JPS60158798U - electronic equipment housing - Google Patents
electronic equipment housingInfo
- Publication number
- JPS60158798U JPS60158798U JP4496984U JP4496984U JPS60158798U JP S60158798 U JPS60158798 U JP S60158798U JP 4496984 U JP4496984 U JP 4496984U JP 4496984 U JP4496984 U JP 4496984U JP S60158798 U JPS60158798 U JP S60158798U
- Authority
- JP
- Japan
- Prior art keywords
- electronic equipment
- protrusion
- equipment housing
- electronic device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は導電性プラスチック製部材の断面図、第２図、
第３図、第４図は第１図に接地部を形成するための従来
例の説明図、第５図は本考案の一実施例の外観を示す斜
視図、第６図は第５図の断面図、第７図は第６図の接地
部の一例を示す断面図、第８図は第７図の分解斜視図、
第９図は第６図の接地部の他の例を示す斜視図である。
２．２０−・・絶縁層、１３ ａ、 １３ ｂ”・当
て金、１４・・・突起、１５・・・接続部、１７・・・
穴、１８・・・めねじバーリング。Figure 1 is a sectional view of a conductive plastic member, Figure 2 is a cross-sectional view of a conductive plastic member,
3 and 4 are explanatory diagrams of a conventional example for forming a grounding part in FIG. 1, FIG. 5 is a perspective view showing the appearance of an embodiment of the present invention, and FIG. A sectional view, FIG. 7 is a sectional view showing an example of the grounding part in FIG. 6, FIG. 8 is an exploded perspective view of FIG. 7,
FIG. 9 is a perspective view showing another example of the grounding part of FIG. 6. 2.20--Insulating layer, 13a, 13b"-Batch, 14-Protrusion, 15-Connection part, 17-
Hole, 18...Female thread burring.
Claims (1)
に存在する絶縁層を突き破って内部の導電層と接触可能
な突起を備えた当て金を有して形成された接地部を具備
したことを特徴とする電子機器筐体。 、（２）少くとも一方に突起を有する２枚の当て金が接
続部により断面Ｕ字形に構成され一方におね−じを挿通
する穴、他方の対応する位置１にめねじバーリング部を
有することを特徴とする実用新案登録請求の範囲第１項
に記載の電子機器筐体。(1) Equipped with a grounding part formed with a stopper having a protrusion that can penetrate the insulating layer existing on the inner and outer surfaces of the conductive plastic material that makes up the casing and come into contact with the internal conductive layer. An electronic device housing featuring: (2) Two pads having a protrusion on at least one side are configured to have a U-shaped cross section by a connecting portion, one has a hole through which a screw is inserted, and the other has a female thread burring portion at the corresponding position 1. An electronic device casing according to claim 1 of the utility model registration claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4496984U JPS60158798U (en) | 1984-03-30 | 1984-03-30 | electronic equipment housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4496984U JPS60158798U (en) | 1984-03-30 | 1984-03-30 | electronic equipment housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60158798U true JPS60158798U (en) | 1985-10-22 |
Family
ID=30558037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4496984U Pending JPS60158798U (en) | 1984-03-30 | 1984-03-30 | electronic equipment housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60158798U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016063103A (en) * | 2014-09-19 | 2016-04-25 | 本田技研工業株式会社 | Manufacturing method of ground structure and ground structure |
-
1984
- 1984-03-30 JP JP4496984U patent/JPS60158798U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016063103A (en) * | 2014-09-19 | 2016-04-25 | 本田技研工業株式会社 | Manufacturing method of ground structure and ground structure |
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