JPS60157255A - Photosemiconductor device - Google Patents

Abstract

PURPOSE:To obtain the titled device excellent in oscillation resistance without the positional shift of a light guide off the photo receiving plane by a method wherein a ring that fixes the light guide by positioning is fixed around the photo receiving plane of a photosemiconductor element. CONSTITUTION:The titled device is provided with the ring 21 fixed around the photo receiving plane 9 of said element and then guiding the light guide 10. After the element is formed by using the ring 21, e.g. of mortar form in the top and with a hole-diameter D of the degree that the light emission end of the guide 10 is tightly fitted, the ring 21 is fixed around the photo receiving plane 9 of the element with adhesive or the like and then connected to the guide 10, resulting in the completion of assembly. Thereby, since the ring 21 is of mortar form in the top and the element is guided and fixed so that the light guide 10 may be fitted to a circle of the hole-diameter D during assembly, the assembly becomes facilitated. Besides, this device has the structure of holding the light emission surfaces of the light guide 10 at an optimum position, and of fixing and supporting them at a required position after assembly, and is therefore highly resistant to a lateral oscillation.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an optical semiconductor device in which the light receiving surface of an optical semiconductor element and a light guide are easily aligned and fixed in a predetermined position.

[Prior art]

FIG. 1 is a schematic cross-sectional view of a very common optical trigger thyristor. In this figure, 1 is a cathode, 2 is a cathode flange, 3 is an optical coupling terminal, 4 is an insulating casing, 5 is an anode flange,
6 is an anode, and each of the parts 1 to 6 above constitutes a package. Reference numeral 7 denotes a silicon wafer which has been subjected to a predetermined treatment, and 8 a metal reinforcing plate bonded to the silicon wafer T using a brazing material. Reference numeral 9 denotes a light receiving surface of the enment, 10 a light guide made of, for example, quartz glass, one end of which is fixed to the package through an optical coupling terminal 3, one end surface of which is exposed outside the package, and the other end surface of which is fixed to the package through an optical coupling terminal 3. faces the light-receiving surface 9 of the enment. Hereinafter, the assembly of the above-mentioned optical trigger scissor will be explained.

First, the cathode 1 is fixed to the insulating casing 4 via the cathode flange 2, and then fixed to the insulating casing 4 via the light guide 10' and the original coupling terminal 3. Cathode made as above 1. In an insulating housing 4 with a cathode flange 21, a connecting terminal 3, and a light guide 10, an enment (manufactured by a known method) is placed so that the light-receiving surface 9 and one end surface of the light guide 10 face each other. The optical trigger thyristor is completed by fitting the anode 6 and fixing it by an appropriate method, and then fixing the anode 6 to the insulating casing 4 via the anode flange 5. terminal 3
The light guide 10 receives an optical signal from a light source connected to the
It can be turned on by supplying the optical signal to the light receiving surface 9 of the element through the light receiving surface 9 of the element, and has the same function as an electric trigger thyristor except that it is turned on by the optical signal. However, in order to trigger with the original signal, precise alignment of the light emitting surface of the light guide 1o and the light receiving surface 9 of the element is required, which makes assembly of the optical trigger thyristor more difficult than that of the electric trigger thyristor. . For example, in the assembly described above, since the cathode 1 faces the surface where the light receiving surface 9 of the enment exists, the light receiving surface 9 and the light guide 1o may be hidden behind the cathode 1 during alignment. Visual alignment is difficult. In addition, the optical trigger thyristor made in this way also has an internal light guide 1o fixed to the insulating casing 4 at one end; for example, when applying lateral vibration to the optical trigger thyristor, The other end of the light guide 1o vibrates, causing instantaneous positional deviation between the original light emitting end surface and the light receiving surface 9. For this reason, there have been drawbacks such as the possibility of using the optically triggered sensor in places where vibration may occur.

[Summary of the invention]

This invention was made in order to eliminate the drawbacks of the conventional ones as described above, and by fixing a light guide alignment ring in contact with the periphery of the light receiving surface of the enement of a light trigger thyristor, The present invention provides an optical semiconductor device that facilitates alignment of a light guide and a light receiving surface.

[Embodiments of the invention]

FIGS. 2(a) and 2(b) are a plan view and a sectional view showing an additional example of the present invention. In these figures, 21 is a ring that guides the light guide 10Y and has a dome-like upper surface. This ring 210 hole diameter is light guide 1
The size is such that the output end of the 0 light fits perfectly.

