JPS60163774U - automatic conveyance device - Google Patents
automatic conveyance deviceInfo
- Publication number
- JPS60163774U JPS60163774U JP5144784U JP5144784U JPS60163774U JP S60163774 U JPS60163774 U JP S60163774U JP 5144784 U JP5144784 U JP 5144784U JP 5144784 U JP5144784 U JP 5144784U JP S60163774 U JPS60163774 U JP S60163774U
- Authority
- JP
- Japan
- Prior art keywords
- automatic conveyance
- conveyance device
- product
- holding mechanism
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の半導体用プリント基板の自動搬送装置の
要部縦断面図、第2図は同上装置下方の各種処理槽の配
置図、第3図は本考案の一実施例を示す縦断面図である
。
1・・・プリント基板、2・・・チェーンガイド、3・
・・チェーン、5・・・ブラケット、21・・・基準板
、22 ′・・・弾性板。Fig. 1 is a longitudinal cross-sectional view of the main parts of a conventional automatic conveyance device for semiconductor printed circuit boards, Fig. 2 is a layout diagram of various processing tanks below the same device, and Fig. 3 is a longitudinal cross-sectional view showing an embodiment of the present invention. It is a diagram. 1... Printed circuit board, 2... Chain guide, 3...
...Chain, 5...Bracket, 21...Reference plate, 22'...Elastic plate.
Claims (1)
有する自動搬送装置において、前記保持機構を、製品の
位置決めの基準となるべく剛性大に取り付けられた基準
板と、該基準板に製品を押圧保持する弾性板と、を含ん
で構成したことを特徴とする自動搬送装置。In an automatic conveyance device having a holding mechanism for conveying a product attached to an automatic conveyance means, the holding mechanism is connected to a reference plate attached with as high rigidity as a reference for positioning the product, and a product is pressed and held against the reference plate. An automatic conveyance device characterized by comprising: an elastic plate that does
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5144784U JPS60163774U (en) | 1984-04-10 | 1984-04-10 | automatic conveyance device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5144784U JPS60163774U (en) | 1984-04-10 | 1984-04-10 | automatic conveyance device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60163774U true JPS60163774U (en) | 1985-10-30 |
Family
ID=30570504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5144784U Pending JPS60163774U (en) | 1984-04-10 | 1984-04-10 | automatic conveyance device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60163774U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6310067A (en) * | 1986-06-30 | 1988-01-16 | Ideya:Kk | Solder dip treating equipment for electronic parts |
JPH10284878A (en) * | 1997-04-09 | 1998-10-23 | Fukuoka Toshiba Electron Kk | Carrier for semiconductor component and manufacture of semiconductor device using the carrier |
-
1984
- 1984-04-10 JP JP5144784U patent/JPS60163774U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6310067A (en) * | 1986-06-30 | 1988-01-16 | Ideya:Kk | Solder dip treating equipment for electronic parts |
JPH10284878A (en) * | 1997-04-09 | 1998-10-23 | Fukuoka Toshiba Electron Kk | Carrier for semiconductor component and manufacture of semiconductor device using the carrier |
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