JPS60179049U - Semiconductor mounting structure - Google Patents

Semiconductor mounting structure

Info

Publication number
JPS60179049U
JPS60179049U JP1984065491U JP6549184U JPS60179049U JP S60179049 U JPS60179049 U JP S60179049U JP 1984065491 U JP1984065491 U JP 1984065491U JP 6549184 U JP6549184 U JP 6549184U JP S60179049 U JPS60179049 U JP S60179049U
Authority
JP
Japan
Prior art keywords
semiconductor
mounting structure
heat sink
semiconductor mounting
attaches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984065491U
Other languages
Japanese (ja)
Inventor
水戸　芳弘
Original Assignee
東北金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東北金属工業株式会社 filed Critical 東北金属工業株式会社
Priority to JP1984065491U priority Critical patent/JPS60179049U/en
Publication of JPS60179049U publication Critical patent/JPS60179049U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体取付構造で、イは平面図、口は側
面図、ハは分解斜視図、第２図は本考案の半導体取付構
造で、イは平面図、ローは側面図、ハは放熱板の斜視図
である。 図中、１は半導体、２と１０は放熱板、４は押え板、５
は取付ねじ、１０ａ，１０ｂ，１０ｃは位置決め突部を
示す。Figure 1 shows a conventional semiconductor mounting structure, where A is a plan view, mouth is a side view, and C is an exploded perspective view. is a perspective view of a heat sink. In the figure, 1 is a semiconductor, 2 and 10 are heat sinks, 4 is a holding plate, and 5
denotes a mounting screw, and 10a, 10b, and 10c denote positioning protrusions.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体を冷却する放熱板と、前記半導体を放熱板上に押
圧して取付ける押え板とからなり、その前記放熱板か、
その押え板の何れか一方に、放熱板の面方向に半導体が
移動するのを規制する位置決め突部を設けたことを特徴
とする半導体取付構構造。It consists of a heat sink that cools the semiconductor, and a holding plate that presses and attaches the semiconductor onto the heat sink, and the heat sink is
A semiconductor mounting structure characterized in that one of the holding plates is provided with a positioning protrusion that restricts movement of the semiconductor in the surface direction of the heat sink.
JP1984065491U 1984-05-07 1984-05-07 Semiconductor mounting structure Pending JPS60179049U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984065491U JPS60179049U (en) 1984-05-07 1984-05-07 Semiconductor mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984065491U JPS60179049U (en) 1984-05-07 1984-05-07 Semiconductor mounting structure

Publications (1)

Publication Number Publication Date
JPS60179049U true JPS60179049U (en) 1985-11-28

Family

ID=30597533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984065491U Pending JPS60179049U (en) 1984-05-07 1984-05-07 Semiconductor mounting structure

Country Status (1)

Country Link
JP (1) JPS60179049U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886752A (en) * 1981-11-18 1983-05-24 Matsushita Electric Ind Co Ltd Mounting device for heating part
JPS6144445U (en) * 1984-08-28 1986-03-24 富士ゼロックス株式会社 Paper feed registration device for copying machines, etc.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886752A (en) * 1981-11-18 1983-05-24 Matsushita Electric Ind Co Ltd Mounting device for heating part
JPS6144445U (en) * 1984-08-28 1986-03-24 富士ゼロックス株式会社 Paper feed registration device for copying machines, etc.

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