JPS60158765U - Hybrid IC - Google Patents
Hybrid ICInfo
- Publication number
- JPS60158765U JPS60158765U JP4508784U JP4508784U JPS60158765U JP S60158765 U JPS60158765 U JP S60158765U JP 4508784 U JP4508784 U JP 4508784U JP 4508784 U JP4508784 U JP 4508784U JP S60158765 U JPS60158765 U JP S60158765U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- shape
- recorded
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のハイブリッドIC実装図でaは正面、b
は側面をあられす。第2図は本考案の実施例でaは正面
、bは側面、Cは上面をあられ、 す。
1:ハイブリッドIC本体、2ニブリント基板、5:本
考案によるハイブリッドIC折り曲げリード、6:ハイ
ブリッドICリードはんだ付はパターン。Figure 1 is a conventional hybrid IC mounting diagram, where a is the front and b
hail on the sides. Figure 2 shows an embodiment of the present invention, where a shows the front, b shows the side, and C shows the top. 1: Hybrid IC body, 2 Niblint board, 5: Hybrid IC bent lead according to the present invention, 6: Hybrid IC lead soldering pattern.
Claims (1)
互にL字形などの形状に折り曲げ、それによって自立性
を保持できるようにしたことを特徴とするハイブリッド
IC0Hybrid IC0 is characterized in that the soldering leads of the hybrid IC are alternately bent into an L-shape or other shape, thereby maintaining independence.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4508784U JPS60158765U (en) | 1984-03-30 | 1984-03-30 | Hybrid IC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4508784U JPS60158765U (en) | 1984-03-30 | 1984-03-30 | Hybrid IC |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60158765U true JPS60158765U (en) | 1985-10-22 |
Family
ID=30558269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4508784U Pending JPS60158765U (en) | 1984-03-30 | 1984-03-30 | Hybrid IC |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60158765U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5316866A (en) * | 1976-07-29 | 1978-02-16 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit |
-
1984
- 1984-03-30 JP JP4508784U patent/JPS60158765U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5316866A (en) * | 1976-07-29 | 1978-02-16 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit |
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