may be used alone or Used in combination.

なかでもスチレン−ブタジェンゴムは不飽和ポリエステ
ル樹脂との相溶性が良く、好ましい。尚、これらブタジ
ェン成分を含有するゴムは、スチレン等のα、β−不飽
和単量体に溶解させた溶液として不飽和ポリエステル樹
脂と混合させることができる。
Among these, styrene-butadiene rubber is preferred because it has good compatibility with unsaturated polyester resins. Note that the rubber containing these butadiene components can be mixed with the unsaturated polyester resin in the form of a solution dissolved in an α,β-unsaturated monomer such as styrene.

ブタジェン成分を含有するゴムの使用量は、不飽和ポリ
エステル樹脂100重量部に対して通常1〜40重1部
、好ましくは6〜20重量部の範囲であり、使用量が1
重量部未満では密着性の也好な金属メッキが得られず、
40重量部を越えると成形材料の粘度の上昇が著しく、
成形材料としての使用が困難となり、それぞれ好ましく
ない。
The amount of rubber containing a butadiene component used is usually 1 to 40 parts by weight, preferably 6 to 20 parts by weight, per 100 parts by weight of the unsaturated polyester resin.
If it is less than part by weight, metal plating with good adhesion cannot be obtained.
If it exceeds 40 parts by weight, the viscosity of the molding material will increase significantly;
It becomes difficult to use it as a molding material, and each is undesirable.

本発明で使用することができる無機充填剤としては、平
6− 均粒径が0.5〜20μmの炭酸カルシウム、クレー、
水酸化アルミニウム等が挙げられ、それぞれ単独あるい
は併用して使用される。なかでも炭酸カルシウムはクロ
ム酸混液等の化学エツチング液に溶解し、金属メッキの
密着性を特に向上させるので好捷しい。無機充填剤の添
加量は、不飽和ポリエステル樹脂100重量部に対して
、通常0〜300重量部、好ましくは30〜180重量
部である。尚、カーボン粉末、グラファイト粉末等の導
電性粉末を併用することも可能である。
Inorganic fillers that can be used in the present invention include calcium carbonate, clay, and clay having an average particle size of 0.5 to 20 μm.
Examples include aluminum hydroxide, each of which may be used alone or in combination. Among these, calcium carbonate is preferred because it dissolves in a chemical etching solution such as a chromic acid mixture and particularly improves the adhesion of metal plating. The amount of the inorganic filler added is usually 0 to 300 parts by weight, preferably 30 to 180 parts by weight, based on 100 parts by weight of the unsaturated polyester resin. Incidentally, it is also possible to use conductive powder such as carbon powder or graphite powder in combination.

さらに不飽和ポリエステル樹脂は、ベンゾイルパーオキ
シド、メチルエチルケトンパーオキシド、ラウロイルパ
ーオキシド、クメンヒドロパーオキシド、ジクミルパー
オキシド;t−ブチルパーベンゾエートなどの如き慣用
の硬化触媒、ジメチルアニリン、ナフテン酸コバルトな
どの如き慣用の硬化促進剤、コバルトオクトエート、ジ
プチルチンジラウレート々どの如き慣用のウレタン化触
媒、ガラス繊維、グラファイト繊維、有機繊維、ミルド
ファイバー、コツトンフロック、ホイスカーなどの如き
繊維強化材、ステアリン酸亜鉛などの慣用の離型剤、そ
の他有機顔料もしくは無機顔料、ポリスチレン、ポリア
クリレート、ポリ酢酸ビニル、飽和ポリエステルの如き
熱可塑性(ψ(脂などの低収縮剤などを添加することが
できる。
Furthermore, the unsaturated polyester resins can be cured using conventional curing catalysts such as benzoyl peroxide, methyl ethyl ketone peroxide, lauroyl peroxide, cumene hydroperoxide, dicumyl peroxide; t-butyl perbenzoate, dimethylaniline, cobalt naphthenate, etc. conventional curing accelerators such as cobalt octoate, diptylthine dilaurate, etc., fiber reinforcements such as glass fibers, graphite fibers, organic fibers, milled fibers, cotton flock, whiskers, etc., zinc stearate. Conventional mold release agents such as other organic or inorganic pigments, thermoplastics such as polystyrene, polyacrylates, polyvinyl acetate, saturated polyesters, low shrinkage agents such as fats, etc. can be added.

