JPS60176316A - Manufacture of ceramic resonator - Google Patents
Manufacture of ceramic resonatorInfo
- Publication number
- JPS60176316A JPS60176316A JP3157984A JP3157984A JPS60176316A JP S60176316 A JPS60176316 A JP S60176316A JP 3157984 A JP3157984 A JP 3157984A JP 3157984 A JP3157984 A JP 3157984A JP S60176316 A JPS60176316 A JP S60176316A
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- ceramic element
- piezoelectric ceramic
- insulating frame
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 3
- 239000002390 adhesive tape Substances 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1042—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a housing formed by a cavity in a resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1028—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being held between spring terminals
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は主として映像機器および音響機器等におけるフ
ィルターまたはマイクロコンピュータ−の基準信号とし
ての発振子として利用されるセラミック共振子の製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a ceramic resonator mainly used as a filter in video equipment, audio equipment, etc. or as an oscillator as a reference signal for a microcomputer.
従来例の４１″ｌｔ成きその間順点
セツミック共振子は・圧′ｆｔＬ子セラミック素子をバ
ネ性突起を有する７Ｍ極板で挾持し、これをケースに収
納した形で構成されている。かかるセラミック共振子の
従来より実施されている製造法を以下に図面を参照して
説明する〇第１図（局に従来のセラミック共振子の一部
切欠平面図を示し第１図（Ｂ）にその側面断１川図を示
す。第１図（Ｎおよび（Ｅ）において、１は機械的振動
をする圧電セラミック緊：ｆ−であり、その両凹に′Ｃ
ル極板２が配置鉦されており・圧電セラミック素子１は
′電極板２上に設けられたバネ↑１突起３で挾持されて
いる。上記電極板２の一部は外部接続用のリード２′と
なっている。４は上記圧電セラミック素子１および１１
Ｌ極板２を収納し、外装を兼ねたケースであり、５は圧
電セラミック米子１をケース４内に封入するためのｊＭ
脂封止利℃゛あり、６は上記樹脂封止材で封止するとき
樹脂力）内部即を圧′屯セラミック素子１へと流入する
のを防止する流入止めである。かかる従来のセラミック
共振子を製造するに当っては、ケース４を用意し、これ
にバネ性突起３を有する電極板２を、バネ性突起３が対
向するように挿入し、次に対接したバネ性突起３の間に
圧ｑｔセラミック素子１を押し込み挿入してＷｍしＣい
る。かかる方法−Ｃは圧′屯セラミック素ゴー１か彌く
相互に押し合って対接したバネ性突起３間に押し込まれ
るとき、傷付き易くまた欠損し易い。The conventional 41"lt single point setmic resonator is constructed by holding a 7M electrode plate having a spring projection and holding a pressure L element ceramic element in a case.Such ceramic The conventional manufacturing method of resonators will be explained below with reference to the drawings.〇Figure 1 (Figure 1 shows a partially cutaway plan view of a conventional ceramic resonator, and Figure 1 (B) shows its side view. A cross-sectional diagram is shown. In Figure 1 (N and (E), 1 is a mechanically vibrating piezoelectric ceramic member: f-, with 'C' in both concavities.
A electrode plate 2 is arranged and a piezoelectric ceramic element 1 is held between springs ↑1 and projections 3 provided on the electrode plate 2. A part of the electrode plate 2 serves as a lead 2' for external connection. 4 is the piezoelectric ceramic element 1 and 11
This is a case that houses the L electrode plate 2 and also serves as an exterior.
There is a resin sealing effect, and 6 is an inflow stop that prevents resin force from flowing into the pressure ceramic element 1 when sealing with the resin sealing material. In manufacturing such a conventional ceramic resonator, a case 4 is prepared, and an electrode plate 2 having spring projections 3 is inserted into the case so that the spring projections 3 face each other. The pressure qt ceramic element 1 is pushed and inserted between the spring projections 3 and then pressed. In this method-C, when the pressed ceramic raw material 1 is pushed between the spring projections 3 that press against each other and are opposed to each other, it is easily damaged or broken.
また樹脂封止材５−Ｃ′封止するとき、流入止め６を設
けても流入止め６とケース４または１ｌａｑ板２との僅
かな間隙から樹脂封止材が流入することがあり、これが
圧電上ラミック素子１に句着する結果をもたらすことが
ある。上述した如き圧電セラミック素子１の損傷発生お
よび／または樹脂封止材の（ＸＪ着は、圧電セラミック
禦子１の振動を抑圧したり、変動せしめて必要な特性か
得られないセラミック共振子としてしまう欠点を有して
いた。Furthermore, when sealing the resin sealant 5-C', even if an inflow stopper 6 is provided, the resin sealant may flow in through a small gap between the inflow stopper 6 and the case 4 or the 1 1/2-acre board 2, and this may cause the piezoelectric This may result in damage to the upper ramic element 1. Damage to the piezoelectric ceramic element 1 as described above and/or XJ adhesion of the resin sealing material may suppress or fluctuate the vibrations of the piezoelectric ceramic element 1, resulting in a ceramic resonator that does not have the required characteristics. It had drawbacks.
