JPS60162928A - Temperature sensor - Google Patents
Temperature sensorInfo
- Publication number
- JPS60162928A JPS60162928A JP1863884A JP1863884A JPS60162928A JP S60162928 A JPS60162928 A JP S60162928A JP 1863884 A JP1863884 A JP 1863884A JP 1863884 A JP1863884 A JP 1863884A JP S60162928 A JPS60162928 A JP S60162928A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- terminal
- fixed
- head
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は調理容器の底を通して内部の調理物の温度を検
出する調届器用の温度センダーに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a temperature sender for a cooking device that detects the temperature of food inside the cooking container through the bottom thereof.
従来例の構成とその問題点
２・・−ミ゛
従来この種の温度センサは第１図に示すように調理容器
１の底部と接触するセンサヘッド２の内部には、絶縁性
基板３の表面に電極膜４と感温抵抗体膜５とを形［戊し
たセンサチップ６を接着剤７で接着して固定し、さらに
、絶縁板８を折り曲げカシメなどで固定したセンサ金具
９を溶接で固定している。絶縁板８には、２本の端子１
０が取付けられ、センサリード線１１をガイドする溝ま
たは、孔口が設けら力ているっセンサチップ６の両電極
膜４には、センサリード線１１として、溶接がやり易く
、耐久性に富み、しかも、電極膜４に機械的応力を少な
くするだめ細線である白金線が一般に用いられて溶接さ
れ、そしてセンサリード線１１１−を絶縁板８の孔口を
ｉｉｊ Ｌ、端子１０に溶接される。さらに、端子１０
には外部リード線１３が溶接される。Structure of the conventional example and its problem 2... As shown in FIG. Then, form the electrode film 4 and the temperature-sensitive resistor film 5. [The cut out sensor chip 6 is glued and fixed with an adhesive 7, and the sensor metal fitting 9, which is fixed by bending and caulking the insulating plate 8, is fixed by welding. are doing. There are two terminals 1 on the insulating plate 8.
0 is attached to both electrode films 4 of the sensor chip 6, which are provided with grooves or holes for guiding the sensor lead wires 11. Moreover, a platinum wire, which is a thin wire, is generally used and welded to the electrode film 4 in order to reduce mechanical stress, and the sensor lead wire 111- is welded to the hole of the insulating plate 8 to the terminal 10. . Furthermore, terminal 10
An external lead wire 13 is welded to.
センサチップ６をセンサヘッド２に接着し電極膜４にセ
ンサリード線１１を溶接した後、センサチップ６の表面
には、絶縁膜１４を形成している。After bonding the sensor chip 6 to the sensor head 2 and welding the sensor lead wire 11 to the electrode film 4, an insulating film 14 is formed on the surface of the sensor chip 6.
この構成で（ｄｊ 、センサチップ６の電極膜４にセ３
Ｎ ミ・
ンサリード線１１を溶接し、さらに、端子１０に溶接ケ
する作業が必要であり、しかも、絶縁板８を固定したセ
ンサ金具９はセンサリード線１１を３１ｊす孔口を有ｌ
−たりしているのでセンサチップ６を完全に密閉するこ
とが不可能なため感温抵抗膜５０表面にこみ等の（−１
着による絶縁不良防雨の絶縁＋＋ｇ １４を形成する必
要があり、従って、高価な白金線のセンサリード線１１
を使用し、しかも、溶接や絶縁膜１４の形成等の作業を
要し複雑な構造となり高価な温度センサとなる。With this configuration (dj, the electrode film 4 of the sensor chip 6 is
It is necessary to weld the sensor lead wire 11 and then weld it to the terminal 10, and the sensor metal fitting 9 to which the insulating plate 8 is fixed has a hole 31j for the sensor lead wire 11.
Since it is impossible to completely seal the sensor chip 6 due to the
It is necessary to form a rainproof insulation ++g 14 due to poor insulation due to adhesion, and therefore the sensor lead wire 11 is made of expensive platinum wire.
Moreover, it requires operations such as welding and forming the insulating film 14, resulting in a complicated structure and an expensive temperature sensor.