また、不飽和ポリエステル樹脂は、アルカリ土類金属の
酸化物、アルカリ土類金属の水酸化物、ポリイソシアネ
ートから選ばれる少なくとも一種の化合物を添加してシ
ート状でβ−ステージ化(増粘)シ、成形材料とするこ
とが好ましい。その添加量は不飽和ポリエステル樹脂1
00市f部に対して、通常1〜20重量部、好ましくは
5〜10重量部の範囲である。
Further, the unsaturated polyester resin can be β-staged (thickened) in sheet form by adding at least one compound selected from alkaline earth metal oxides, alkaline earth metal hydroxides, and polyisocyanates. , is preferably used as a molding material. The amount added is unsaturated polyester resin 1
The amount is usually 1 to 20 parts by weight, preferably 5 to 10 parts by weight, based on 00 parts f.

ここで用いるアルカリ土類金属の酸化物としては、例え
ば酸化マグネシウム、酸化カルシウム等が、アルカリ土
類金属の水酸化物としては、例えば水酸化マグネシウム
、水酸化カルシウム等が、ポリイソシアネートとしては
、例えばテトラメチレンジイソシアネート、ヘキサメチ
レンジイソシアネート、1,4−シクロヘキサンジイソ
シアネート、1.6−シクロヘキサンジイソシアネート
、キシリレンジイソシアネート、4.4’−ジフェニル
メタンジイソシアネート、2.4−4リレンジイソシア
ネート、2.6−)リレンジイソシアネート、ナフタレ
ンジイソシアネートなどのジイソシアネート;ポリメチ
レンポリフェニルイソシアネートなどの多官能性ポリイ
ソシアネート;およびポリエステルポリオールまたはポ
リエーテルポリオールの末端ヒドロキシ基をジイソシア
ネート化合物と反応させて末端にイソシアネート基に付
加させた分子量500〜5000のイソシアネート・プ
レポリマーなどの如き公知慣用のもの9− が挙げられる。
Examples of alkaline earth metal oxides used here include magnesium oxide, calcium oxide, etc., examples of alkaline earth metal hydroxides include magnesium hydroxide, calcium hydroxide, etc., and polyisocyanates include, for example, Tetramethylene diisocyanate, hexamethylene diisocyanate, 1,4-cyclohexane diisocyanate, 1.6-cyclohexane diisocyanate, xylylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2.4-4 lylene diisocyanate, 2.6-) lylene diisocyanate, Diisocyanates such as naphthalene diisocyanate; polyfunctional polyisocyanates such as polymethylene polyphenylisocyanate; Known and commonly used polymers such as isocyanate prepolymers may be mentioned.

上記の如くして得られた不飽和ポリエステル樹脂成形材
料の成形法は特に限定されるものではなく、公知の不飽
和ポリエステル樹脂成形法がいずれも使用できる。
The method for molding the unsaturated polyester resin molding material obtained as described above is not particularly limited, and any known unsaturated polyester resin molding method can be used.

不飽和ポリエステル樹脂成形品を金属メッキする方法と
しては、公知の無電解メッキ法(化学メッキ法)、する
い例えば、不飽和ポリエステル成形品表面をメタノール
、エタノール、イングロビルアルコール、アセトン、ト
リクロルエタン等を用いて脱脂し、水洗後、化学エツチ
ングを行う。化学エツチングは、クロム酸混液(例えば
、重クロム酸カリウムの飽和水溶液と濃硫酸との混合液
)、ノンクロムエツチング液(例えば、過マンガン酸塩
とリン酸との混合液)等を使用することができる。次に
センシタイジング処理、アクチベーテイング処理等の前
処理を行った後、無10− 電解メッキを行い、ニッケル、クロム、銀、銅、ニッケ
ル、l金(例えば、ニッケルーリン、ニッケルーボロン
)等を成形品表面に付着させる。更に好ましくは、各種
金属、例えば、銅、ニッケル、クロム、亜鉛、カドミウ
ム、スズ、金、銀、黄銅、青銅等の電気メッキを行い、
金属メッキを完了させる方法等が一例として挙げられる
。尚、金属メッキは必要に応じて繰シ返して行うことも
でき、その厚さはそれぞれ通常0.1〜50μmである
As a method for metal plating an unsaturated polyester resin molded product, a well-known electroless plating method (chemical plating method) is used, for example, the surface of the unsaturated polyester molded product is plated with methanol, ethanol, inglobil alcohol, acetone, trichloroethane, etc. After degreasing and washing with water, chemical etching is performed. For chemical etching, a chromic acid mixture (for example, a mixture of a saturated aqueous solution of potassium dichromate and concentrated sulfuric acid), a non-chromium etching solution (for example, a mixture of permanganate and phosphoric acid), etc. can be used. can. Next, after performing pre-treatments such as sensitizing treatment and activating treatment, non-10-electrolytic plating is performed to coat nickel, chromium, silver, copper, nickel, gold (e.g. nickel-phosphorus, nickel-boron). etc. are attached to the surface of the molded product. More preferably, various metals such as copper, nickel, chromium, zinc, cadmium, tin, gold, silver, brass, bronze, etc. are electroplated,
An example is a method of completing metal plating. Note that metal plating can be performed repeatedly as necessary, and the thickness thereof is usually 0.1 to 50 μm each.