発明の１］的
本発明は上述した便来のセラミック共振子の製造法の欠
点を解決し、簡単に製造できるセラミック共振子の製造
方法を提供することにある。SUMMARY OF THE INVENTION The object of the present invention is to solve the above-mentioned drawbacks of the conventional ceramic resonator manufacturing method and to provide a method of manufacturing a ceramic resonator that can be easily manufactured.
発明の構成
本発明は圧′屯セラミック集子を押入した絶縁性枠をバ
ネ性突−起を有する電極板−Ｃ挾持し、かつη丁、極板
を上記枠に接着固定し、次い゛Ｃ樹脂で上記電極板の電
極リード部を除いて封入成形することによるセラミック
共振子の製造方法にある。Structure of the Invention The present invention comprises an insulating frame in which a pressure-sensitive ceramic aggregate is pressed, which is sandwiched between an electrode plate-C having spring projections, and an electrode plate is adhesively fixed to the frame. The present invention provides a method of manufacturing a ceramic resonator by encapsulating and molding the electrode plate with C resin except for the electrode lead portions of the electrode plate.
上記圧電セラミック素子およびバネ性突起を有する電極
板は従来よりセラミック共振子の製造に使用されている
ものを使用−（きる。As the piezoelectric ceramic element and the electrode plate having spring projections, those conventionally used in the manufacture of ceramic resonators can be used.
本発明で使用する上記絶縁性枠としては任意の電気絶縁
性材料、例えは水利、樹脂例えはエポキシ樹脂を用いて
作ることか一部きる。また封入成形する樹脂としてはエ
ポキシ１財脂を使用するとよい。The insulating frame used in the present invention may be made of any electrically insulating material, such as water or resin, such as epoxy resin. Furthermore, it is preferable to use epoxy 1 resin as the resin for encapsulation molding.
実施例の説明 以下に本発明の一実施例を図囲を参照して説明する。Description of examples An embodiment of the present invention will be described below with reference to the drawings.
第２図は本発明により製造されるセラミック共振子の各
構成部分を示す分解説明図であり、第３図（蜀は本発明
方法により製造されたセラミック共振子の平面図であり
、第３図ＣＢ）はその側面断面図である。FIG. 2 is an exploded explanatory view showing each component of the ceramic resonator manufactured by the method of the present invention, and FIG. CB) is a side sectional view thereof.
第２図および第３図（Ｅ）に示す如く、電極板リ一１２
′を有し、中央にバネ性突起３を有する一つの１ル極＋
Ｒ２を用意し、このバネ性突起３をイアする電神（板２
Ｋ、予め接・ｈ剤または画面接層テープ７を両側に１寸
）Ｈさせた絶縁１ｙｙ伜８を接着１−ソ１定し、次に（
′８：消固足した上記１廂縁性忰８内に圧′屯セラミッ
ク素子１を挿入する。次にもう一つの上記７［１枳仮２
と同じ電極板２をその中央に有するバネ性突起３が圧電
セラミック索子１に対接するようにかぶせ、絶縁性枠８
に接層固定する。As shown in FIGS. 2 and 3(E), the electrode plate 12
’ with a spring-like protrusion 3 in the center
Prepare R2 and use the electric god (board 2) to ear this spring protrusion 3.
K, Glue the insulation 1yy ＼ 8 with adhesive or screen adhesive tape 7 (1 inch) on both sides in advance, and then (
'8: Insert the pressure ceramic element 1 into the one-sided frame 8 which has been solidified. Next, the other above 7 [1
The spring protrusion 3 having the same electrode plate 2 at its center is placed over the piezoelectric ceramic cord 1 so that it is in contact with the insulating frame 8.
Fix it in contact with the
かくして組立てた全体を電極板リード２′を残して樹脂
９で封入成形する（第３１図（Ａ）および（Ｅ） なｎ
（イ）
上述した実施例においては圧電セラミック素子１、電極
板２、および絶縁性枠８は正方形で示したか、これらは
必すしも正方形−（ある必要はなく、所望により他の杉
、例えは円形、方形その他のＪｓとすることかできる。The entire assembly thus assembled is sealed and molded with resin 9, leaving the electrode plate leads 2' (see FIGS. 31(A) and 31(E)).
(a) In the above-described embodiment, the piezoelectric ceramic element 1, the electrode plate 2, and the insulating frame 8 are shown as squares. It can be circular, square or other Js.
発明の効果
上述した如く本発明の方法によれは、′１狂極板、絶縁
性枠１圧電セラミツク素子、および電極板と順次棲み重
ねることによって作ることができるの−Ｃ１先に述べた
従来の方法によける吐１１セラミック菓子の場、欠損烙
のｊｏ生か完全に防止でき、かつ簡単に組立てることか
−（きる。また絶縁性枠に各電極板を接＞ｉ同定しであ
るので最後に全ドを樹脂で封入成形するとき、この樹脂
か内部、即ち枠内に流入し、圧電セラミック集子に刺着
し、特性劣化をもたらすことがない。Effects of the Invention As described above, according to the method of the present invention, the electrode plate can be manufactured by sequentially stacking the polar plate (1), the insulating frame (1), the piezoelectric ceramic element, and the electrode plate. According to the method, in the case of 11 ceramic confectionery, it is possible to completely prevent the loss of heat, and it is easy to assemble.In addition, each electrode plate is connected to the insulating frame, and the identification is completed. When the entire board is encapsulated and molded with resin, the resin does not flow into the interior, that is, into the frame, stick to the piezoelectric ceramic collector, and cause characteristic deterioration.
