JPS60154678A - Sense of pressure sensor - Google Patents
Sense of pressure sensorInfo
- Publication number
- JPS60154678A JPS60154678A JP59011588A JP1158884A JPS60154678A JP S60154678 A JPS60154678 A JP S60154678A JP 59011588 A JP59011588 A JP 59011588A JP 1158884 A JP1158884 A JP 1158884A JP S60154678 A JPS60154678 A JP S60154678A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- type
- strain gauge
- wirings
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013078 crystal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 7
- 238000001514 detection method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Pressure Sensors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の属する技術分野〕
本葬、明は半梼体即結晶からなり一4電形の表面層に逆
導電形の初数のストレンゲージ領域が形成された感圧ネ
1り造体の複数個が上にアレイ状に配置され、各感圧構
造体に力が加わった時にストレンゲージからなるブリッ
ジに生ずる出力電圧により感圧構造体に加わる力の3成
分の大きさの面分布を検出する圧覚センサに関する。[Detailed description of the invention] [Technical field to which the invention pertains] The present invention is a pressure-sensitive device made of a semi-transparent crystal, in which an initial strain gauge region of opposite conductivity type is formed on a surface layer of 14-conductivity type. A plurality of strain gauges are arranged in an array on top, and when a force is applied to each pressure-sensitive structure, the output voltage generated in the bridge made of strain gauges determines the magnitude of the three components of the force applied to the pressure-sensitive structure. The present invention relates to a pressure sensor that detects the surface distribution of pressure.
各種物体を取シ扱うロボットハンドにおいて、物体の種
類に応じた適正な把持力で物体を扱うだめには、把持力
すなわちロボットハンドのフィンガに掛かる荷重の大き
さとその分布を精密に検出して把持力を制御しなければ
ならない。そのような目的で第1図に示すような小形の
圧覚センサ単位セルが提案され、面状分布の検出にはこ
の単もIセルあるいは2個の単位セルからなる感圧モジ
ュ・−ルをアレイ状に配列して圧覚センサをI!(成す
る。In a robot hand that handles various objects, in order to handle the object with the appropriate gripping force depending on the type of object, the gripping force, that is, the magnitude and distribution of the load applied to the fingers of the robot hand, must be precisely detected and gripped. Power must be controlled. For such a purpose, a small pressure sensor unit cell as shown in Fig. 1 has been proposed, and to detect a planar distribution, an array of pressure sensor modules consisting of a single I cell or two unit cells is used. The pressure sensors are arranged in the shape of I! (To be accomplished.)
この単位セルは、例えはN形シリコン単結晶からなるリ
ング状感圧構造体1の受圧面11に垂直の面の表面1ら
拡散により12個のP形ストレングージ領域21,22
.23をへ成し受圧面1]に対向する底面13によシ支
持体に固定したものである。This unit cell has 12 P-type strong regions 21, 22 formed by diffusion from the surface 1 of the ring-shaped pressure-sensitive structure 1, which is perpendicular to the pressure-receiving surface 11, made of, for example, N-type silicon single crystal.
.. 23 and is fixed to a support by the bottom surface 13 facing the pressure receiving surface 1.
ストレンゲージ21で構成されるブリッジの出力↑L圧
によシ受圧面11に加わる力の受圧面に伸「1方向成分
Fz、ストレンゲ・−ジ22で組成されるブリッジの出
力霜、圧によシ受圧面J1に平行な方向の1成分Fx、
ストレンゲージ23で構成されるブリッジの出力電圧に
よシ残りの1成分Fyを検出する。このようなブリッジ
の出力信号は増幅部に入力されるが、各単位セルあるい
は感圧モジュールからの出力(Q号の取り出シフ、およ
びそれらへの人力の供給のための配線を少なくするため
に入力の供給および出カイ8号の取り出しを単位セルあ
るいはモジュールごとにスキャンニングできるようにす
ることが望ましい。The output of the bridge composed of the strain gauge 21 ↑L is applied to the pressure receiving surface 11 due to the unidirectional component Fz, and the output frost of the bridge composed of the strain gauge 22 is One component Fx in the direction parallel to the pressure receiving surface J1,
The remaining one component Fy is detected based on the output voltage of the bridge constituted by the strain gauge 23. The output signal of such a bridge is input to the amplification section, but the output signal from each unit cell or pressure-sensitive module (in order to reduce the wiring for taking out the Q and supplying human power to them) It is desirable to be able to scan input supply and output output for each unit cell or module.
本発明の目的はそのようなスキャンニングを容易にでき
配線を少なくし7た圧覚センサを提供することを目的と
する。An object of the present invention is to provide a pressure sensor that facilitates such scanning and reduces wiring.
