JPS60173742A - Production for information recording substrate - Google Patents
Production for information recording substrateInfo
- Publication number
- JPS60173742A JPS60173742A JP59029725A JP2972584A JPS60173742A JP S60173742 A JPS60173742 A JP S60173742A JP 59029725 A JP59029725 A JP 59029725A JP 2972584 A JP2972584 A JP 2972584A JP S60173742 A JPS60173742 A JP S60173742A
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- substrates
- substrate
- information recording
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 125000006850 spacer group Chemical group 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000002093 peripheral effect Effects 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000005304 joining Methods 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 3
- 229920003023 plastic Polymers 0.000 abstract description 2
- 230000004927 fusion Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
- B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D17/00—Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
- B29D17/005—Producing optically read record carriers, e.g. optical discs
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/0014—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture record carriers not specifically of filamentary or web form
- G11B23/0021—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture record carriers not specifically of filamentary or web form discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、例えばレーザ光等の光を集束することによっ
て情報の書き込み、読み出しが行われる情報記録基板の
製造方法に関し、特にエアーサンドイッチ型ディスクの
製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an information recording substrate on which information is written and read by focusing light such as a laser beam, and particularly relates to a method for manufacturing an air sandwich type disk. .
一般に光ビデオディスクや光メモリなどに用いられる円
盤状の情報記録基板は、通常８１図に示すような構造を
なしている。すなわち光信号を透過するために、例えは
アクリル樹脂やポリカーボネート等の透明なプラスチッ
ク基板１及び１′の表面に薄膜の記録媒体２及び２′が
塗布され、該記録媒体２及び２′が互いに対向するよう
に２枚の基板１及び１′を上下にし、両面の内周縁部３
と外周線部４が中央部５よシ突出した一体構造のスペー
サ６を介して接合する。この際記録媒体２及び２′と前
記スペーサ６の中央部５との間には中空層７及び７′が
形成されている。A disk-shaped information recording substrate generally used for optical video disks, optical memories, etc. usually has a structure as shown in FIG. 81. That is, in order to transmit optical signals, thin film recording media 2 and 2' are coated on the surfaces of transparent plastic substrates 1 and 1' made of, for example, acrylic resin or polycarbonate, and the recording media 2 and 2' are placed facing each other. Place the two substrates 1 and 1' up and down so that the inner peripheral edges 3 of both sides
and the outer circumferential line portion 4 are joined via a spacer 6 of an integral structure that protrudes from the center portion 5. At this time, hollow layers 7 and 7' are formed between the recording media 2 and 2' and the center portion 5 of the spacer 6.
従来このような一体構造のスペーサを介するエアーサン
ドインチ構造の情報記録基板の接合方法に関しては、常
温硬化型、熱硬化型、ＵＶ硬化型等の接着剤を用いて貼
合せる方法が一般的である。Conventionally, the common method for bonding information recording substrates with an air sandwich structure through such an integral spacer is to use a room temperature curing type, a thermosetting type adhesive, a UV curing type adhesive, etc. .
しかしながらこのような接着剤を使用するということは
、基板やスペーサへの塗布及び接合硬化までに多大な工
数を要するばがシ小、硬化時に必要な熱や、硬化時に発
生するガスに含まれた溶剤が、ディスク基板や、基板に
塗布された記録媒体２及び２′の劣化をまねくというよ
うな問題があった。又接着むらによる情報記録基板の不
釣）合いの発生や基板内・外周縁部外への接着剤の溢れ
による外観上美観を損なう等の欠点も多い。However, using such an adhesive requires a lot of man-hours to apply it to the substrate or spacer and cure the bond, and the heat required during curing and the amount of gas contained in the gas generated during curing are small. There was a problem in that the solvent caused deterioration of the disk substrate and the recording media 2 and 2' coated on the substrate. In addition, there are many drawbacks such as imbalance of the information recording substrate due to uneven adhesion and loss of aesthetic appearance due to adhesive overflowing into the substrate and outside the outer periphery.
さらに接着剤による基板とスペーサ間の接着層は、数十
〜数百ミクロンの厚さになるが、硬化した接着層には無
数のピンホールが存在し、材質的には疎の状態となって
いるため、完全な気密が得られない欠点がある。Furthermore, the adhesive layer between the substrate and spacer made of adhesive is several tens to hundreds of microns thick, but the cured adhesive layer has countless pinholes and is sparse in terms of material. Because of this, it has the disadvantage that complete airtightness cannot be achieved.