多・１図（Ａ）は従来のセラミック共振子の一部切欠平
面図１あり、第１図（Ｂ）はその側面断１６１図であり
・り１２図は本発明により製造されるセラミック共振子
の各６寸成部分を示す分解説明図−Ｃあり、第３図（Ａ
）は本発明により製造されたセラミック共振子の平面図
であり、第３図（Ｂ）はその側面断聞図である。
■は庄゛屯セラミック素子、２は電極板、３はバネ性突
起、７は接着剤、８は絶縁性枠、９は封入成形樹脂。
特許出願人 松下電器産業株式会社
第１図
ム
（Ａ） （Ｂ）
第３図
（Ａ） （Ｂ）
手続補正書（白・）（’ｉ）
昭和５９年１０月 ５日
］・ 事件の表示 昭イ：Ｌ］ ５９年特ｆ’＋’ｌげ
１第３１５７９号２、うＣ３明の名称
セラミック共撮子の製造方法
３、補正をする者
事件との関係 ！ｂ’＋信出加入
出加入豚唐ｑ妬
４、代理人
５、補正の対象
６、 ｌ’＋ｌｉ正の山谷
（１）明細４弟１は第１６行「圧霜、子セラミック素Ｐ
」を「圧市、セラミック零子」とＫＪ正する。
第２頁第１３行Ｕ内部１ｉ１Ｊを」を「内部ｊ！ＩＪち
ＪとｇＪ正する。
以 上Figure 1 (A) is a partially cutaway plan view of a conventional ceramic resonator, Figure 1 (B) is a side cross-sectional view of the same, and Figure 12 is a ceramic resonator manufactured according to the present invention. There is an exploded explanatory diagram showing each 6-dimensional part of -C, and Fig. 3 (A
) is a plan view of a ceramic resonator manufactured according to the present invention, and FIG. 3(B) is a side cross-sectional view thereof. ① is a Zhuangtun ceramic element, 2 is an electrode plate, 3 is a spring projection, 7 is an adhesive, 8 is an insulating frame, and 9 is an encapsulated molded resin. Patent applicant Matsushita Electric Industrial Co., Ltd. Figure 1 (A) (B) Figure 3 (A) (B) Procedural amendment (white) ('i) October 5, 1980] / Indication of the case Showi: L] 1959 special f'+'lage 1 No. 31579 2, name of U C3 Akira Ceramic co-photograph manufacturing method 3, relationship with the case of the person making corrections! b' + input/output participation pig tang q jealousy 4, agent 5, correction target 6, l' + li positive mountain valley (1) specification 4 younger brother 1 is line 16 ``press frost, child ceramic element P
” is corrected by KJ as “press city, ceramic Reiko.” Page 2, line 13, U internal 1i1J” is corrected as “internal j!IJchiJ and gJ.”
Claims (1)
を有する′電極板で挾持し、かつ電極板を上記枠に接着
同定し、次い℃樹脂て上記電極板の電極リード部を除い
て封入成形することを特徴とするセラミック共振子の製
造方法。1. The insulating frame into which the piezoelectric ceramic element has been inserted is held between two electrode plates having spring projections, and the electrode plate is glued to the frame. Next, the electrode plate is sealed with resin at ℃ except for the electrode lead part. A method for manufacturing a ceramic resonator, characterized by molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3157984A JPS60176316A (en) | 1984-02-22 | 1984-02-22 | Manufacture of ceramic resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3157984A JPS60176316A (en) | 1984-02-22 | 1984-02-22 | Manufacture of ceramic resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60176316A true JPS60176316A (en) | 1985-09-10 |
Family
ID=12335091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3157984A Pending JPS60176316A (en) | 1984-02-22 | 1984-02-22 | Manufacture of ceramic resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60176316A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109967330A (en) * | 2018-12-27 | 2019-07-05 | 无锡市宇超电子有限公司 | A kind of ultrasonic transduction device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5021389U (en) * | 1973-06-15 | 1975-03-11 | ||
| JPS5857114B2 (en) * | 1976-06-23 | 1983-12-19 | 株式会社リコー | magnetic brush developing device |
-
1984
- 1984-02-22 JP JP3157984A patent/JPS60176316A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5021389U (en) * | 1973-06-15 | 1975-03-11 | ||
| JPS5857114B2 (en) * | 1976-06-23 | 1983-12-19 | 株式会社リコー | magnetic brush developing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109967330A (en) * | 2018-12-27 | 2019-07-05 | 无锡市宇超电子有限公司 | A kind of ultrasonic transduction device |
| CN109967330B (en) * | 2018-12-27 | 2023-11-28 | 无锡市宇超电子有限公司 | Ultrasonic transduction device |
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