JPS60167396A - Method of coating paste material on inner wall of through hole - Google Patents
Method of coating paste material on inner wall of through holeInfo
- Publication number
- JPS60167396A JPS60167396A JP59022521A JP2252184A JPS60167396A JP S60167396 A JPS60167396 A JP S60167396A JP 59022521 A JP59022521 A JP 59022521A JP 2252184 A JP2252184 A JP 2252184A JP S60167396 A JPS60167396 A JP S60167396A
- Authority
- JP
- Japan
- Prior art keywords
- paste material
- hole
- paste
- wall
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（発明の属する技術分野）
本発明はスルーホール内壁へのペースト材料の塗布方法
、詳しくはセラミック基板（以下基板という）、セラミ
ックグリーンシート（以下シートという）等に形成され
ているスルーホールの内壁に導電ペースト、絶縁ペース
ト等のペースト材料を均一に塗布する方法に関するもの
である。[Detailed Description of the Invention] (Technical Field to which the Invention Pertains) The present invention relates to a method for applying a paste material to the inner wall of a through hole, and more specifically, a method for applying a paste material to the inner wall of a through hole, and more specifically, a method for applying a paste material to the inner wall of a through hole. The present invention relates to a method for uniformly applying a paste material such as a conductive paste or an insulating paste to the inner wall of a through hole.
（従来技術とその問題点）
基板又はシートのスルーホールの内壁にペースト材料を
塗布する方法として、従来は第１図に示す如くスクリー
ンマスク３上にペースト材料１を一定厚さに塗布した後
、これを基板４表面に接触させ、基板４裏面からスルー
ホール２内を吸引機６で吸引し、スクリーンマスク３の
開孔部を通じペースト材料１をスルーホール２内に流入
させ。(Prior art and its problems) Conventionally, as a method for applying a paste material to the inner wall of a through hole in a substrate or sheet, as shown in FIG. 1, a paste material 1 is applied to a constant thickness on a screen mask 3, and then This is brought into contact with the surface of the substrate 4, and the inside of the through hole 2 is suctioned from the back surface of the substrate 4 by the suction device 6, and the paste material 1 is caused to flow into the through hole 2 through the opening of the screen mask 3.
さらに吸引することによりスルーホール２外に流出させ
る方法を用いていた。なお第１図において５は吸引治具
である。しかしこの方法ではペースト材料１が塗布され
ない部分が残ったり、ペースト材料１の塗布厚さがばら
ついたり、ペースト材料が全く吸引されずスルーホール
２表面に被膜を形成したりするなどの問題が発生してい
た。この原因は各スルーホール内の吸引力を同一に制御
できない事にある。Furthermore, a method was used in which the liquid was caused to flow out of the through hole 2 by suction. Note that in FIG. 1, 5 is a suction jig. However, with this method, problems occur such as the paste material 1 remaining uncoated, the thickness of the paste material 1 being applied varies, and the paste material not being sucked in at all and forming a film on the surface of the through hole 2. was. The reason for this is that the suction force in each through hole cannot be controlled equally.
（発明の目的）
本発明はこのような問題点のないスルーホール内壁への
ペースト材料の塗布方法を提供することを目的とするも
のである。(Object of the Invention) It is an object of the present invention to provide a method for applying a paste material to the inner wall of a through-hole without such problems.
（問題点を解決するだめの手段）
本発明者らはペースト材料を吸引する際の各スルーホー
ル内の吸引力を制御する方法について種々研究を重ねた
結果、スクリーンマスク上にペースト材料を一定厚さに
塗布し、これを基板又はシート上に接触させ、基板又は
シートの裏面からスルーホール内を吸引する際いったん
基板又はシートを密閉し、スルーホール内及びペースト
材料塗布面側をｌ Ｑ ｔｏｒｒ以下兼以下列して減圧
し、この後ペースト材料塗布面側を常圧に開放すること
により、ペースト材料をスルーホール内壁全面に均一な
厚さで塗布することができることを見い出した。(Means to Solve the Problem) The inventors of the present invention have repeatedly conducted various studies on methods of controlling the suction force in each through hole when sucking paste material, and as a result, they have found that paste material is applied to a screen mask with a constant thickness. Apply this to the substrate or sheet, and when suctioning the inside of the through-hole from the back side of the substrate or sheet, once seal the substrate or sheet, and keep the inside of the through-hole and the side where the paste material is applied below 1 Q torr. It has been found that the paste material can be applied to the entire inner wall of the through-hole to a uniform thickness by reducing the pressure in both rows and then releasing the paste material application side to normal pressure.
