JPS6017861Y2 - Coil parts mounting structure - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a coil component mounting structure in which a large number of coils are wound around a coil board made of a thermoplastic resin material and bent and shaped.

Conventionally, electronic devices such as televisions and radios have a large number of semiconductors such as transistors and diodes, circuit elements 3 such as resistive capacitors, etc. on a printed circuit board 2 surrounded and supported by a frame 1, as shown in FIG. Attunement wound around the core,
The oscillation coil 4 and the like are attached by soldering or the like.

By the way, these circuit elements 3 such as semiconductors, resistors, capacitors, etc. are solid and can be easily attached to the printed circuit board 2, and are almost automatically assembled.

However, the tuned oscillation coil 4 has an air core, and the insertion and soldering into the printed circuit board 2 is due to deformation of the coil during the process, so precision work is required for assembly and most of the work is done manually. There were productivity and quality problems.

Also, as a recent trend, electronic devices are becoming smaller, but when organizing and organizing a large number of electronic components on the printed circuit board 2, if they are placed too close together, the tuning/oscillation coils 4 will cause electromagnetic interference between the coils. Because they are linked by induction, it is difficult to organize them into a small area, which has been an obstacle to miniaturization.

Here, as a method for automatically inserting the air-core coil, as shown in FIG. 2, for example, the semiconductor shown in FIG.
A structure in which the circuit elements 3 such as resistors and capacitors and the tuned oscillation coil 4 are separated and incorporated onto the printed circuit board 2 is also conceivable.

That is, in this electronic device, a plurality of tuning coils 5 and oscillation coils 6 are wound around a coil board 8 provided with coil mounting terminals 7, and are arranged uniformly on a printed circuit board 2. This becomes easy because each coil 5 and 6 is wound on the coil board 8.

However, with this structure, mutual induction is likely to occur between the tuning coils 5 and between the oscillation coils 6, so it is necessary to provide sufficient spacing between the coils, and the coil board 8 is designed to be long.

Therefore, if the printed circuit board 2 is configured with each circuit element 3 and the tuned oscillation coil 4 separated, there are disadvantages such as the size increases and the work of adjusting the inductance of each coil becomes complicated.

The present invention has been proposed above, and provides a coil component mounting structure in which the distance between each coil is shortened as much as possible and the size of the printed circuit board is reduced.

The coil component mounting structure according to the present invention uses a coil board made of thermoplastic resin material, and after the coils constituting each circuit are wound, it is bent into an arbitrary shape. Describe.

FIG. 3 shows a coil component mounting structure 10 for an electronic device according to the present invention, in which a plurality of coils (three in the figure) 12a constituting each circuit of the electronic device are mounted on a coil board 11 made of a thermoplastic resin material. , 12b, 12c are wound.

Both ends of these coils are connected to coil boards 11, respectively.
The coil mounting terminal 13 is soldered to the coil mounting terminal 13 planted in the coil mounting terminal 13 .

Each coil 12a* 12b* of the coil board 11
The end portion 14 to which the end portion 12c is attached is formed of inner paper, and is bent into a U-shape at this portion so that the respective coils are orthogonal to each other.

As described above, in the coil component mounting structure 10 according to the present invention, since each coil is arranged orthogonally to each other, the electromagnetic induction between the coils is much smaller than that in a case where the coil components are arranged in series. This allows the structure to be made as small as possible.

To make the coil component mounting structure 10 having such a structure, first, a cylindrical coil board 11 made of a thermoplastic resin member as shown in FIG. 4 is used.

This board 11 has a wire interior 14 formed in the middle thereof that divides the board 11 into three parts, and coil terminal mounting holes 15 are provided in each of the divided parts.

Nail-shaped coil mounting terminals 1 are inserted into these mounting holes 15.
3 are fitted and caulked.

Next, as shown in FIG. 5, the coil board 11 with the coil mounting terminals attached is wound around each coil 12a using an automatic coil winding machine.
* 12by 12c is wound and each coil end is soldered to the coil mounting terminal.

And this coil winding and soldered coil hold 1
1, the wire interior 14 formed between each coil is heated to a softening temperature using a heating shaping machine and shaped into a U-shape, thereby obtaining a coil component mounting structure 10 as shown in FIG. 3.

Since the coil board 11 to be heated and shaped has the wire interior 14 formed in the portion to be bent, this portion can be locally heated and easily shaped.

FIG. 6 shows a three-dimensionally formed coil component mounting structure 15 according to another embodiment of the present invention.

This coil component mounting structure 15 is constructed by winding each coil 17a, 17b, 17c, 17d, and 17e around a cylindrical coil board 16 made of a thermoplastic resin material as in the above embodiment, and then winding each coil as shown in the figure. It is obtained by three-dimensionally bending the coils.

Since this mounting structure 15 has a three-dimensional structure, when it is inserted and mounted on a printed circuit board (not shown), the coil 1
Other electronic components can be mounted on the printed circuit board at the bottom of 7c, allowing consolidation of printed circuit boards.

As described above, the present invention involves winding a plurality of coils constituting each circuit component of an electronic device around a coil board made of thermoplastic resin material, and then heat forming the spaces between the coils in a flat or three-dimensional manner to attach the coil components. Since the structure is constructed, the work of inserting the printed circuit board can be greatly reduced compared to the conventional air-core coil.

Furthermore, by bending the coils and shaping them in a plane or three-dimensionally, the electromagnetic induction of the coils can be made as small as possible, which makes it possible to make printed circuit boards smaller and electronic devices more compact.

In this example, one coil was arranged on each side of the bent coil board, but it is not necessary to do so, and multiple coils to be connected to each other are arranged on the same side. If necessary, ferrite or the like having high magnetic permeability can be actively mixed into the thermoplastic resin material of the coil board.

[Brief explanation of drawings]

1 and 2 are perspective views illustrating how circuit elements are mounted in conventional electronic equipment, FIG. 3 is a perspective view of a coil component mounting structure according to the present invention, and FIGS. FIG. 6 is a perspective view of a part in the process of being manufactured, and FIG. 6 is a perspective view of a coil component mounting structure according to another embodiment of the present invention. 10.15... Coil parts mounting structure, 11,1
6------- ml board, 12at 12b
, 12c. 17a, 17b, 17c, 17d, 11e...
coil.

Claims (1)

[Scope of utility model registration request] A coil component mounting structure comprising a bent thermoplastic resin coil board and a coil wound around each bent portion of the coil board to constitute a plurality of coil circuit components.