JPS60147121A - Container for wafer processing - Google Patents

Container for wafer processing

Info

Publication number
JPS60147121A
JPS60147121A JP256384A JP256384A JPS60147121A JP S60147121 A JPS60147121 A JP S60147121A JP 256384 A JP256384 A JP 256384A JP 256384 A JP256384 A JP 256384A JP S60147121 A JPS60147121 A JP S60147121A
Authority
JP
Japan
Prior art keywords
container
resin
wafers
processing
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP256384A
Other languages
Japanese (ja)
Other versions
JPH0638413B2 (en
Inventor
Yoshihisa Goto
善久 後藤
Katsuhiko Ito
伊東　克彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP59002563A priority Critical patent/JPH0638413B2/en
Publication of JPS60147121A publication Critical patent/JPS60147121A/en
Publication of JPH0638413B2 publication Critical patent/JPH0638413B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Abstract

PURPOSE:To obtain a heat-resisting and chemical-proof molding plastic container for silicon wafers to be processed in the manufacture of integrated circuit chips by a method wherein said plastic container is formed using polyether etherketone resin. CONSTITUTION:Polyether etherketone (PEEK) resin is the thermoplastic aromatic resin having the repetitive unit as indicated by the formula separately mentioned, and it has excellent heat-resisting property, chemical-proof property, mechanical characteristics, formability and workability. By using said resin, the molded wafer processing container has excellent dimensional accuracy, and a lightweight quality, high rigidity is maintained at high temperature, and it has also excellent chemical-proof property. The processing of wafers and the conveyance of wafers between each treatment or processing are automated, and much more efficiency is displayed by utilizing robbots. The container is fundamentally formed in such a manner that a plurality of grooves and two opposing panels are provided for the purpose of supporting a plurality of wafers separately. For example, the container is formed by an injection-molding machine at the temperature of 380 deg.C, at the molding mold temperature of 150 deg.C and at the injection pressure of 1,000kg/cm<2>.

Description

【発明の詳細な説明】 本発明は集積回路チップの製造において処理されるシリ
コンウェハ用の成形プラスチック容器に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to molded plastic containers for silicon wafers processed in the manufacture of integrated circuit chips.

シリコンウェハの処理においては、容器はウェハを浸す
液浴に浸される。この液浴は種々の腐食性化学物質を含
み、ある場合は１００〜２００℃と高温である。このた
め処理工程の間シリコンウェハの保持に用いられる容器
は、使用化学物質に対してだけでなく、高い液浴温度に
対しても安定であることが必要である。In processing silicon wafers, the container is immersed in a liquid bath that immerses the wafer. This liquid bath contains various corrosive chemicals and is at high temperatures, in some cases as high as 100-200°C. Therefore, the containers used to hold the silicon wafers during processing must be stable not only to the chemicals used, but also to high bath temperatures.

従来、これ等の容器はパーフルオロアルコキシ置換ポリ
テトラフルオロエチレン樹脂（以下、ＰＦＡ樹脂と略記
する。）で成形されていた。しかしＰＦＡ樹脂で成形さ
れた容器は、高温で軟化し変形し易い、重い、成形時の
収縮が大きく寸法精度が劣る等の欠点を有している。Conventionally, these containers have been molded from perfluoroalkoxy-substituted polytetrafluoroethylene resin (hereinafter abbreviated as PFA resin). However, containers molded from PFA resin have drawbacks such as being easily softened and deformed at high temperatures, being heavy, and having large shrinkage during molding and poor dimensional accuracy.

本発明はかかる欠点をな（した成形プラスチック容器を
得ることを目的とするものである。The object of the present invention is to obtain a molded plastic container which overcomes these drawbacks.

本発明者等は、これ等の課題を達成するために種々検討
した結果、用いるプラスチックとしては、ポリエーテル
エーテルケトン樹脂（以下、ＰＥＥＫ樹脂と略記する。The inventors of the present invention have conducted various studies to achieve these goals, and as a result, the plastic used is polyether ether ketone resin (hereinafter abbreviated as PEEK resin).

）が最適であることを見出し、本発明を完成した。) was found to be optimal, and the present invention was completed.

すなわち、本発明は、ＰＥＥＫ樹脂より成形されたもの
であることを特徴とする集積回路チップの製造における
ウェハ処理用容器である。That is, the present invention is a container for processing wafers in the manufacture of integrated circuit chips, characterized in that the container is molded from PEEK resin.

本発明に於いて用いられるＰＥＥＫ樹脂とは、式（Ｉ）
で表わされる繰返し単位を有する結晶性の熱可塑性芳香
族系樹脂である。The PEEK resin used in the present invention has the formula (I)
It is a crystalline thermoplastic aromatic resin having a repeating unit represented by:

ＰＥＥＫ樹脂は耐熱性、耐薬品性、機械特性、成形加工
性の優れた樹脂であり、これにより成形されたウェハ処
理用容器は、寸法精度が良〜・、軽量である、高温にお
いても高剛性が維持される、耐薬品性が良い等の特徴を
有する。このような特徴は、ウェハの処理および処理工
程間の搬送を自動化し、ロボットで増扱う際に一層効果
を発揮する。PEEK resin is a resin with excellent heat resistance, chemical resistance, mechanical properties, and moldability, and wafer processing containers molded with it have good dimensional accuracy, are lightweight, and have high rigidity even at high temperatures. It has characteristics such as high chemical resistance and good chemical resistance. These features automate the processing of wafers and their transportation between processing steps, making them even more effective when increasing handling with robots.