（発明の構成）
本発明はスルーホールを有する基板又はシート上にスク
リーンマスクを載置し、このスクリーンマスク上にペー
スト材料を塗布し、ついでスルーホール内及びペースト
材料塗布面側をｌ Ｑ ｔｏｒｒ以下に減圧した後ペー
スト材料塗布面側を常圧に開放するスルーホール内壁へ
のペースト材料の塗布方法に関する。(Structure of the Invention) The present invention involves placing a screen mask on a substrate or sheet having through holes, applying a paste material on the screen mask, and then applying a paste material inside the through holes and on the side to which the paste material is applied at a temperature below lQ torr. The present invention relates to a method of applying a paste material to the inner wall of a through-hole, in which the pressure is reduced to a normal pressure, and then the paste material application surface side is opened to normal pressure.
（数値限定の理由）
なお本発明においてペースト材料をスルーホール内壁に
塗布する際いったん基板又はシートを密閉し、スルーホ
ール内及びペースト材料塗布面側を１Ｑｔｏｒｒ以下に
減圧することが必要であり、１０ｔｏｒｒより高い圧力
では減圧後ペースト材料塗布面側を急激に開放すること
により得られる吸引力が小さく第２図〜第４図に示す問
題が発生する。(Reason for numerical limitation) In the present invention, when applying the paste material to the inner wall of the through-hole, it is necessary to seal the substrate or sheet once and reduce the pressure inside the through-hole and on the side where the paste material is applied to 1 Qtorr or less. At higher pressures, the suction force obtained by rapidly opening the paste material application side after depressurization is small, resulting in the problems shown in FIGS. 2 to 4.
（材料例及び好ましい粘度の割合）
本発明におけるペースト材料としては特に制限はなく１
例えば導電ペースト、絶縁ペースト等が用いられる。ペ
ースト材料の粘度は測定温度１５〜２５℃においてすり
速度４／秒のとき１０００Ｐｓ以下であることが好まし
い。(Examples of materials and preferred viscosity ratio) There are no particular restrictions on the paste material in the present invention.
For example, conductive paste, insulating paste, etc. are used. The viscosity of the paste material is preferably 1000 Ps or less at a measurement temperature of 15 to 25° C. and a sliding speed of 4/sec.
（実施例） 以下実施例により本発明を説明する。(Example) The present invention will be explained below with reference to Examples.
実施例１
平均粒径１．７〜２．０μｍのタングステン粉末（東京
タングステン製、商品名Ｂ−３０＞８０重量部及び平均
粒径０．４〜０．５μｍのタングステン粉末（東京タン
グスデン製、商品名Ａ−２０）２０重量部に有機バイン
ダとしてニトロセルロース（態化成製、商品名ＨＩＧ−
１２０）を３重量部及び有機溶剤としてブチルカルピト
ール（和光純薬製、試薬−級）を２０重量部添加し、こ
れをらいかい機で１０時間混合してタングステンペース
トを得た。このようにして得たタングステンペーストを
厚さ０．４ｍｍのシートに形成した直径１．１５鵬のス
ルーホール１００個に側面塗布した。塗布方法を第５図
に示す。最初に吸引治具５上にシート１０を七ツトシ、
この後スクリーンマスク３上に上記で得たタングステン
ペースト９を厚さ２００μｍＫ塗布し、スクリーンマス
クをシート表面に接触させ１次いでコック８をとじ、吸
引機６により容器７内を吸引した。約３０秒間吸引し、
スルーホール内及びタングステンペースト塗布面側の圧
力がｌ Ｑ ｔｏｒｒ以下になった後コック８を開き。Example 1 Tungsten powder with an average particle size of 1.7 to 2.0 μm (manufactured by Tokyo Tungsten Co., Ltd., trade name B-30>80 parts by weight) and tungsten powder with an average particle size of 0.4 to 0.5 μm (manufactured by Tokyo Tungsten Co., Ltd., product name 20 parts by weight of A-20) and nitrocellulose (manufactured by Seikasei Co., Ltd., trade name HIG-
120) and 20 parts by weight of butylcarpitol (manufactured by Wako Pure Chemical Industries, Ltd., reagent grade) as an organic solvent were added, and the mixture was mixed for 10 hours using a sieve machine to obtain a tungsten paste. The tungsten paste thus obtained was coated on the side surface of 100 through holes each having a diameter of 1.15 mm formed in a sheet having a thickness of 0.4 mm. The coating method is shown in FIG. First, place the sheet 10 on the suction jig 5 seven times,
Thereafter, the tungsten paste 9 obtained above was applied to a thickness of 200 μm on the screen mask 3, the screen mask was brought into contact with the sheet surface, the cock 8 was then closed, and the inside of the container 7 was suctioned by the suction device 6. Suction for about 30 seconds,
After the pressure inside the through-hole and on the side where the tungsten paste is applied becomes less than lQ torr, open the cock 8.