接着層にピンホールがあると、情報記録基板の中空層７
及び７′に外部がら空気や塵埃が侵入して結紐したシ、
読み書きの透過光に対する吸収や散乱を生じたシ、記録
媒体２及び２′にキズや化学反応を生じたシして、性能
を低下させる原因となる場合が多い。If there is a pinhole in the adhesive layer, the hollow layer 7 of the information recording substrate
and 7' is tied due to air or dust entering from the outside,
Absorption and scattering of transmitted light during reading and writing often occurs, and scratches and chemical reactions occur on the recording media 2 and 2', resulting in a decrease in performance.
本発明の目的は、かかる欠点を除去するためにスペーサ
及び基板の接合面に環状の凸凹はめ合い部を設け、超音
波溶着法にょ多接合を行うことによ）、気密性に優れ、
接合力の強固でしかも接合時間が極めて短かい情報記録
基板の製造方法を提供するものである。An object of the present invention is to eliminate such drawbacks by providing an annular convex-concave fitting part on the joint surfaces of the spacer and the substrate, and performing multiple joints using ultrasonic welding, thereby achieving excellent airtightness.
The present invention provides a method for manufacturing an information recording substrate that has a strong bonding force and an extremely short bonding time.
以下に図面を参照しながら本発明の実施例について詳細
に説明する。Embodiments of the present invention will be described in detail below with reference to the drawings.
第２図は本発明の超音波溶着法を用いて行う、情報記録
基板の製造方法の一実施例を示す断面図でアシ、透明な
プラスチック基板（例えばアクリル樹脂や、ポリカーボ
ネート等）８”及δ８・の表面に薄膜記録媒体９及び９
′が塗布されている。FIG. 2 is a cross-sectional view showing an embodiment of the method for manufacturing an information recording substrate using the ultrasonic welding method of the present invention.・Thin film recording media 9 and 9 on the surface of
' is applied.
基板８及び８′の間にはスペーサ１ｏが挾持され、それ
ぞれの接合面である内周縁部１１と外周縁部１２の中央
部分は例えば基板８及び８′側には矩形状の環状溝１３
及び１３′が、スペーサ１０側両面には矩形状の環状堤
１４及び１４′がゆるいはめ合い状態で合致している。A spacer 1o is sandwiched between the substrates 8 and 8', and a rectangular annular groove 13 is formed at the center of the inner peripheral edge 11 and the outer peripheral edge 12, which are the joint surfaces of the substrates 8 and 8', for example.
and 13', and rectangular annular banks 14 and 14' are loosely fitted on both surfaces of the spacer 10 side.
、基本的にこのような構造の情報記録基板は基台１５に
固定した後上部から超音波溶着機（図示せず）のホーン
１６が押し付けられる。Basically, after an information recording board having such a structure is fixed to a base 15, a horn 16 of an ultrasonic welding machine (not shown) is pressed from above.
第３図及び第４図は、第３図における接合面部の構造を
詳細に示した部分断面図である。3 and 4 are partial cross-sectional views showing in detail the structure of the joint surface portion in FIG. 3. FIG.
第３図はスペーサ１７と基板１８及び１８’の外周縁部
１９の接合面を示す断面図で、スペーサ１７の両面に設
けられた環状堤２０の中央部分にそれぞれ三角形状の環
状突起２１が射出成形によシ容易に成形されておシ、基
板１８及び１８′側に設けられた環状韓２２内中央底部
と接触している。FIG. 3 is a cross-sectional view showing the bonding surface between the spacer 17 and the outer peripheral edge 19 of the substrates 18 and 18', in which a triangular annular projection 21 is injected into the center of an annular bank 20 provided on both sides of the spacer 17. It is easily formed by molding and is in contact with the center bottom of the annular ring 22 provided on the sides of the substrates 18 and 18'.
第４図は、第３図同様外周縁部２３の接合面を示す断面
図で基板２４及び２４′に設けられた環状溝２５の構成
部の両コーナ部分が斜面形状部２６に形成され、スペー
サ２７の両面に設けられた狽状堤２８と接触している。FIG. 4 is a cross-sectional view showing the joint surface of the outer peripheral edge portion 23 similar to FIG. It is in contact with the cage-like embankments 28 provided on both sides of 27.
