JPS60162043U - サ−マルプリントヘツド - Google Patents

サ−マルプリントヘツド

Info

Publication number
JPS60162043U
JPS60162043U JP1984049555U JP4955584U JPS60162043U JP S60162043 U JPS60162043 U JP S60162043U JP 1984049555 U JP1984049555 U JP 1984049555U JP 4955584 U JP4955584 U JP 4955584U JP S60162043 U JPS60162043 U JP S60162043U
Authority
JP
Japan
Prior art keywords
print head
thermal print
substrate
filler
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984049555U
Other languages
English (en)
Japanese (ja)
Other versions
JPH036435Y2 (enrdf_load_stackoverflow
Inventor
明智　方俊
博 福本
山田　譲司
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP1984049555U priority Critical patent/JPS60162043U/ja
Publication of JPS60162043U publication Critical patent/JPS60162043U/ja
Application granted granted Critical
Publication of JPH036435Y2 publication Critical patent/JPH036435Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909—Post-treatment of the layer connector or bonding area
    • H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant

Landscapes

  • Electronic Switches (AREA)
JP1984049555U 1984-04-03 1984-04-03 サ−マルプリントヘツド Granted JPS60162043U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984049555U JPS60162043U (ja) 1984-04-03 1984-04-03 サ−マルプリントヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984049555U JPS60162043U (ja) 1984-04-03 1984-04-03 サ−マルプリントヘツド

Publications (2)

Publication Number Publication Date
JPS60162043U true JPS60162043U (ja) 1985-10-28
JPH036435Y2 JPH036435Y2 (enrdf_load_stackoverflow) 1991-02-19

Family

ID=30566870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984049555U Granted JPS60162043U (ja) 1984-04-03 1984-04-03 サ−マルプリントヘツド

Country Status (1)

Country Link
JP (1) JPS60162043U (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56133464U (enrdf_load_stackoverflow) * 1980-03-11 1981-10-09
JPS58101758U (ja) * 1981-12-28 1983-07-11 株式会社リコー サ−マルヘツド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56133464U (enrdf_load_stackoverflow) * 1980-03-11 1981-10-09
JPS58101758U (ja) * 1981-12-28 1983-07-11 株式会社リコー サ−マルヘツド

Also Published As

Publication number Publication date
JPH036435Y2 (enrdf_load_stackoverflow) 1991-02-19

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