本発明の金属メッキされた化成形品は、表面硬度、耐摩
耗性、輻射耐熱性、表面導電性、電波反射性、装飾性に
優れ、電気電子部品、自動車部品、工業部品等の分野に
適用することができる。
The metal-plated chemical molded product of the present invention has excellent surface hardness, abrasion resistance, radiation heat resistance, surface conductivity, radio wave reflection properties, and decorative properties, and is applicable to fields such as electrical and electronic parts, automobile parts, and industrial parts. can do.

以下に実施例、比較例を示して本発明を更に具体的に説
明する。尚、例中の部および%はすべて重量基準である
EXAMPLES The present invention will be explained in more detail by showing Examples and Comparative Examples below. In addition, all parts and percentages in the examples are based on weight.

実施例1 無水マレイン酸19’6#(2モル)、無水フタルIt
148g(1モル)、プロピレングリコール228II
(3モル)を不活性ガス気流中で200〜220℃で加
熱攪拌しながら脱水反応させて得た不飽和ポリエステル
の60部を、ハイドロキノン0.005部とともにスチ
レン40部に混合溶解して、酸価20、水酸基価15な
る不飽和ポリエステル樹脂を得た。この干鰯1相ポリエ
ステル樹脂100部にJSR8L−556(日本合成ゴ
ム■製SBRゴム、ブタジェン含量76%)のスチレン
溶液(濃度30%)を60部混合した。次いで、低収縮
化剤としてポリスチレン(分子量26000)のスチレ
ン溶液(濃度50%)を15部混合し、さらに炭酸カル
シウム150部、ステアリン酸亜鉛5部、t−ブチルパ
ーベンゾエート1部、酸化マグネシウム1.5部を添加
混練し、不飽和ポリエステル樹脂コンパウンドを得、S
MC含浸機により1インチのガラスロービングチョップ
含有率が25%のSMC成形材料を作製した。24時間
熟成した後、140℃に加熱した金型内にて50ky/
crI?。
Example 1 Maleic anhydride 19'6# (2 mol), phthalic anhydride It
148g (1 mole), propylene glycol 228II
60 parts of an unsaturated polyester obtained by dehydrating (3 mol) in an inert gas stream at 200 to 220°C while stirring were mixed and dissolved in 40 parts of styrene with 0.005 part of hydroquinone. An unsaturated polyester resin having a value of 20 and a hydroxyl value of 15 was obtained. 60 parts of a styrene solution (concentration: 30%) of JSR8L-556 (SBR rubber manufactured by Japan Synthetic Rubber (1), butadiene content: 76%) was mixed with 100 parts of this dried sardine one-phase polyester resin. Next, 15 parts of a styrene solution (concentration 50%) of polystyrene (molecular weight 26,000) was mixed as a low shrinkage agent, and further 150 parts of calcium carbonate, 5 parts of zinc stearate, 1 part of t-butyl perbenzoate, and 1.5 parts of magnesium oxide were added. 5 parts were added and kneaded to obtain an unsaturated polyester resin compound, S
An SMC molding material having a 1-inch glass roving chop content of 25% was prepared using an MC impregnation machine. After aging for 24 hours, it was heated to 50ky/in a mold heated to 140℃.
crI? .

