JPS60146365U - 発光ダイオ−ドアレイヘツド - Google Patents
発光ダイオ−ドアレイヘツドInfo
- Publication number
- JPS60146365U JPS60146365U JP1984034544U JP3454484U JPS60146365U JP S60146365 U JPS60146365 U JP S60146365U JP 1984034544 U JP1984034544 U JP 1984034544U JP 3454484 U JP3454484 U JP 3454484U JP S60146365 U JPS60146365 U JP S60146365U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode array
- array head
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来のＬＥＤアレイヘッドの構成を示した図で
あり、第２図は本考案の一実施例を示した図である。 図において、１，７は基板、２は負荷抵抗、３１．３２
．３３はポンディングパッド、４に給電線、５はＬＥＤ
アレイチップ、６はドライバチップである。
あり、第２図は本考案の一実施例を示した図である。 図において、１，７は基板、２は負荷抵抗、３１．３２
．３３はポンディングパッド、４に給電線、５はＬＥＤ
アレイチップ、６はドライバチップである。
Claims (2)
- （１）基板上に複数の発光ダイオードを有する発光ダイ
オードアレイチップを複数千鳥状、あるいは−列状に配
列した発光ダイオードアレイヘッドにおいて、上記発光
ダイオードアレイチップに近接して駆動用チップを配置
し、上記発光ダイオードアレイチップ上のホンディング
パッドと上記駆動用チップ上のポンディングパッドとを
直接接続したことを特徴とする発光ダイオードアレイヘ
ッド。 - （２）発光ダイオードアレイチップまたは駆動用チップ
のすくなくともいずれか一方が各発光ダイオードの発光
出力を安定化させる負荷抵抗を有していることを特徴と
する実用新案登録請求の範囲第１項記載の発光ダイオー
ドアレイヘッド。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984034544U JPS60146365U (ja) | 1984-03-09 | 1984-03-09 | 発光ダイオ−ドアレイヘツド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984034544U JPS60146365U (ja) | 1984-03-09 | 1984-03-09 | 発光ダイオ−ドアレイヘツド |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60146365U true JPS60146365U (ja) | 1985-09-28 |
Family
ID=30538010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984034544U Pending JPS60146365U (ja) | 1984-03-09 | 1984-03-09 | 発光ダイオ−ドアレイヘツド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60146365U (ja) |
-
1984
- 1984-03-09 JP JP1984034544U patent/JPS60146365U/ja active Pending
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