さらに、細い白金線からなるセンダーリード線１１を電
極膜４表１′＠子１０に溶接する点でも、白金線のけが
れや断線等による信頼性に欠けるという問題を有してい
た。Furthermore, there is also a problem in that the sender lead wire 11 made of a thin platinum wire is welded to the electrode film 4 1' @ child 10, and that reliability is lacking due to fraying or breakage of the platinum wire.
発明の目的
不発り−１はかかる従来の問題点を解決するもので、簡
単な構造で廉価で、しかも、信頼性の高い温度センサを
提供することを目的とする。OBJECT OF THE INVENTION-1 is to solve such conventional problems, and aims to provide a temperature sensor that has a simple structure, is inexpensive, and has high reliability.
発り１の構１ｊｓ２
この１」的を達成するために不発１３１１は、２木の端
子を固設した絶縁体を円筒状のセンツー金具に収イＫｊ
け、センサ金具と絶縁体によりセンサチップを覆いセン
サチップの両電極膜（／ｉ″２本の端子を圧接するよう
センサ金具をセンサヘッドに固設したものである。この
構成によって白金線よりなるセンサリード線を収イ・」
けることもなくセンサチップを密封するだめ絶縁膜を形
成する必要もなく安価で信頼性に優れた温度センサとな
る。Structure of origin 1 1js2 In order to achieve this goal 1, the misfire 1311 is made by housing an insulator with a fixed wooden terminal in a cylindrical metal fitting.
The sensor chip is covered with a sensor metal fitting and an insulator, and the sensor metal fitting is fixed to the sensor head so as to press the two terminals of the sensor chip (/i''). Insert the sensor lead wire.
There is no need to form an insulating film to seal the sensor chip, resulting in an inexpensive and highly reliable temperature sensor.
実施例の説明
以下、本発明の一実旋例を第２図を用いて説Ｆ！ｌ−１
する。第１図と同一部］」ＶＣは同一番号をｆ（］１〜
でいる。２はステンレス板からなるセンサヘッド、６は
センサチップでありアルミナ、ムライト智からなる絶縁
性基板３の表面に電極膜４と感温抵抗体膜５とを形成し
ている。電極）換４にはＡ、ｕ−Ｐｔ、Ａｕ−Ｐｄなど
の厚膜電１ｉｔｉ、Ａｕ、Ａｇなとの蒸着電極、Ｗ、Ｍ
ｎ などのメタライズ電極等が用いられる。丑だ、感温
抵抗体膜５には炭化珪素（ＳｉＣ）を用いている。DESCRIPTION OF EMBODIMENTS Hereinafter, one example of the present invention will be explained using FIG. l-1
do. The same part as in Figure 1]” VC uses the same number f(]1~
I'm here. 2 is a sensor head made of a stainless steel plate, and 6 is a sensor chip, on which an electrode film 4 and a temperature-sensitive resistor film 5 are formed on the surface of an insulating substrate 3 made of alumina or mullite. Electrode 4 includes thick film electrodes such as A, u-Pt and Au-Pd, vapor deposited electrodes such as Au and Ag, W, M
A metallized electrode such as n is used. Unfortunately, silicon carbide (SiC) is used for the temperature sensitive resistor film 5.
センサチップ６はセンサヘッド２とに２枚のろう材１５
とチタン箔１６表によりろう何される。こ５べ一１゛
のろうイ・］けｌｉ１ ％ センサヘッド２とセンサチ
ップ６との熱衝ヤ゛を緩和しろう何はを容易となし、そ
して、熱応答性を良好なものとするためのものである。The sensor chip 6 is connected to the sensor head 2 by two pieces of brazing material 15.
And the titanium foil is waxed with 16 sheets. In order to ease the thermal shock between the sensor head 2 and the sensor chip 6, and to improve the thermal response. belongs to.
９は円筒状をなしたセンサ金具、８は２本の端子１０を
メタライズ、ガラス封口捷たはカシメ等により固設した
絶縁体であり、この絶縁体８１−を端子１０々同様な方
法によりセンサ金具８に取何けられる。ここで、端子１
０を固設した絶縁休日と一体となしたセンサ金具９をセ
ンサヘッド２に溶接すれば、センサチップ６を密封し端
子１０は電４ｉ！ｌλ膜４に圧接されるようになってい
る。9 is a cylindrical sensor metal fitting; 8 is an insulator which is fixed by metalizing, glass sealing, or caulking the two terminals 10; this insulator 81- is connected to the sensor by the same method as the terminals 10 It can be attached to the metal fitting 8. Here, terminal 1
By welding the sensor metal fitting 9, which is integrated with the insulating wire 0 fixedly attached, to the sensor head 2, the sensor chip 6 is sealed and the terminal 10 is connected to the electric wire 4i! It is adapted to be pressed against the lλ film 4.
