JPS60167362U - Enamel board with parts mounting area - Google Patents
Enamel board with parts mounting areaInfo
- Publication number
- JPS60167362U JPS60167362U JP5458484U JP5458484U JPS60167362U JP S60167362 U JPS60167362 U JP S60167362U JP 5458484 U JP5458484 U JP 5458484U JP 5458484 U JP5458484 U JP 5458484U JP S60167362 U JPS60167362 U JP S60167362U
- Authority
- JP
- Japan
- Prior art keywords
- enamel
- mounting area
- parts mounting
- enamel board
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はほうろう基板に部品を取付ける場合の従来構造
例を示す要部の縦断面図、第２図は第１図の■−■線に
沿う矢視図、第３図は本考案の一実施例を示す要部の縦
断面図、第４図は第３図のＩＶ−ＩＶ線に沿う矢視図、
第５図は本考案の他の実施例を示す要部の正面図である
。
２・・・・・・印刷回路、３・・・・・・部品、３Ｃ・
・・・・・かしめ部、４・・・・・・取付は穴、４′・
・・・・・取付は部、５・・・・・・クラック、６・・
・・・・はうろう基板、６ａ・・・・・・金属コア、６
ｂ・・・・・・はうろうエナメル、７・・・・・・印刷
面、８・・・・・・貫通孔。Fig. 1 is a vertical cross-sectional view of the main part showing an example of a conventional structure when parts are attached to an enamel board, Fig. 2 is a view taken along the line A vertical sectional view of the main part showing the embodiment, FIG. 4 is a view taken along the line IV-IV in FIG. 3,
FIG. 5 is a front view of main parts showing another embodiment of the present invention. 2... Printed circuit, 3... Parts, 3C.
...Caulking part, 4...Mounting hole, 4'.
・・・・・・Installation is part, 5...Crack, 6...
...Wandering board, 6a...Metal core, 6
b...Wandering enamel, 7...Printed surface, 8...Through hole.
Claims (1)
上に印刷回路２が形成されるほうろう基板６に、部品３
が取付けられる取付は部４，４′を設けるとともに、該
取付は部と前記印刷回路が形成される印刷面７との間を
相互に隔離する貫通孔８を設けたことを特徴とする部品
取付は部を有するほうろう基板。The component 3 is placed on the enamel substrate 6 on which the printed circuit 2 is formed on the enamel enamel 6b formed on the surface of the metal core 6a.
Component mounting is characterized in that the mounting is provided with parts 4 and 4', and a through hole 8 is provided for mutually isolating between the parts and the printed surface 7 on which the printed circuit is formed. is an enamel substrate with a section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5458484U JPS60167362U (en) | 1984-04-13 | 1984-04-13 | Enamel board with parts mounting area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5458484U JPS60167362U (en) | 1984-04-13 | 1984-04-13 | Enamel board with parts mounting area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60167362U true JPS60167362U (en) | 1985-11-06 |
Family
ID=30576472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5458484U Pending JPS60167362U (en) | 1984-04-13 | 1984-04-13 | Enamel board with parts mounting area |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167362U (en) |
-
1984
- 1984-04-13 JP JP5458484U patent/JPS60167362U/en active Pending
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