4分の条件にて30X30αの不飽和ポリエステル樹脂
平板を成形した。得られた成形板平面をトリクロルエタ
ンにて脱脂した後、クロム酸42[[’、濃硫酸2oo
cc、水11の混合液よりなるクロム酸混液(70℃)
に15分浸漬し、化学エツチングを行なった。水洗後、
水11に塩化第1錫10g、濃塩酸40ccを添加しだ
液(25℃)に5分間浸漬(センシタイジング)した後
、水洗し、次いで水1ノに塩化パラジウム0511濃塩
酸15ccを添加した液(35℃)に2分間浸漬(アク
チベーテイング)した。水洗、水相処理した後、水17
.硫酸ニッケル60g、次亜リン酸ソーダ20g、クエ
ン酸ソーダ40I!、28%アンモニア水25eeなる
水溶液(30℃)に10分間浸漬し、無電解二13− ツケルメツキ(厚さ02μm)を行なった。次いで水1
11硫酸銅220 F1濃硫酸250gなる水溶液(2
0℃)中にて6 V b 1.5 A/ dm”なる条
件にて20分間電気銅メッキ(厚さ6μm)を行なった
後、水11sfjtt酸ニッケル60011塩化ニッケ
ル50II、ホウ酸35.9なる水溶液(20℃)中に
て6V、IA/dm”なる条件にて10分間電気ニッケ
ルメッキ(厚さ4.5μ、)を行なった。得られたメッ
キ板は表面にふくれ、割れ、しわがなく、密着性(クロ
スカットテス)100/100)も良好であった。
A 30×30α unsaturated polyester resin flat plate was molded for 4 minutes. After degreasing the flat surface of the obtained molded plate with trichloroethane, chromic acid 42[[', concentrated sulfuric acid 2oo
Chromic acid mixture (70°C) consisting of a mixture of cc and 11 parts water
It was immersed in water for 15 minutes to perform chemical etching. After washing with water,
10 g of stannous chloride and 40 cc of concentrated hydrochloric acid were added to water 11. The mixture was immersed in a solution (25°C) for 5 minutes (sensitizing), washed with water, and then 15 cc of palladium chloride 0511 concentrated hydrochloric acid was added to water 11. It was immersed (activated) in a liquid (35°C) for 2 minutes. After washing with water and aqueous phase treatment, water 17
.. 60g of nickel sulfate, 20g of sodium hypophosphite, 40I of sodium citrate! , immersed in an aqueous solution (30° C.) of 28% ammonia water 25 ee for 10 minutes, and subjected to electroless dipping (thickness: 02 μm). Then water 1
11 Copper sulfate 220 F1 Aqueous solution of 250 g of concentrated sulfuric acid (2
After electrolytic copper plating (thickness: 6 μm) was performed for 20 minutes at 6 Vb 1.5 A/dm (0°C), water was 11sf, nickel oxide was 60011, nickel chloride was 50II, and boric acid was 35.9mm. Electrolytic nickel plating (thickness: 4.5 μm) was performed in an aqueous solution (20° C.) at 6 V and IA/dm for 10 minutes. The plated plate obtained had no bulges, cracks, or wrinkles on the surface, and had good adhesion (cross cut test: 100/100).