本発明によれは、圧覚センサの単位セルの感圧構造体に
アナログスイッチが集積され、入出力配線中に接続され
ることによって上記の目的が達せられる。アナログスイ
ッチとしてはMOS)ランジスタを形成することが有利
である。According to the present invention, the above object is achieved by integrating an analog switch in the pressure sensitive structure of a unit cell of a pressure sensor and connecting it to the input/output wiring. It is advantageous to form the analog switch as a MOS transistor.
第2図、第3図は本発明の実施例を示し、この場合は単
結晶半導体として基板の両面に異なる導電形のエピタキ
シャル層を備えたシリコン板を用い、一方の面のエピタ
キシャル層にFz検出用ブリッジを、他方の面のエピタ
キシャル層にFxおよびFy検出用のブリッジを形成し
、たものである。第2図に示した感圧構造体の表面12
にはストレンゲージ領域21のほかにその中間の子の小
さい領域に出力端子Zに接続されるアナログスイッチ3
1゜32、入力端子Vに接続されるアナログスイッチ3
3が形成されている。このアナログスイッチは第4図に
示しだようにMOS )ランジスタとして形成されてい
る。すなわちP形シリコン基板41上に設けられたN形
エピタキシャル層42中にP形波散層43が形成され、
さらにその中にN+形のソース、ドレイン層44が形成
されている。シリコン板表面は酸化膜45で覆われ、そ
の上にゲートt、極46が設けられ、NチャネルMO8
)ランジスタ3が構成される。一方、ストレンゲージf
Jl 域UP形拡散N47により形成され、とれとの接
続は金属薄膜配IM5によp接続されている。接地配線
として利用される基板4工への接続はP形波散層48で
行われる。この接地部は第2図、第3図では小円6で表
わされている。第3図は裏面14を示し、出力端子X、
Yに接続されるアナログスイッチ34〜37および入力
端子Vに接続されるアナログスイッチ38が表面と同様
に歪の小さい左右中間部に形成されている。2 and 3 show an embodiment of the present invention. In this case, a silicon plate is used as a single crystal semiconductor and has epitaxial layers of different conductivity types on both sides of the substrate, and Fz detection is applied to the epitaxial layer on one side. A bridge for detecting Fx and Fy is formed in the epitaxial layer on the other side. Surface 12 of the pressure sensitive structure shown in FIG.
In addition to the strain gauge area 21, there is an analog switch 3 connected to the output terminal Z in a small area in the middle thereof.
1゜32, analog switch 3 connected to input terminal V
3 is formed. This analog switch is formed as a MOS transistor, as shown in FIG. That is, a P-type wave dispersion layer 43 is formed in an N-type epitaxial layer 42 provided on a P-type silicon substrate 41,
Further, an N+ type source/drain layer 44 is formed therein. The surface of the silicon plate is covered with an oxide film 45, on which a gate t and a pole 46 are provided, and an N-channel MO8
) A transistor 3 is configured. On the other hand, the strain gauge f
It is formed by the Jl region UP type diffusion N47, and the connection with the groove is p-connected by the metal thin film interconnection IM5. Connection to the substrate 4 used as ground wiring is made by a P-type wave dispersion layer 48. This grounding portion is represented by a small circle 6 in FIGS. 2 and 3. FIG. 3 shows the back side 14, with output terminals X,
Analog switches 34 to 37 connected to Y and an analog switch 38 connected to input terminal V are formed in the left and right intermediate portions where distortion is small, similar to the front surface.
第4図に示すMOS )ランジスタ3はグー14極46
に正の電圧を印加した場合に導通するが、第5図に示す
ようにエピタキシャル層42にm接P+拡散層49によ
りソース、ドレイン層を形成した場合は、ゲート電極4
6に印加される箱、圧が零あるいは負の場合に導通する
。MOS shown in Figure 4) The transistor 3 is 14 poles 46
When a positive voltage is applied to the gate electrode 4, the gate electrode 4 becomes electrically conductive.
When the pressure applied to the box 6 is zero or negative, conduction occurs.
第6図は配線密度の小さいFZ検出用ブリッジ形成面に
アナログスイッチ31〜33および39のほかに温度セ
ンサ7およびそれに直列接続の薄膜抵抗8を形成した実
施例である。第7図は本発明に基づく単位セルを用いた
場合の圧覚センサの回路構成の一例を示し、図中に記入
された符号は本発明の実施例を示した図に記入した符号
の部分に対応する。入力配線51,52、出力配線53
,54゜55に挿入されたアナログスイッチ3を制御部
10よシの信号により順次オン、オフすることによりス
キャンニングして、各単位セルのFx、Fy、Fz検出
用の各ブリッジからの出力信号を順次増幅部20に取り
出す。FIG. 6 shows an embodiment in which, in addition to analog switches 31 to 33 and 39, a temperature sensor 7 and a thin film resistor 8 connected in series thereto are formed on the FZ detection bridge forming surface with a low wiring density. FIG. 7 shows an example of the circuit configuration of a pressure sensor using a unit cell based on the present invention, and the symbols written in the figure correspond to the parts written in the figures showing the embodiments of the present invention. do. Input wiring 51, 52, output wiring 53
, 54 and 55 are sequentially turned on and off by a signal from the control unit 10 to perform scanning and output signals from each bridge for detecting Fx, Fy, and Fz of each unit cell. are sequentially taken out to the amplifying section 20.