タングステンペースト塗布面側を急激に常圧にもどした
。この結果、第６図に示す如くシートに形成されたスル
ーホール１００個全てに厚さ５μｒｎにタングステンペ
ーストを均一に側面塗布することができた。The tungsten paste applied side was suddenly returned to normal pressure. As a result, as shown in FIG. 6, it was possible to uniformly apply the tungsten paste to a thickness of 5 μrn on all 100 through holes formed on the sheet.
実施例２
平均粒径２．０μｍの銀粉末（日中貴金属製、商品名５
Ｐ−１５Ｔ）１００重量部に有機バインダとして二）Ｃ
＝セルロース（脂化成製、商品名ＨＩＧ−１２０）を３
Ｍ量部及び有機溶剤としてブチルカルピトール（和光純
薬製、試薬−級）を１５重量部添加し、これをらいかい
機で１５時間混合して銀ペーストを得た。このようにし
て得た銀ペーストを厚さ０．８ ｍｍの基板に形成した
直径１．０ Ｍのスルーホール２００個に側面塗布した
。塗布は実施例１と同じ装置を用い、スクリーンマスク
上に銀ペーストを厚さ１００μｍに塗布し； １ ｔｏ
ｒｒまで減圧して行なった。この結果、スルーホール２
００個全てに厚さ１０μｍに銀ペーストを均一に側面塗
布することができた。Example 2 Silver powder with an average particle size of 2.0 μm (manufactured by Nichi-no Kikinzoku Co., Ltd., trade name 5)
P-15T) 100 parts by weight as an organic binder 2)C
= Cellulose (manufactured by Fukkasei, trade name HIG-120) 3
Parts of M and 15 parts by weight of butyl calpitol (manufactured by Wako Pure Chemical Industries, Ltd., reagent grade) as an organic solvent were added, and the mixture was mixed in a sieve for 15 hours to obtain a silver paste. The silver paste thus obtained was coated on the side surface of 200 through holes with a diameter of 1.0 M formed in a substrate with a thickness of 0.8 mm. For coating, using the same equipment as in Example 1, silver paste was coated on the screen mask to a thickness of 100 μm; 1 to
The pressure was reduced to rr. As a result, through hole 2
It was possible to uniformly coat the sides of all 00 pieces with silver paste to a thickness of 10 μm.
（発明の効果）
本発明はスルーホールを有する基板又はシート上にスク
リーンマスクを載置し、このスクリーンマスク上にペー
スト材料を塗布し、ついでスルーホール内及びペースト
材料塗布面側を１６ｔｏｒｒ以下に減圧した後ペースト
材料塗布面側を常圧に開放スるので、スルーホール内壁
にペースト材料が塗布されない部分が残ったり、ペース
ト材料の塗布厚さがばらついたり、ペースト材料が全く
吸引されずスルーホール表面に被膜を形成したりする問
題を解消することができるため、スルーホールを有する
各種厚膜配線板を製造する際に信頼性を高め９歩留まり
を向上させる上で効果が非常に大である。(Effects of the Invention) The present invention places a screen mask on a substrate or sheet having through holes, applies a paste material onto the screen mask, and then reduces the pressure in the through holes and on the side where the paste material is applied to 16 torr or less. After applying the paste material, the side to which the paste material is applied is released to normal pressure, which may leave some parts of the inner wall of the through-hole where the paste material is not applied, or the thickness of the paste material may vary, or the paste material may not be absorbed at all and the surface of the through-hole may not be coated. Since it is possible to solve the problem of forming a film on the substrate, it is very effective in increasing reliability and yield when manufacturing various thick film wiring boards having through holes.
第１図は従来のスルーホール内壁へのペースト材料の塗
布方法を示す概略図、第２図はスルーホール内壁の未塗
布部を示す概略図、第３図はスルーホール内壁の塗布厚
さばらつきを示す概略図。
第４図はペースト材料がスルーホール表面に被膜を形成
した状態を示す概略図、第５図は本発明の実施例になる
スルーホール内壁へのタングステンペーストの塗布方法
を示す概略図及び第６図は本発明の実施例によって得ら
れたシートのスルーホール内壁の塗布状態を示す概略図
である。
符号の説明
１・・・ペースト材料２・・・スルーホール３・・・ス
クリーンマスク ４・・・基板５・・・吸引治具 ６・
・・吸引機
７・・・容器 ８・・・コック
９・・・タングステンペースト
１０・・・シート
代理人 弁理士 若 林 邦 彦Fig. 1 is a schematic diagram showing a conventional method of applying paste material to the inner wall of a through hole, Fig. 2 is a schematic diagram showing an uncoated part of the inner wall of a through hole, and Fig. 3 is a schematic diagram showing the uncoated portion of the inner wall of a through hole. Schematic diagram shown. FIG. 4 is a schematic diagram showing a state in which the paste material forms a film on the surface of a through hole, FIG. 5 is a schematic diagram showing a method of applying tungsten paste to the inner wall of a through hole according to an embodiment of the present invention, and FIG. FIG. 2 is a schematic diagram showing the state of coating on the inner wall of a through hole of a sheet obtained according to an example of the present invention. Explanation of symbols 1...Paste material 2...Through hole 3...Screen mask 4...Substrate 5...Suction jig 6.