１３け外部リード線であり、接続金具１７にカシメられ
端子１０に収イ」けら力、ている。There are 13 external lead wires, which are crimped to the connecting fitting 17 and fit into the terminal 10.
」−記構成において、センサヘッド２で受熱しセンサチ
ップ６０感潟抵抗体膜５で温度感知し電極膜４、端子１
０を経て外部リード線１３から出力される。ここで、絶
縁体８とセンサ金具９とが一体となりセンダーチップ６
を覆い、しかも両電極膜４と端子１０が圧接されるよう
センサ金具９をセンサヘッド２に固設しているため、セ
ンサリードｚ
線や絶、縁膜か不卯となり簡ｔ１４な構成の温度センサ
が寿られる。In the configuration described above, the sensor head 2 receives heat, the sensor chip 60 senses the temperature with the resistor film 5, and the electrode film 4 and the terminal 1
0 and is output from the external lead wire 13. Here, the insulator 8 and the sensor metal fitting 9 are integrated, and the sender chip 6
Since the sensor metal fitting 9 is fixed to the sensor head 2 so that both the electrode films 4 and the terminals 10 are in pressure contact with each other, the sensor lead z wire, insulation, and membrane are uncircumcised, resulting in a simple temperature control structure. The sensor will last a long time.
次に本発明の伸の実施例を第３図を用いて説す１する。Next, an embodiment of the present invention will be described with reference to FIG.
第３図において前記第２図と相離する点は端子１０のη
）極膜４への圧接ｌ１ｌｌＩにスプリング性をもたせる
だめの屈曲部１０′を設けたことにあり、この構成によ
れば、センサ金具９をセンサヘッド２に固設するとき端
子１０のスプリング性により適度な接触用で電極膜４に
（催実に圧接され電極膜４を傷つける心配もない。The point in FIG. 3 that differs from that in FIG. 2 is η of the terminal 10.
) A bending portion 10' is provided in the pressure contact l1llI to the electrode film 4 to provide a spring property. According to this configuration, when the sensor fitting 9 is fixed to the sensor head 2, the spring property of the terminal 10 is provided. Since it is for moderate contact, there is no need to worry about it being pressed against the electrode film 4 and damaging the electrode film 4.
発明の幼牛
以」−のように本発明の温度センサにより、ば次の効用
が寿られる。The temperature sensor of the present invention provides the following benefits:
（１） 端子と固設した絶縁体をセンサ金具に収イ」け
そのセンサ金具をセンサヘッドに固設することによって
端子が、センサヘッドにろうｆ４はされたセンサチップ
の両電極膜に圧接されるため確実に端子と電極膜が密着
するとともに、センサリード線が不要となり断線や溶接
はかね等の心配がなく信頼性の高い温度センサとなる。(1) The terminal and the fixed insulator are placed in the sensor metal fitting. By fixing the sensor metal fitting to the sensor head, the terminal is pressed against both electrode films of the sensor chip soldered to the sensor head. This ensures that the terminal and electrode membrane are in close contact with each other, and there is no need for a sensor lead wire, resulting in a highly reliable temperature sensor without the need for wire breakage or welding.
７、− ・
（２） 絶縁体と絶縁体を収イ」けだセンサ金具とでセ
ンサチップをキ“θうことにより密封構造としただめセ
シツーヂッゾの花ｌｉ）抵抗膜の表面にこみなどが何名
する心配がないので絶縁膜を形］戊する必要がない。7. - (2) Create a hermetic structure by sealing the sensor chip with an insulator and a sensor metal fitting that contains the insulator. There is no need to shape the insulating film, as there is no need to worry about damage.
（３） 従って、高価な白金線よりなるセンヴーリード
線の削減とセンサチップの表面に絶縁膜の形成や溶接作
業等が不要となり、よって、廉価で簡単な構造の湯度セ
ンサを提供できる。(3) Therefore, the need for expensive platinum lead wires is reduced, and the formation of an insulating film on the surface of the sensor chip, welding work, etc. are no longer necessary, and a hot water temperature sensor with an inexpensive and simple structure can be provided.
