JPS6014679B2 - Thin film cutting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention cuts thin films made of brittle and malleable materials, such as porcelain materials or plastic materials in a half-dried state before firing, to a fixed size, and also eliminates cuts generated during cutting. The present invention relates to a device that removes powder and loads and takes out a predetermined container in a clean state.

Conventionally, this type of cutting equipment automatically performs the work of applying feed to the thin film to be cut, cutting the thin film, and then stacking the cut thin film in a designated container and taking it out in a clean and precise manner. There is no continuous cutting process, and the worker uses a simple cutting jig consisting of a punch and die to cut each piece one by one, then removes it from the cutting tool using tweezers and cuts it into the required number of pieces. The common method was to stack containers in layers until they reached the desired size.

In such a conventional method, the production is inefficient and slow, and the product is expensive because it is all done manually by the worker.

In addition, methods such as blowing compressed air onto the cutting part have been used to remove chips generated during cutting, but the chips just scatter all over the place, making it impossible to obtain a clean product. Another drawback is that even if the thin film sag during cutting, the cutting operation is continued as is, making it impossible to obtain products with good dimensional accuracy. The purpose of the present invention is to eliminate the above-mentioned drawbacks, to cut the thin film with precision, and then to be able to take it out as a thin layer.
It is an object of the present invention to provide a thin film cutting device that can be easily handled by an operator.

According to the present invention, in an apparatus for cutting a brittle and cohesive thin film, one end surface (hereinafter referred to as the lower end surface)
A punch with a constant cross-sectional shape, which has a plurality of vacuum suction holes on the bottom and a driving source connected to the bottom end surface (hereinafter referred to as the top end surface) coaxial with the bottom end surface, and a punch with a fixed dimension spaced from the bottom end surface of the punch. dies arranged vertically downward facing each other; and a wrinkle presser that is slidable on the outer peripheral surface of the punch, the tip of which slightly protrudes from the lower end surface of the punch, and has a face sucking space in the lower inner surface. , a take-out container disposed below the die and facing the punch; a thin film feeding section disposed near the punch and the die; connected to a vacuum suction hole of the punch and a dust suction space of the wrinkle holder; Thin film cutting characterized by comprising a vacuum source, a mechanism control section that controls the operations of the punch and the thin film feeding section, and a central control section that is connected to the vacuum source and the mechanism control section and controls the overall operation. A device is obtained.

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a detailed diagram for explaining the cutting state of the thin film in an easy-to-understand manner. Figure c is a cross-sectional view showing the state after cutting, Figure d is a cross-sectional view showing the state after lamination, and Figure e is a cross-sectional view showing the state after thin film feeding. In the figure, one river is a thin film.

The punch has a plurality of vacuum suction holes 13 on the lower end surface 12, and the upper end surface 14 is connected to a drive source 15 for vertical movement.

In order to cut the thin film 10 with a die, the die 17 is disposed below the punch 11 and facing each other at a constant interval L.

20 is a wrinkle presser that hangs down on punch 11, and then presses punch 1.
The punch 11 is arranged so as to slightly protrude from the lower end surface 12 of the punch 11 and surround the outer circumferential surface 21 of the punch 11, and has a dust suction space 24 in the lower inner surface 22 for vacuum removing chips 23 of the thin film 10 generated during cutting.

25 is disposed below the die 17 and facing the punch 11 in order to stack the thin films 26 cut in the take-out container.

Reference numeral 27 denotes a thin film feeding section, which is a pair of drive rollers 2 with both ends 28 of the thin film 10 sandwiched therebetween in order to feed the thin film in one direction.
9, a pinch roller 30, and a rotational drive source 31 connected to the drive roller 29.

A vacuum source 33 is connected to the vacuum suction hole 13 of the punch 11 and the dust suction space 24 of the crease presser 20.

A mechanism control section 34 is connected to the drive source 15 and the rotary drive source 29.

A central control section 35 is connected to a vacuum source 33 and a mechanism control section 34, respectively, in order to control the overall operation.

Next, the operation of the embodiment of the present invention configured as above will be explained.

