JPS6016475A - Photo coupler - Google Patents
Photo couplerInfo
- Publication number
- JPS6016475A JPS6016475A JP59131373A JP13137384A JPS6016475A JP S6016475 A JPS6016475 A JP S6016475A JP 59131373 A JP59131373 A JP 59131373A JP 13137384 A JP13137384 A JP 13137384A JP S6016475 A JPS6016475 A JP S6016475A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- light
- chips
- semiconductor chip
- opaque
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、フォトカプラーの電気−光一電気変換機能の
精度向上（誤動作の防止）を容易に実現できる構造を提
供するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a structure that can easily improve the accuracy (prevent malfunctions) of the electrical-to-optical electrical conversion function of a photocoupler.
従来、フォトカプラーは第１図に示すように構成されて
いた。すなわち、リードフレーム１ａの上に発光部半導
体チップ２ａと受光部半導体テップ２ｂをグイスボンデ
ィングし、そしてリードフレーム１ｂ、１ｃと半導体チ
ップ２ａ 、２ｂの表面に接続ワイヤー３ａ 、 ３ｂ
をそれぞれワイヤーボンディングにより接続し、これら
を内部に隔壁５を有する中空状で不透明な樹脂ケース４
に挿入し、その後、透明な封止用樹脂６を注入し硬化し
て作られていた。Conventionally, photocouplers have been constructed as shown in FIG. That is, the light-emitting semiconductor chip 2a and the light-receiving semiconductor chip 2b are bonded onto the lead frame 1a, and the connecting wires 3a, 3b are attached to the surfaces of the lead frames 1b, 1c and the semiconductor chips 2a, 2b.
are connected to each other by wire bonding, and these are connected to a hollow, opaque resin case 4 having a partition wall 5 inside.
After that, transparent sealing resin 6 was injected and cured.
しかしながら、このような構成ではフォトカフ。However, in such a configuration a photocuff.
うの動作として、発光部半導体チップ２ａの光がＣ方向
だけでなくＣ方向にももれることにより光量が減少し、
また受光部半導体チップ２ｂへはｂ方向だけの光取外に
不必要で誤動作の原因となるＣ方向の光が入射されるた
め、フォトカプラーの電気−光一電気変換の精度が低く
、誤動作を発生しやすいものであった。As a second operation, the light from the light emitting semiconductor chip 2a leaks not only in the C direction but also in the C direction, so that the amount of light decreases.
In addition, since the light in the C direction, which is unnecessary for extracting only the light in the B direction and causes malfunctions, enters the light receiving semiconductor chip 2b, the accuracy of the photocoupler's electrical-to-optical conversion is low, causing malfunctions. It was easy.
本発明はこのような従来の欠点を解消するものであり、
以下その一実施例について第２図を用いて説明する。The present invention solves these conventional drawbacks,
An example of this will be described below with reference to FIG. 2.
この第２図において第１図の従来の構成と同一構成個所
には同一番号が附してあり、リードフレーム１ａ上に発
光部半導体チップ２ａと受光部半導体チップ２ｂを設け
、かつこれらの半導体チップ２ａ、２ｂとリードフレー
ム１ｂ、１ｃとを接続ワイヤーｓ ａ 、 ３ｂで接続
し、これらを樹脂ケース４に挿入した後、少なくとも前
記半導体チップ２ａ、２ｂを含んでリードフレーム１ａ
上に透明な保護樹脂層７を塗布により設け、そして両面
に金属箔Ｂａ、ｓｂを形成した不透明な樹脂板９を前記
半導体チップ２ａ、２ｂ間において前記保護樹脂層７に
圧入し、その後光の透過方向がそれぞれ半導体チップ２
ａ、２ｂの上面に直角となるように光ファイバー１ｏａ
、１０ｂを同様に保護樹脂層７に圧入し、かつこの光フ
ァイバー１０ａ。In FIG. 2, the same components as those in the conventional configuration shown in FIG. 2a, 2b and lead frames 1b, 1c are connected with connecting wires sa, 3b, and after inserting these into the resin case 4, the lead frame 1a including at least the semiconductor chips 2a, 2b is assembled.
A transparent protective resin layer 7 is provided on the protective resin layer 7 by coating, and an opaque resin plate 9 with metal foils Ba and sb formed on both sides is press-fitted into the protective resin layer 7 between the semiconductor chips 2a and 2b, and then exposed to light. The transmission direction is the semiconductor chip 2.
Optical fiber 1OA perpendicular to the top surfaces of a and 2b
, 10b are similarly press-fitted into the protective resin layer 7, and this optical fiber 10a.
