JPS60151148U - thick film circuit board - Google Patents

thick film circuit board

Info

Publication number
JPS60151148U
JPS60151148U JP3912984U JP3912984U JPS60151148U JP S60151148 U JPS60151148 U JP S60151148U JP 3912984 U JP3912984 U JP 3912984U JP 3912984 U JP3912984 U JP 3912984U JP S60151148 U JPS60151148 U JP S60151148U
Authority
JP
Japan
Prior art keywords
circuit board
thick film
film circuit
trimming
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3912984U
Other languages
Japanese (ja)
Other versions
JPH046221Y2 (en
Inventor
真之 長谷川
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP3912984U priority Critical patent/JPS60151148U/en
Publication of JPS60151148U publication Critical patent/JPS60151148U/en
Application granted granted Critical
Publication of JPH046221Y2 publication Critical patent/JPH046221Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は本考案による厚膜回路基板の異なる
二つの実施例をそれぞれ示す平面図である。 １・・・基板、８，８′及び８ａ〜８ｄ・・・電極導体
、９及び９ａ〜９ｄ・・・表示用抵抗体。1 and 2 are plan views respectively showing two different embodiments of the thick film circuit board according to the present invention. 1... Substrate, 8, 8' and 8a-8d... Electrode conductor, 9 and 9a-9d... Display resistor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に所望の回路を構成する抵抗体パターンを形成し
、その抵抗体パターンに対してトリミングを行なって抵
抗値の調整を行なう回路基板に於いて、基板上の所定個
所に表示用抵抗体及びその両端部に位置する電極導体を
形成し、前記トリミングの結果に関する情報をトリミン
グ装置による前記表示用抵抗体の切断の有無によって表
示するようにしたことを特徴とする厚膜回路基板。In a circuit board in which a resistor pattern constituting a desired circuit is formed on a substrate, and the resistance value is adjusted by trimming the resistor pattern, display resistors and A thick film circuit board, characterized in that electrode conductors are formed at both ends thereof, and information regarding the result of the trimming is displayed depending on whether or not the display resistor is cut by a trimming device.
JP3912984U 1984-03-19 1984-03-19 thick film circuit board Granted JPS60151148U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3912984U JPS60151148U (en) 1984-03-19 1984-03-19 thick film circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3912984U JPS60151148U (en) 1984-03-19 1984-03-19 thick film circuit board

Publications (2)

Publication Number Publication Date
JPS60151148U true JPS60151148U (en) 1985-10-07
JPH046221Y2 JPH046221Y2 (en) 1992-02-20

Family

ID=30546788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3912984U Granted JPS60151148U (en) 1984-03-19 1984-03-19 thick film circuit board

Country Status (1)

Country Link
JP (1) JPS60151148U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53136662A (en) * 1977-05-02 1978-11-29 Hitachi Ltd Method of producing thin film ic
JPS6027155A (en) * 1983-07-25 1985-02-12 Nec Corp Thin film hybrid ic substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53136662A (en) * 1977-05-02 1978-11-29 Hitachi Ltd Method of producing thin film ic
JPS6027155A (en) * 1983-07-25 1985-02-12 Nec Corp Thin film hybrid ic substrate

Also Published As

Publication number Publication date
JPH046221Y2 (en) 1992-02-20

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