...Suction machine 7...Container 8...Cook 9...Tungsten paste 10...Sheet agent Patent attorney Kunihiko Wakabayashi
Claims (1)
クグリーンシート上にスクリーンマスクを載置し、この
スクリーンマスク上にペースト材料を塗布し、ついでス
ルーホール内及びペースト材料塗布面側をｌ Ｑ ｔｏ
ｒｒ以下に減圧した後ペースト材料塗布面側を常圧に開
放することを特徴とするスルーホール内壁へのペースト
材料の塗布方法。1. Place a screen mask on a ceramic substrate or ceramic green sheet that has through holes, apply paste material on this screen mask, and then line the inside of the through holes and the side on which the paste material is applied.
A method for applying a paste material to an inner wall of a through hole, which comprises: reducing the pressure to below rr and then opening the paste material application side to normal pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59022521A JPS60167396A (en) | 1984-02-09 | 1984-02-09 | Method of coating paste material on inner wall of through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59022521A JPS60167396A (en) | 1984-02-09 | 1984-02-09 | Method of coating paste material on inner wall of through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60167396A true JPS60167396A (en) | 1985-08-30 |
Family
ID=12085075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59022521A Pending JPS60167396A (en) | 1984-02-09 | 1984-02-09 | Method of coating paste material on inner wall of through hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167396A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113298A (en) * | 1984-11-08 | 1986-05-31 | 松下電器産業株式会社 | Through hole printing |
| JPS61285794A (en) * | 1985-06-12 | 1986-12-16 | 株式会社村田製作所 | Manufacture of printed wiring board |
| US4710395A (en) * | 1986-05-14 | 1987-12-01 | Delco Electronics Corporation | Method and apparatus for through hole substrate printing |
| US4779565A (en) * | 1986-05-14 | 1988-10-25 | Delco Electronics Corporation | Apparatus for through hole substrate printing |
| EP0627874A1 (en) * | 1993-06-04 | 1994-12-07 | Blaupunkt-Werke GmbH | Process for making through-hole connections in printed circuit boards |
| CN107072073A (en) * | 2016-12-29 | 2017-08-18 | 中国电子科技集团公司第二研究所 | A kind of method of LTCC ceramic chips the via hole |
| WO2022034716A1 (en) * | 2020-08-12 | 2022-02-17 | 株式会社村田製作所 | Circuit board, electronic device, circuit board manufacturing method, and motherboard for circuit board |
-
1984
- 1984-02-09 JP JP59022521A patent/JPS60167396A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61113298A (en) * | 1984-11-08 | 1986-05-31 | 松下電器産業株式会社 | Through hole printing |
| JPH0586879B2 (en) * | 1984-11-08 | 1993-12-14 | Matsushita Electric Ind Co Ltd | |
| JPS61285794A (en) * | 1985-06-12 | 1986-12-16 | 株式会社村田製作所 | Manufacture of printed wiring board |
| JPH044760B2 (en) * | 1985-06-12 | 1992-01-29 | ||
| US4710395A (en) * | 1986-05-14 | 1987-12-01 | Delco Electronics Corporation | Method and apparatus for through hole substrate printing |
| US4779565A (en) * | 1986-05-14 | 1988-10-25 | Delco Electronics Corporation | Apparatus for through hole substrate printing |
| EP0627874A1 (en) * | 1993-06-04 | 1994-12-07 | Blaupunkt-Werke GmbH | Process for making through-hole connections in printed circuit boards |
| CN107072073A (en) * | 2016-12-29 | 2017-08-18 | 中国电子科技集团公司第二研究所 | A kind of method of LTCC ceramic chips the via hole |
| CN107072073B (en) * | 2016-12-29 | 2019-06-04 | 中国电子科技集团公司第二研究所 | A kind of method of LTCC ceramic chips the via hole |
| WO2022034716A1 (en) * | 2020-08-12 | 2022-02-17 | 株式会社村田製作所 | Circuit board, electronic device, circuit board manufacturing method, and motherboard for circuit board |
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