実施例2 無水マレイン酸19612モル)、イソフタル酸166
、?(1モル)、プロピレングリコール22813モル
)を実施例1と同様の方法にて縮合反応させ、酸価18
%水酸基価14、スチレン含有量30%なる不飽和ポリ
エステル樹脂を得た。この不飽和ポリエステル樹脂10
0部に14− 5olprene 312 (フィリップスベトロウリ
アム社製SBRブタジェン含壕70%)のスチレン溶液
(#度30%)を60部混合した。次いで炭酸カルシウ
ム150部、ステアリン酸亜鉛5部、t−ブチルパーベ
ンゾエート1部、酸化マグネシウム1.5部を添加混練
し、不飽和ポリエステル樹脂コンパウンドを得た。この
コンパウンドを実施例1と同様に8MC化し、成形材料
としだ。これを140℃、50 ’Q/cm” 、4分
なる条件にてプレス成形し、30X30cmの不飽和ポ
リエステル樹脂平板を作製した。次いで実施例1と同様
に無電解メッキ、電気メッキを施した。得られたメッキ
板は、表面にふくれ、割れ、しわがなく、密着性(クロ
スカットテスト100/100)も虫好であった。
Example 2 Maleic anhydride (19612 moles), isophthalic acid (166 moles)
,? (1 mol), propylene glycol (22813 mol)) were subjected to a condensation reaction in the same manner as in Example 1, and the acid value was 18.
An unsaturated polyester resin having a % hydroxyl value of 14 and a styrene content of 30% was obtained. This unsaturated polyester resin 10
60 parts of a styrene solution (#30%) of 14-5olprene 312 (manufactured by Philips Vetroulium Co., Ltd., SBR butadiene containing 70%) was mixed with 0 parts. Next, 150 parts of calcium carbonate, 5 parts of zinc stearate, 1 part of t-butyl perbenzoate, and 1.5 parts of magnesium oxide were added and kneaded to obtain an unsaturated polyester resin compound. This compound was made into 8MC in the same manner as in Example 1 and used as a molding material. This was press-molded under the conditions of 140°C, 50'Q/cm'', and 4 minutes to produce a 30x30cm unsaturated polyester resin flat plate.Next, electroless plating and electroplating were performed in the same manner as in Example 1. The plated plate thus obtained had no blisters, cracks, or wrinkles on its surface, and its adhesion (crosscut test 100/100) was good for insects.

実施例3 炭酸カルシウムの代わシにカオリンAsP−4oop 
(上屋カオリン工業■製〕を用いた以外は、実施例1と
同様にして平板を作製し、無電解メッキ及び電解メッキ
を行彦った。得られたメッキ板は表面にふくれ、割れ、
しわがなく、密着性(クロスカットテスト100/10
0)も良好であった。
Example 3 Kaolin AsP-4oop instead of calcium carbonate
A flat plate was prepared in the same manner as in Example 1, except that the plated plate (manufactured by Ueya Kaolin Kogyo ■) was used, and electroless plating and electrolytic plating were performed.
No wrinkles, adhesion (cross cut test 100/10)
0) was also good.

実施例4 実施例1のコンパウンドにさらにカーボン粉末ジースト
116〔東海カーボン■製〕を2部添加した以外は実施
例1と同様にして平板を作製し、無電解メッキ及び電解
メッキを行なった。得られたメッキ板は、表面にふくれ
、割れ、しわがなく、密着性(クロス力ットテス) 1
00/100)も1好であった。
Example 4 A flat plate was prepared in the same manner as in Example 1, except that 2 parts of carbon powder GEST 116 (manufactured by Tokai Carbon ■) was further added to the compound of Example 1, and electroless plating and electrolytic plating were performed. The obtained plated plate has no blisters, cracks, or wrinkles on the surface, and has good adhesion (cross force test) 1
00/100) was also 1 favorable.

実施例5 実施例1で得られた不飽和ポリエステル樹脂100部に
JSR5L−556のスチレン溶液(+#度30%)を
30部混合した。次いでステアリン酸亜鉛5部、t−ブ
チルパーベンゾエート1部、ジフェニルメタン−4,4
’−ジイソシアネート6部を添加混練し、不飽和ポリエ
ステルコンパウンドを得、含浸機によ91インチのガラ
スロービングチップ含有率が50%のシート状成形材料
を作製した。この成形材料を用いた以外は実施例1と同
様にして平板を作成し、無電解メッキ及び電解メッキを
行−りた。得られたメッキ板は表面にふくれ、割れ、し
わがなく、密着性(クロスカットテスト100/100
)もQ好であった。
Example 5 To 100 parts of the unsaturated polyester resin obtained in Example 1, 30 parts of a styrene solution of JSR5L-556 (+# degree 30%) was mixed. Next, 5 parts of zinc stearate, 1 part of t-butyl perbenzoate, and 4,4 parts of diphenylmethane
6 parts of '-diisocyanate were added and kneaded to obtain an unsaturated polyester compound, and a 91-inch sheet-like molding material having a glass roving chip content of 50% was produced using an impregnation machine. A flat plate was prepared in the same manner as in Example 1 except that this molding material was used, and electroless plating and electrolytic plating were performed. The plated plate obtained has no bulges, cracks, or wrinkles on the surface, and has good adhesion (cross cut test 100/100).
) also had a good Q.

