JPS6015489U - Solder paste filled packaging - Google Patents

Solder paste filled packaging

Info

Publication number
JPS6015489U
JPS6015489U JP10656983U JP10656983U JPS6015489U JP S6015489 U JPS6015489 U JP S6015489U JP 10656983 U JP10656983 U JP 10656983U JP 10656983 U JP10656983 U JP 10656983U JP S6015489 U JPS6015489 U JP S6015489U
Authority
JP
Japan
Prior art keywords
solder paste
filled packaging
paste filled
filled
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10656983U
Other languages
Japanese (ja)
Inventor
石井　銀弥
奥谷　健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10656983U priority Critical patent/JPS6015489U/en
Publication of JPS6015489U publication Critical patent/JPS6015489U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例のはんだペースト充填包装体
の一部の切欠き斜視図、第２図は他の実施例のはんだペ
ースト充填包装体の分解斜視図である。 図中、２，５は包装体としてのプラスチックス・フィル
ム（又はシート）、押し出し用チューブ、３ははんだペ
ーストである。FIG. 1 is a partially cutaway perspective view of a solder paste-filled package according to one embodiment of the present invention, and FIG. 2 is an exploded perspective view of a solder paste-filled package according to another embodiment. In the figure, 2 and 5 are a plastic film (or sheet) as a packaging body, an extruded tube, and 3 is a solder paste.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] はんだペーストを包装体により空間を残すことなく充填
して密着包装し、はんだペーストを外界の空気と遮断し
たことを特徴とするはんだペースト充填包装体。1. A solder paste-filled package characterized in that solder paste is filled into the package without leaving any space and tightly packaged, and the solder paste is isolated from the outside air.
JP10656983U 1983-07-11 1983-07-11 Solder paste filled packaging Pending JPS6015489U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10656983U JPS6015489U (en) 1983-07-11 1983-07-11 Solder paste filled packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10656983U JPS6015489U (en) 1983-07-11 1983-07-11 Solder paste filled packaging

Publications (1)

Publication Number Publication Date
JPS6015489U true JPS6015489U (en) 1985-02-01

Family

ID=30249339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10656983U Pending JPS6015489U (en) 1983-07-11 1983-07-11 Solder paste filled packaging

Country Status (1)

Country Link
JP (1) JPS6015489U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009006329A (en) * 2007-05-29 2009-01-15 Hideo Kai Brazing set

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170157A (en) * 1974-12-17 1976-06-17 Meiji Puranto Kogyo Kk Aruminiumurozaino sankahimakuboshiho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170157A (en) * 1974-12-17 1976-06-17 Meiji Puranto Kogyo Kk Aruminiumurozaino sankahimakuboshiho

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009006329A (en) * 2007-05-29 2009-01-15 Hideo Kai Brazing set

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