以上の構造を有する基板及びスペーサによ多情報記録基
板を製造する場合、第２図に示す様にセットされた後、
ホーン１６によシ加圧され超音波を発振し溶着する。そ
の際第３図に示すような環状朶起２１や第４図に示す環
状溝２５の斜面形状部２６に摩擦熱が集中し、突起２１
や斜向形状部２６が溶けることによシ基板とスペーサと
の接合が可能となる。When manufacturing a multi-information recording substrate using the substrate and spacer having the above structure, after setting it as shown in Fig. 2,
Pressure is applied by the horn 16 to generate ultrasonic waves and weld. At this time, frictional heat is concentrated on the annular shank 21 as shown in FIG. 3 and the sloped portion 26 of the annular groove 25 as shown in FIG.
By melting the diagonal shaped portion 26, it becomes possible to join the substrate and the spacer.
その結果構造的には、接合方法が異なるのみで第１図と
同様となる。As a result, the structure is the same as that shown in FIG. 1, except for the joining method.
さらに本実施例の如く接合面に凹凸のはめ合い部を設け
ることによシ、浴融した接合層が鉾の中に溜って外に溢
れないため、溶着層への抑圧が可能となシ、接着層に発
生したピンホールを押しつぶしてしまうため、材質的に
は密の状態となシ、完全気密が得られる。Furthermore, by providing an uneven fitting part on the joint surface as in this embodiment, the bath-melted joining layer does not accumulate inside the frame and overflow to the outside, so it is possible to suppress the welding layer. Since the pinholes that occur in the adhesive layer are crushed, the material is in a tight state, resulting in complete airtightness.
この際溶着部分の厚みや面積は、接合面に形成された凹
凸のはめ合い部や、突起２１や治面形状部２６の大きさ
及びホーン１６の振幅や加圧力の増減によシ自・在にコ
ントロールすることができるため、接着ムラのない均一
な厚さの接合層と完全気密の両方が得られる。At this time, the thickness and area of the welded portion can be varied depending on the fit of the unevenness formed on the joint surface, the size of the protrusion 21 and the surface-shaped portion 26, and the amplitude and pressure of the horn 16. This allows for both a uniformly thick bonding layer with no uneven adhesion and complete airtightness.
尚以上説明したような基板とスペーサの凹凸のはめ合い
部は第５図に示すように基板２９及び２９′の接合面部
に環状堤３０及び３１’を、スペーサ３１の接合面部に
環状溝３２及び３２′を設けてもよく、その場合の効果
は前記と同様である。As shown in FIG. 5, the fitting portion of the irregularities between the substrate and the spacer as described above is formed by forming annular ridges 30 and 31' on the bonding surface of the substrates 29 and 29', and an annular groove 32 and a groove on the bonding surface of the spacer 31. 32' may be provided, and the effect in that case is the same as described above.
尚記録層として９及び９′のを用いた２面記録の可能な
情報記録基板について説明したが、９及び９′のいずれ
か一方のみを有するものであっても良いことはいうまで
もない。Although an information recording substrate capable of two-sided recording using layers 9 and 9' as the recording layer has been described, it goes without saying that it may have only one of layers 9 and 9'.
以上説明した如く本発明の情報記録基板の製造方法によ
れば、記録媒体を有する２枚の基板をスペーサを介して
接合する製造方法において、スベ、ｆまたは基板接合面
に凹凸状のはめ合い部を設けその中で超音波溶着を行う
ことにより、ピンホールのない完全気密の接着層が得ら
れる。その結果、接着剤を使用した時の接着層に比べ、
ピンホールの原因によ多発生していた結露や媒体劣化等
の防止が計れる。As explained above, according to the method for manufacturing an information recording substrate of the present invention, in the manufacturing method in which two substrates each having a recording medium are bonded via a spacer, a mating portion having an uneven shape on the surface, f, or bonding surface of the substrates is provided. By providing an adhesive layer and performing ultrasonic welding therein, a completely airtight adhesive layer without pinholes can be obtained. As a result, compared to the adhesive layer when using adhesive,
This prevents dew condensation and media deterioration, which often occur due to pinholes.