本発明で言うウェハ処理容器とは、集積回路チップの製
造において処理されるシリコンウェハ用の容器であり、
薬液処理工程、洗浄工程および各工程間の搬送のいづれ
にも使用される。The wafer processing container referred to in the present invention is a container for silicon wafers processed in the manufacture of integrated circuit chips,
It is used in the chemical treatment process, cleaning process, and transportation between each process.

ウェハ処理用容器の形状はとくに規定はないが、基本的
に１ま複数のウニ・・を隔離、支持するための複数の溝
をもつ相対する２枚のパネルを有する。Although the shape of the wafer processing container is not particularly specified, it basically has two facing panels each having a plurality of grooves for isolating and supporting one or more sea urchins.

以下、実施例をあげて本発明を更に説明する。The present invention will be further explained below with reference to Examples.

実施例１ ＰＥＥＫ樹脂’ＶＩＣＴＲＢＸ　ＰＥＥＫ　４５Ｐ”　
（商標、英国ＩＣＩ　社製）を、型締力２００　ｔ　ｏ
ｎの射出成形機により温度３８０℃、金型温度１５０℃
、射出圧力１０００ｋｙｃＩＩＬの条件で成形してウエ
ノ・処理用容器を得た。シリンダー成形品の重量は５９
０ｇであり、外観は良好で光沢のあるウエノ・処理用容
器が得られた。Example 1 PEEK resin 'VICTRBX PEEK 45P'
(trademark, manufactured by ICI, UK) with a mold clamping force of 200 t o
Temperature: 380℃, mold temperature: 150℃ by n injection molding machine
A ueno processing container was obtained by molding at an injection pressure of 1000 kycIIL. The weight of the cylinder molded product is 59
0 g, and a Ueno/processing container with good appearance and gloss was obtained.

ウェハ処理に好適に用いることができた。It could be suitably used for wafer processing.

特許出願人　三井東圧化学株式会社 ♂Patent applicant Mitsui Toatsu Chemical Co., Ltd. ♂

Claims (1)

【特許請求の範囲】 脂 （１１ポリエーテルエーテルケトン樹肪より成形された
ものであることを特徴とする集積回路チップの製造にお
けるウェハ処理用容器[Claims] A container for processing wafers in the production of integrated circuit chips, characterized in that it is molded from resin (11 polyetheretherketone resin)
JP59002563A 1984-01-12 1984-01-12 Wafer processing container Expired - Lifetime JPH0638413B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59002563A JPH0638413B2 (en) 1984-01-12 1984-01-12 Wafer processing container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59002563A JPH0638413B2 (en) 1984-01-12 1984-01-12 Wafer processing container

Publications (2)

Publication Number Publication Date
JPS60147121A true JPS60147121A (en) 1985-08-03
JPH0638413B2 JPH0638413B2 (en) 1994-05-18

Family

ID=11532837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59002563A Expired - Lifetime JPH0638413B2 (en) 1984-01-12 1984-01-12 Wafer processing container

Country Status (1)

Country Link
JP (1) JPH0638413B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247328A (en) * 1986-04-21 1987-10-28 Mitsui Toatsu Chem Inc Holding vessel
JPS62276849A (en) * 1986-05-26 1987-12-01 Mitsui Toatsu Chem Inc Holding container
EP0363480A1 (en) * 1987-10-27 1990-04-18 MITSUI TOATSU CHEMICALS, Inc. Retention vessel
EP0722985A2 (en) * 1995-01-20 1996-07-24 Sumitomo Chemical Company, Limited Polyetherketone resin compositions and carriers for processing and treating semiconductor wafers

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5490296A (en) * 1977-09-07 1979-07-17 Ici Ltd Thermoplastic polyether aromatic ketone
JPS58207651A (en) * 1982-05-28 1983-12-03 Hitachi Ltd Electrostatic preventing type containing jig

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5490296A (en) * 1977-09-07 1979-07-17 Ici Ltd Thermoplastic polyether aromatic ketone
JPS58207651A (en) * 1982-05-28 1983-12-03 Hitachi Ltd Electrostatic preventing type containing jig

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247328A (en) * 1986-04-21 1987-10-28 Mitsui Toatsu Chem Inc Holding vessel
JPS62276849A (en) * 1986-05-26 1987-12-01 Mitsui Toatsu Chem Inc Holding container
JPH0553063B2 (en) * 1986-05-26 1993-08-09 Mitsui Toatsu Chemicals
EP0363480A1 (en) * 1987-10-27 1990-04-18 MITSUI TOATSU CHEMICALS, Inc. Retention vessel
US5455201A (en) * 1987-10-27 1995-10-03 Mitsui Toatsu Chemicals, Inc. Method of manufacturing planar display using a polyether ether ketone holding container
EP0722985A2 (en) * 1995-01-20 1996-07-24 Sumitomo Chemical Company, Limited Polyetherketone resin compositions and carriers for processing and treating semiconductor wafers
EP0722985A3 (en) * 1995-01-20 1997-11-12 Sumitomo Chemical Company Limited Polyetherketone resin compositions and carriers for processing and treating semiconductor wafers

Also Published As

Publication number Publication date
JPH0638413B2 (en) 1994-05-18

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