Although aluminum alloy is used as the material for the ring 21 in the embodiment, there is no particular specification of the material, and if electrical insulation is required, porcelain may be used. The assembly of the device will be explained below with reference to FIG.

After the enment is formed, the ring 21 is fixed around the light receiving surface 9 of the enment with an adhesive or the like, and the light guide 1 is attached.
0 and complete the assembly.

The ring 21 according to the present invention has a dovetail-shaped upper surface, and when assembled, the light guide 10 is guided and fixed so that it fits into the circle of the hole diameter.
Assembly becomes easier. Moreover, since the light guide 10 has a structure in which the light emitting end face is held at an optimal position and fixedly supported at a predetermined position even after assembly, it has strong resistance to the above-mentioned lateral vibration.

FIGS. 4(a) and 4(b) are a plan view and a cross-sectional view, with parts omitted, of another embodiment of the present invention. In these figures, reference numeral 22 denotes a ring that guides the light guide 10, and its upper surface and fixing surface are in the shape of a dovetail. The hole diameter of this ring 220 is large enough to fit the light emitting end of the light guide 10. Reference numeral 23 is a refractive index matching agent that increases the optical coupling efficiency between the light guide 10 and the enment, and is inserted between the fixed surface of the ring 22 and the light receiving surface 9 as shown in FIG.

The ring 22 according to the present invention uses the refractive index matching agent 23 and can suppress air bubbles between the light guide 10 and the refractive index matching agent 23 that occur when the light guide 10 is connected to the ring 22, so that optical coupling is possible. It has a shape that can increase efficiency. In addition, the ring 21 and 22 are made of resin, for example, a Teflon seat.
The coefficient of friction at that portion is reduced, the sliding is improved, and the light guide 10v can be brought into alignment with the light receiving surface 9 more smoothly than the light guide 10v. Furthermore, since the fixing surface of the ring 22 is larger than that of the ring 21, the attachment is not limited to any location.

Note that although the above embodiments have been explained using an optical trigger thyristor as an example, the present invention is not limited to this; any optical semiconductor device may be used as long as it includes an element, a light guide, and a package.

〔Effect of the invention〕

As explained above, in this invention, a ring for positioning and fixing the light guide is fixed around the light-receiving surface of the optical semiconductor element, so there is no misalignment between the light guide and the light-receiving surface, and it has excellent vibration resistance. In addition, since the fixed surface of this ring and the surface on which the light guide is guided are concentric with the ring's inner diameter and have a beveled shape, and these surfaces are coated with 7-tsun resin, the frictional resistance is reduced. , the light guide and the light-receiving surface can be easily aligned.

[Brief explanation of the drawing]

Figure 1 is a schematic cross-sectional view of a conventional optically triggered thyristor;
Figures (a) and (b) are a plan view and a cross-sectional view showing one embodiment of the present invention, and Figure 3 is a schematic cross-sectional view of an optical trigger cyrisk to which the ring of Figures 2 (a) and (b) is applied. , Figure 4 (a
) and (b) are a plan view and a sectional view showing another embodiment of the present invention, and FIG. 5 is FIG. 4(a). (b) is a schematic diagram of a light-triggered cyrisk to which a ring fire is applied. In the figure, 1 is a cathode, 2 is a cathode flange, 3 is an optical coupling terminal,
4 is an insulating casing, 5 is an anode flange, 6 is an anode, 7 is a silicon wafer, 8 is a reinforcing plate, 9 is a light receiving surface, 10 is a light guide, 21 and 22 are rings, and 23 is a refractive index matching agent. be. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Ohmaki (2 others) Figure 1 Figure 2 Figure 4

Claims (1)

[Claims] () An optical semiconductor element that performs a predetermined operation to prevent signal loss/reception, a package that protects the optical semiconductor element), and a package that protects the optical semiconductor element from the outside of this package. an optical semiconductor device comprising a light guide that receives an optical signal to transmit the optical signal to a light receiving section of the optical semiconductor element, and a ring that is fixed around the light receiving surface of the optical semiconductor element and guides the light guide; An optical semiconductor device characterized by providing: (2) The optical semiconductor device according to claim (1), wherein the fixing surface of the ring and the surface for guiding the light guide are formed into a dome shape concentric with the inner diameter of the ring. (3) The optical semiconductor device according to claim 11, wherein the surface of the ring that guides the light guide is coated with a fluororesin.