本発明は圧覚センサ単位セルの感圧’fPi 、+S体
にアナログスイッチを配設したもので、単位セルあるい
は感圧モジュールへの入力の供給および出力(U号の取
り出しがスキャンニング可能となυ、単位セルのストレ
ンゲージ部と信号処理部との間の配線数が大幅に減少す
るので、多数のセルを内蔵するアレイ状圧覚センサの構
成が極めて容易になる。In the present invention, an analog switch is provided on the pressure-sensitive 'fPi, +S body of a pressure-sensitive sensor unit cell, and it is possible to supply input to the unit cell or pressure-sensitive module and output (retrieval of the U number) by scanning υ Since the number of wires between the strain gauge section and the signal processing section of a unit cell is greatly reduced, it is extremely easy to construct an array pressure sensor incorporating a large number of cells.
第1図は圧覚センサ単位セルの感圧構造体の斜視図、第
2図は本発明の一実施例の感圧構造体表面の平面図、第
3図は同じく裏面の平面図、第4図は本発明によるアナ
ログスイッチの一実施例を示す感圧構造体太部断面図、
第5図はアナログスイッチの別の実施例を示す感圧構造
体の衆部陣1面図、第6図は本発明の異なる実施例の感
圧構造体表面の乎面図、第7図は本発明の実施例の圧覚
センサの回路図である。
J・・・・・感圧構う6体、2.1.22.23・・・
・・・ストレンゲージ領域、3. 31.32. 33
.34. 35.36.37゜38.39・・・・・
アナログスイッチ、5・・・・・・配線。
z
第1図
f2図
謂′3区
牙4図
才j閃
7.7ノ!
判′乙図FIG. 1 is a perspective view of a pressure sensitive structure of a pressure sensor unit cell, FIG. 2 is a plan view of the surface of the pressure sensitive structure according to an embodiment of the present invention, FIG. 3 is a plan view of the back side, and FIG. 4 is a sectional view of a thick part of a pressure-sensitive structure showing an embodiment of an analog switch according to the present invention;
FIG. 5 is a front view of the various parts of the pressure-sensitive structure showing another embodiment of the analog switch, FIG. 6 is a top view of the surface of the pressure-sensitive structure of a different embodiment of the present invention, and FIG. FIG. 2 is a circuit diagram of a pressure sensor according to an embodiment of the present invention. J...6 pressure-sensitive bodies, 2.1.22.23...
. . . strain gauge region, 3. 31.32. 33
.. 34. 35.36.37゜38.39...
Analog switch, 5... Wiring. z 1st figure f2 figure so-called '3 ward fang 4 figure sai j flash 7.7 no! size 2
Claims (1)
形の複数のストレンゲージ領域が形成された感圧構造体
の複数個がアレイ状に配置され、各感圧構造体に力が加
わった簡にストレンゲージからなるブリッジに生する出
力像、圧により加わった力の3成分の大きさの面分布を
検出するものにおいて、#I■、、構造体にアナログス
イッチが年払され、入出力配線中に接わ“「さねたこと
を特徴とする圧覚センサ。■) A plurality of pressure-sensitive structures made of semiconductor J\crystal and having a plurality of strain gauge regions of opposite conductivity type formed on a surface layer of one conductivity type are arranged in an array, and a force is applied to each pressure-sensitive structure. In a device that detects the surface distribution of the magnitude of the three components of the force applied due to the output image produced on the bridge consisting of a strain gauge and pressure, #I■, an analog switch is installed in the structure, A pressure sensor that features a "grooved" contact during input/output wiring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59011588A JPS60154678A (en) | 1984-01-25 | 1984-01-25 | Sense of pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59011588A JPS60154678A (en) | 1984-01-25 | 1984-01-25 | Sense of pressure sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60154678A true JPS60154678A (en) | 1985-08-14 |
JPH0446463B2 JPH0446463B2 (en) | 1992-07-30 |
Family
ID=11782058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59011588A Granted JPS60154678A (en) | 1984-01-25 | 1984-01-25 | Sense of pressure sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60154678A (en) |
-
1984
- 1984-01-25 JP JP59011588A patent/JPS60154678A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0446463B2 (en) | 1992-07-30 |
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