比較例1 JSR8L−556のスチレン溶液を除いた以外は実施
例1と同様にして平板を作製し、化学メッキ及び電解メ
ッキを行なった。得られたメッキ成形板は、表面にふく
れ、割れが発生し、密着性(クロスカットテス)20/
100)は不良であった。
Comparative Example 1 A flat plate was prepared in the same manner as in Example 1 except that the styrene solution of JSR8L-556 was omitted, and chemical plating and electrolytic plating were performed. The plated molded plate obtained had bulges and cracks on the surface, and its adhesion (cross cut test) was 20/20.
100) was defective.

17− 比較例2 実施例1にて得られた不飽和ポリエステル樹脂100部
に6%ナンテン酸コバルト0.1部、55%MEKパー
オキサイド1部を添加し、チョツプド自ストランドマッ
ト[45011,/m2、日本硝子繊維■製]3ply
に含浸させて得られた成形材料を用いた以外は実施例1
と同様にして平板を作製し、化学メッキ及び重置メッキ
を施したが、メッキは付着しなかった。
17- Comparative Example 2 0.1 part of 6% cobalt nanthenate and 1 part of 55% MEK peroxide were added to 100 parts of the unsaturated polyester resin obtained in Example 1, and a chopped self-strand mat [45011,/m2 , made by Nippon Glass Fiber ■] 3ply
Example 1 except that a molding material obtained by impregnating with
A flat plate was prepared in the same manner as above, and chemical plating and superposition plating were applied, but the plating did not adhere.

代理人 弁理士 高 橋 勝 利 18−Agent: Patent Attorney Katsutoshi Takahashi 18-

Claims (1)

【特許請求の範囲】[Claims] 不飽和ポリエステル樹脂と、ブタジェン成分を含有する
ゴムと、更に必要に応じて無機質充填剤とを含有する不
飽和ポリエステル樹脂層上に金属メッキ層を有すゐこと
を特徴とする金属メッキされた不飽和ポリエステル樹脂
成形品。
A metal-plated nonwoven fabric characterized by having a metal plating layer on an unsaturated polyester resin layer containing an unsaturated polyester resin, a rubber containing a butadiene component, and optionally an inorganic filler. Saturated polyester resin molded product.
JP59035315A 1984-02-28 1984-02-28 Metal plated molded article of unsaturated polyester resin Pending JPS60181275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59035315A JPS60181275A (en) 1984-02-28 1984-02-28 Metal plated molded article of unsaturated polyester resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59035315A JPS60181275A (en) 1984-02-28 1984-02-28 Metal plated molded article of unsaturated polyester resin

Publications (1)

Publication Number Publication Date
JPS60181275A true JPS60181275A (en) 1985-09-14

Family

ID=12438370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59035315A Pending JPS60181275A (en) 1984-02-28 1984-02-28 Metal plated molded article of unsaturated polyester resin

Country Status (1)

Country Link
JP (1) JPS60181275A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150983A (en) * 1974-10-31 1976-05-06 Matsushita Electric Works Ltd KAGAKUMETSUKIKI BANNO SEIHO
JPS5388877A (en) * 1977-01-14 1978-08-04 Matsushita Electric Works Ltd Plating of polyvinylchloride
JPS5388878A (en) * 1977-01-14 1978-08-04 Matsushita Electric Works Ltd Plating of polypropylene
JPS5458784A (en) * 1977-10-18 1979-05-11 Mitsubishi Rayon Co Ltd Molded article having laminated resin layers and its manufacture
JPS5584330A (en) * 1978-12-22 1980-06-25 Teijin Chem Ltd Plating of polycarbonate resin molded article

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150983A (en) * 1974-10-31 1976-05-06 Matsushita Electric Works Ltd KAGAKUMETSUKIKI BANNO SEIHO
JPS5388877A (en) * 1977-01-14 1978-08-04 Matsushita Electric Works Ltd Plating of polyvinylchloride
JPS5388878A (en) * 1977-01-14 1978-08-04 Matsushita Electric Works Ltd Plating of polypropylene
JPS5458784A (en) * 1977-10-18 1979-05-11 Mitsubishi Rayon Co Ltd Molded article having laminated resin layers and its manufacture
JPS5584330A (en) * 1978-12-22 1980-06-25 Teijin Chem Ltd Plating of polycarbonate resin molded article

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