As shown in FIGS. 1 and 2a, the thin film 10 is punched into the punch 1.
1 and the die 17, the central control unit 35
Based on the command, the drive source 15 is activated via the mechanism control section 34, and the punch 11 starts to descend. At this time, punch 11
Since the wrinkle presser 20 hanging down is lowered together, the wrinkle presser 20 comes into contact with the thin film 10 before the lower end surface 12 of the punch 11 and removes the wrinkles of the thin film 10, as shown in FIG. 2B. Wrinkle presser 2 will stop here, but punch 11
continues to descend further and cuts the thin film 10 as shown in FIG. 2c. At the same time as the punch 11 cuts the thin film 10, the vacuum source 33 is activated in response to a command from the central control unit 35, and the cut thin film 26 is vacuum-adsorbed. At the same time, the dust suction space 24
The chips 23 generated when cutting the thin film 10 are removed by vacuum suction. As shown in FIG.
The operation of the vacuum source 33 is stopped at the same time as the punch 11 is transferred to the extraction container 25, and the punch 11 is separated from the lower end surface 12.
will be stored in. When the cut thin film 10 is stored in the take-out container 25, the drive source 15 is activated in response to a command from the mechanism control unit 34, and the punch 11 and the punch 1 are activated as shown in FIG. 2e.
The crease presser foot 2 hanging down from 1 rises again. At the same time as the punch 11 and the wrinkle presser 20 complete their lifting, the rotational drive source 29 is activated in response to a command from the mechanism control unit 34, and the drive roller 28 and pinch roller 31 feed the thin film 10 by a predetermined distance, thereby causing the first The first cutting operation is completed.
Subsequently, the second and subsequent cutting operations are repeated in the same manner as the first cutting operation. The cutting operation continues in this way, but the cut thin film 26 to be stacked on the removal container 25
Since the required number of sheets is known in advance, by setting that value in the central control unit 35, the device will automatically stop and cut when the laminated value and the value set in the central control unit 35 match. The work is finished. As explained above, according to the present invention, the chips generated when cutting the thin film are removed using a vacuum method, and since the thin film is fed without contacting the necessary parts of the thin film, the chips are removed. There is no contamination between the layered thin films, and a clean, high-quality product can be obtained.

In addition, when cutting the thin film, the thin film is cut without sagging, and the cut thin film is transferred by vacuum suction, so that products of uniform quality with good dimensional accuracy are obtained without positional deviation. be able to. Furthermore, since the cutting operation is carried out continuously, production is very efficient, and the cost of the product can be reduced. Therefore, the apparatus of the present invention is easy to operate and can produce high-quality products with high precision efficiently and at low cost, so its effects are significant.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a detailed diagram for explaining the cutting state of the thin film in an easy-to-understand manner. Figure c is a cross-sectional view showing the state after cutting, Figure d is a cross-sectional view showing the state after lamination, and Figure e is a cross-sectional view showing the state after thin film feeding. In the figure, 10 is a thin film, 11 is a punch, 12 is a lower end surface, 13 is a vacuum suction hole, 14 is an upper end surface, 15 is a driving source, 1
7 is a die, 2 rivers presser, 21 is an outer peripheral surface, 22 is an inner lower part, 24 is a dust suction space, 25 is a take-out container, 27 is a thin film feeding section, 33 is a vacuum line, 34 is a mechanism control section, 35 is a center This is the control section. Figure 1 Figure 2

Claims (1)

[Claims] 1. An apparatus for cutting brittle and flexible thin films, which has a plurality of vacuum suction holes on one end surface (hereinafter referred to as the lower end surface), and the other end surface coaxial with the lower end surface (hereinafter referred to as the upper end surface). a punch with a constant cross-sectional shape connected to a drive source (referred to as a wrinkle presser whose tip slightly protrudes from the lower end surface of the punch and has a dust suction space at the lower part of the inner surface; a take-out container disposed below the die and facing the punch; and a portion near the punch and the die. a vacuum source connected to the vacuum suction hole of the punch and the dust suction space of the wrinkle presser, a mechanism control section that controls the operation of the punch and the thin film feed section, and the vacuum source and mechanism control unit. What is claimed is: 1. A thin film cutting device comprising: a central control section that is connected to the central control section and controls the overall operation;