JPS60158765U - Hybrid IC - Google Patents

Hybrid IC

Info

Publication number
JPS60158765U
JPS60158765U JP4508784U JP4508784U JPS60158765U JP S60158765 U JPS60158765 U JP S60158765U JP 4508784 U JP4508784 U JP 4508784U JP 4508784 U JP4508784 U JP 4508784U JP S60158765 U JPS60158765 U JP S60158765U
Authority
JP
Japan
Prior art keywords
hybrid
shape
recorded
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4508784U
Other languages
Japanese (ja)
Inventor
出村 等
Original Assignee
日立電子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立電子株式会社 filed Critical 日立電子株式会社
Priority to JP4508784U priority Critical patent/JPS60158765U/en
Publication of JPS60158765U publication Critical patent/JPS60158765U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のハイブリッドIC実装図でaは正面、b
は側面をあられす。第2図は本考案の実施例でaは正面
、bは側面、Cは上面をあられ、  す。 1:ハイブリッドIC本体、2ニブリント基板、5:本
考案によるハイブリッドIC折り曲げリード、6:ハイ
ブリッドICリードはんだ付はパターン。
Figure 1 is a conventional hybrid IC mounting diagram, where a is the front and b
hail on the sides. Figure 2 shows an embodiment of the present invention, where a shows the front, b shows the side, and C shows the top. 1: Hybrid IC body, 2 Niblint board, 5: Hybrid IC bent lead according to the present invention, 6: Hybrid IC lead soldering pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ハイブリッドICにおいて、はんだ付は部のリードを交
互にL字形などの形状に折り曲げ、それによって自立性
を保持できるようにしたことを特徴とするハイブリッド
IC0
Hybrid IC0 is characterized in that the soldering leads of the hybrid IC are alternately bent into an L-shape or other shape, thereby maintaining independence.
JP4508784U 1984-03-30 1984-03-30 Hybrid IC Pending JPS60158765U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4508784U JPS60158765U (en) 1984-03-30 1984-03-30 Hybrid IC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4508784U JPS60158765U (en) 1984-03-30 1984-03-30 Hybrid IC

Publications (1)

Publication Number Publication Date
JPS60158765U true JPS60158765U (en) 1985-10-22

Family

ID=30558269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4508784U Pending JPS60158765U (en) 1984-03-30 1984-03-30 Hybrid IC

Country Status (1)

Country Link
JP (1) JPS60158765U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316866A (en) * 1976-07-29 1978-02-16 Mitsubishi Electric Corp Method of producing hybrid integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316866A (en) * 1976-07-29 1978-02-16 Mitsubishi Electric Corp Method of producing hybrid integrated circuit

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