１０ｂを前記金属箔ｓａ、ｓｂに透明な接着剤１１ａ、
１１ｂにより接着し、その後樹脂ケース４に不透明な封
止用樹脂１２を注入硬化したものである。10b to the metal foil sa, sb to a transparent adhesive 11a,
11b, and then an opaque sealing resin 12 is injected into the resin case 4 and hardened.
以上のように構成することにより、発光前半導体チップ
２ａからの光は光ファイバー１０ａを通るｅ方向の光の
みとなって光もれがなくなり、また受光部半導体チップ
２ｂに入射される光は光ファイバー１０ｂを通る正方向
のみの光となって従来のような誤動作の原因となるよう
な光が発生されたり、ｇ方向の光が受光されたりするよ
うなことがないもので、精度が大幅に向上するものであ
る。With the above configuration, the light from the semiconductor chip 2a before emitting light becomes only the light in the e direction passing through the optical fiber 10a, eliminating light leakage, and the light entering the light receiving part semiconductor chip 2b is transmitted through the optical fiber 10b. There is no need for light to pass through in the forward direction, which would cause malfunctions, or to receive light in the g direction, which greatly improves accuracy. It is something.
そして、金属箔ｓａ、ｓｂは光ファイバー１０８゜１ｏ
ｂの光の通過を良好ならしめ、効率のよい光通過が行な
われるものである。And the metal foils sa and sb are optical fibers 108°1o
This allows light to pass through efficiently.
なお、」二記実施例では樹脂ケース４内に封止用樹脂１
２を充填しだが、これらはいずれも不透明であるため、
一方で他方を兼ねることも可能である。In addition, in the second embodiment, the sealing resin 1 is placed inside the resin case 4.
2, but since they are all opaque,
It is also possible for one to serve as the other.
以上のように本発明は簡単な構成により、フォトカプラ
ーの電気−光一電気変換機能の精度が向上し、誤動作の
ない確実な動作が行なわれるものである。As described above, the present invention has a simple configuration that improves the accuracy of the photocoupler's electrical-to-optical conversion function and ensures reliable operation without malfunction.
第１図は従来例の断面図、第２図は本発明の一実施例の
断面図である。
１ａ、１ｂ、１ｃ・・・・・・リードフレーム、２・・
・・・発光前半導体チップ、２ｂ・・・・・・受光部半
導体チップ、４・・・・・・樹脂ケース、７・・・・・
・保護樹脂層、８ａ。
８ｂ・・・・・・金属箔、９・・・・・・樹脂板、１Ｑ
ａ、１０ｂ・・・・・・光ファイバー、１２・・・・・
・封止用樹脂。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図FIG. 1 is a sectional view of a conventional example, and FIG. 2 is a sectional view of an embodiment of the present invention. 1a, 1b, 1c...Lead frame, 2...
... Semiconductor chip before emitting light, 2b ... Light receiving part semiconductor chip, 4 ... Resin case, 7 ...
- Protective resin layer, 8a. 8b...Metal foil, 9...Resin plate, 1Q
a, 10b...Optical fiber, 12...
- Sealing resin. Name of agent: Patent attorney Toshio Nakao and 1 other person 1st
figure
Claims (1)
属箔を有する樹脂板を配し、前記両金属箔と接して光の
透過方向が前記それぞれの半導体チップの表面に直角方
向となるように光ファイバーをそれぞれ配したことを特
徴とするフォトカプラー。A resin plate having metal foil on both sides is arranged between the light emitting part semiconductor chip and the light receiving part semiconductor chip, and an optical fiber is placed in contact with both the metal foils so that the direction of light transmission is perpendicular to the surface of each of the semiconductor chips. A photocoupler characterized by the arrangement of each.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59131373A JPS6046555B2 (en) | 1984-06-26 | 1984-06-26 | Photocoupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59131373A JPS6046555B2 (en) | 1984-06-26 | 1984-06-26 | Photocoupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6016475A true JPS6016475A (en) | 1985-01-28 |
| JPS6046555B2 JPS6046555B2 (en) | 1985-10-16 |
Family
ID=15056419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59131373A Expired JPS6046555B2 (en) | 1984-06-26 | 1984-06-26 | Photocoupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6046555B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7026654B2 (en) * | 2002-04-05 | 2006-04-11 | Canon Kabushiki Kaisha | Package for optical semiconductor |
-
1984
- 1984-06-26 JP JP59131373A patent/JPS6046555B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7026654B2 (en) * | 2002-04-05 | 2006-04-11 | Canon Kabushiki Kaisha | Package for optical semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6046555B2 (en) | 1985-10-16 |
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