第１図は従来の温度センサの羽部断面図、第２図は本発
明の温度センサの一実施例を示す要部断［ｆ［１図、第
３図は本発明の湯度センサの他の実施例を示す羽部断面
図である。
２ ・・センザヘソド、３・・絶縁性基板、４・・・電
４ｉｉ膜、５・・・蒋潟抵抗体膜、６・ ・・センサチ
ップ、８ ・絶縁体、９・・・ センサ金具＜１０・・
・・・端子、１０′ ・屈曲部。FIG. 1 is a cross-sectional view of a blade of a conventional temperature sensor, and FIG. 2 is a cross-sectional view of a main part showing an embodiment of the temperature sensor of the present invention. It is a sectional view of a wing part showing an example of. 2...Sensor head, 3...Insulating substrate, 4...Electronic 4II film, 5...Chianggata resistor film, 6...Sensor chip, 8...Insulator, 9...Sensor metal fitting <10・・・
...Terminal, 10' - Bent part.
Claims (2)
りｙしたセンサチップをセンサヘッドに固設し、２木の
端子を固設した絶縁体と円筒状のセンサ金具に取伺け、
前記センサ金具と絶縁体により前記センサチップを使う
とともに前記センサチップの両電極膜に前記端子が圧接
するよう前記センサ金具を前記センサヘッドに固設して
なる温度センサ。(1) A sensor chip with an electrode film and a temperature-sensitive resistor film formed on the surface of an insulating substrate is fixed to the sensor head, and 2 a wooden terminal is fixed to the insulator and a cylindrical sensor metal fitting. Ask for it,
A temperature sensor in which the sensor chip is used with the sensor metal fitting and an insulator, and the sensor metal fitting is fixed to the sensor head so that the terminals are in pressure contact with both electrode films of the sensor chip.
両電極膜に圧接してなる特許請求の範囲第１項記載の温
度センサ。(2) The temperature sensor according to claim 1, wherein the terminal has spring properties and is pressed against both electrode films of the sensor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1863884A JPS60162928A (en) | 1984-02-03 | 1984-02-03 | Temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1863884A JPS60162928A (en) | 1984-02-03 | 1984-02-03 | Temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60162928A true JPS60162928A (en) | 1985-08-24 |
Family
ID=11977146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1863884A Pending JPS60162928A (en) | 1984-02-03 | 1984-02-03 | Temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60162928A (en) |
-
1984
- 1984-02-03 JP JP1863884A patent/JPS60162928A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0260335A1 (en) | Ultrasonic transreceiver | |
| GB2047465A (en) | Pressure sensor | |
| EP0171877A1 (en) | Method of securing leads to a thermistor | |
| KR100426939B1 (en) | Gas sensor | |
| GB1339166A (en) | Capacitors | |
| JPS60162928A (en) | Temperature sensor | |
| JP3277471B2 (en) | Temperature detecting element and its application element | |
| JPS6124178A (en) | Method of contacting conductor with conductive strip or conductive layer in thermal resistant manner | |
| JP2003247897A (en) | Temperature sensor | |
| JP3086305B2 (en) | Sensor and manufacturing method thereof | |
| JPS6140930B2 (en) | ||
| JP2000241274A (en) | Semiconductor pressure sensor, manufacture thereof and parts thereof | |
| JPS5946401B2 (en) | thermistor | |
| JPS60124802A (en) | Glass-sealed type thermistor | |
| JPS6453618A (en) | Crystal oscillator | |
| JP2783735B2 (en) | Package for storing semiconductor elements | |
| JPS6237949A (en) | Electronic-part mounting package | |
| JPS5870139A (en) | Semiconductor type pressure to electricity transducer | |
| JPS5857881B2 (en) | oxide negative resistor | |
| JPS581551B2 (en) | semiconductor pressure transducer | |
| JPS622683B2 (en) | ||
| JP2001127208A (en) | Semiconductor chip packaging structure and manufacturing method thereof | |
| JPH0630282B2 (en) | SiC thin film thermistor | |
| JPS62259030A (en) | Semiconductor pressure sensor | |
| JPS5932041B2 (en) | thin film thermistor |