さらに従来の問題点であった接着層のはみ出しによる記
録媒体の劣化や外観上の問題が解消されるため、エアー
サンドイッチ型情報記録基板の製造方法にとって極めて
効果がある。Furthermore, since the conventional problems of deterioration of the recording medium and appearance problems caused by the protrusion of the adhesive layer are eliminated, this method is extremely effective for the manufacturing method of air sandwich type information recording substrates.
第１図は従来の情報記録基板の一例の断面図、第２図は
本発明の一実施例を説明するための図であ夛、第３図お
よび第４図は第３図における部分詳細断面図、第５図は
基板とスペーサの凹凸のはめ合い部を説明するための図
である。
図において、１．１’ 、８．８’ 、１８．１８’
、２４゜２４′及び２９．２９’は基板、２．２′及び
９．９′は記録媒体、３，１１．１９及び２３は内周縁
部、４及び１２は外周縁部、５は中央部、６，１０，１
７．２７３０’？′ｉ壊状堤、７及び７′は中空層、１
５は基台、１６はホーン、２１は突起、２６は斜面形状
部である。
第 １図
第 ２図
第３図 第４図
招、５図Fig. 1 is a cross-sectional view of an example of a conventional information recording substrate, Fig. 2 is a diagram for explaining an embodiment of the present invention, and Figs. 3 and 4 are partial detailed cross-sections of Fig. 3. FIG. 5 is a diagram for explaining the fitting portion of the unevenness of the substrate and the spacer. In the figure, 1.1', 8.8', 18.18'
, 24° 24' and 29.29' are the substrates, 2.2' and 9.9' are the recording medium, 3, 11.19 and 23 are the inner peripheral edges, 4 and 12 are the outer peripheral edges, and 5 is the center part. ,6,10,1
7.2730'? 'i broken bank, 7 and 7' are hollow layers, 1
5 is a base, 16 is a horn, 21 is a protrusion, and 26 is a sloped portion. Figure 1 Figure 2 Figure 3 Figure 4 Invitation, Figure 5
Claims (1)
記録面を有するディスク基板の内周及び外周縁部を一体
構造のスペーサを介して両方平行に貼合せたエアーサン
ドイッチ構造の情報記録基板の製造方法において、前記
ディスク基板または前記スペーサの面のいずれか一方の
貼合せ部に譲状の溝を形成し、他方の貼合せ部には該環
状溝に合致し、中央部に環状突起を設けた環状構を形成
し、前記スペーサと前記ディスク基板とを超音波浴着法
によシ、完全気密状態に接合することを特徴とする情報
記録基板の製造方法。 ２、ディスク基板及びスペーサの面のいずれか一方の貼
合せ部に矩形の環状構を形成し、他方の貼合せ部には該
環状構に合致し纒底部のコーナーが斜面形状をなしてい
る環状溝を形成して接合する特許請求の範囲第１項記載
の情報記録基板の製造方法。[Claims] 1. Information on an air sandwich structure in which the inner and outer edges of a disk substrate having a recording surface on which information is written and read by light are bonded together in parallel via an integrated spacer. In the method for manufacturing a recording substrate, a concession-shaped groove is formed in the bonded portion of either the disk substrate or the spacer surface, and a circular groove is formed in the center portion of the bonded portion of the other bonded portion to match the annular groove. 1. A method of manufacturing an information recording substrate, characterized in that an annular structure having projections is formed, and the spacer and the disk substrate are bonded in a completely airtight state by an ultrasonic bath bonding method. 2. A rectangular annular structure is formed on one of the bonded parts of the disk substrate and the spacer surface, and a rectangular annular structure is formed on the other bonded part, and the corners of the bottom of the thread are sloped in shape and match the annular structure. The method for manufacturing an information recording substrate according to claim 1, wherein grooves are formed and bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59029725A JPS60173742A (en) | 1984-02-20 | 1984-02-20 | Production for information recording substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59029725A JPS60173742A (en) | 1984-02-20 | 1984-02-20 | Production for information recording substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60173742A true JPS60173742A (en) | 1985-09-07 |
Family
ID=12284081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59029725A Pending JPS60173742A (en) | 1984-02-20 | 1984-02-20 | Production for information recording substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60173742A (en) |
-
1984
- 1984-02-20 JP JP59029725A patent/JPS60173742A/en active Pending
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