JPS60145298A - Flux for hardly solderable base metal - Google Patents
Flux for hardly solderable base metalInfo
- Publication number
- JPS60145298A JPS60145298A JP25070883A JP25070883A JPS60145298A JP S60145298 A JPS60145298 A JP S60145298A JP 25070883 A JP25070883 A JP 25070883A JP 25070883 A JP25070883 A JP 25070883A JP S60145298 A JPS60145298 A JP S60145298A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- soldering
- difficult
- acid salt
- amine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 58
- 239000010953 base metal Substances 0.000 title claims abstract description 7
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 24
- 239000010959 steel Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000012190 activator Substances 0.000 claims abstract description 15
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 12
- 239000010935 stainless steel Substances 0.000 claims abstract description 12
- -1 amine hydrofluoric acid salt Chemical class 0.000 claims abstract description 6
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 claims abstract description 6
- 150000001412 amines Chemical class 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 claims description 44
- 229910000679 solder Inorganic materials 0.000 claims description 22
- FVPCNTIZTYPTAZ-UHFFFAOYSA-N cyclohexylazanium;fluoride Chemical compound F.NC1CCCCC1 FVPCNTIZTYPTAZ-UHFFFAOYSA-N 0.000 claims description 15
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 11
- GFKPETVGJZJVHZ-UHFFFAOYSA-N propan-2-amine;hydrofluoride Chemical compound F.CC(C)N GFKPETVGJZJVHZ-UHFFFAOYSA-N 0.000 claims description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical class Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 claims description 2
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 claims description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims 1
- 150000003840 hydrochlorides Chemical class 0.000 claims 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 24
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 24
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 24
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002253 acid Substances 0.000 abstract description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical class Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract description 2
- 150000003839 salts Chemical class 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009972 noncorrosive effect Effects 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- NRTLTGGGUQIRRT-UHFFFAOYSA-N triethylazanium;bromide Chemical compound [Br-].CC[NH+](CC)CC NRTLTGGGUQIRRT-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-N N,N-Diethylethanamine Substances CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- ZVVSSOQAYNYNPP-UHFFFAOYSA-N olaflur Chemical compound F.F.CCCCCCCCCCCCCCCCCCN(CCO)CCCN(CCO)CCO ZVVSSOQAYNYNPP-UHFFFAOYSA-N 0.000 description 1
- 229960001245 olaflur Drugs 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- DSISTIFLMZXDDI-UHFFFAOYSA-N propan-1-amine;hydrofluoride Chemical compound F.CCCN DSISTIFLMZXDDI-UHFFFAOYSA-N 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000003021 water soluble solvent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、ステンレス鋼、アルミニウム鍍金鋼、クロ
メート処理鋼等の難はんだ付は母材のはんだ付けに使用
する難はんだ付は母材用フラ・7クスに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flux 7 for use in difficult-to-solder base materials such as stainless steel, aluminum-plated steel, and chromate-treated steel.
最近の電子工業や通信機器に用いられる部品材料には、
耐候性や耐蝕性を重視する処から、ステンレス鋼や、ア
ルミニウム鍍金あるいはクロメート処理鋼等が用いられ
ているが、これらの材料はその表面が強固な酸化膜で覆
われているため、通常の方法では、はんだ付けが困難で
ある。Part materials used in recent electronic industries and communication equipment include:
Stainless steel, aluminum-plated or chromate-treated steel, etc. are used because weather resistance and corrosion resistance are important, but since the surface of these materials is covered with a strong oxide film, it is difficult to use conventional methods. This makes soldering difficult.
このような難はんだ付は母材のはんだ付けを行うには、
周知の如く、燐酸あるいは弗酸のような強酸を主剤とし
た強酸フラックス又はこれらの塩化物を主剤とした水溶
性フラックスを使用してはんだ付けを行うのが一般的で
あった。For such difficult soldering, it is necessary to solder the base material.
As is well known, soldering has generally been carried out using a strong acid flux containing a strong acid such as phosphoric acid or hydrofluoric acid as a main ingredient, or a water-soluble flux containing a chloride of these acids as a main ingredient.
しかしながら、これらのフラックスの残渣は腐食性を有
するので、水洗などの後処理を必要とし、当然のことな
がら、水洗処理後の廃液処理施設の増設などに多大の費
用を要する他、水洗の不可能な電子機器部品には不適当
である等の欠点を有していた。However, since these flux residues are corrosive, they require post-treatment such as washing with water. Naturally, this requires a great deal of cost to add waste liquid treatment facilities after washing, and it is impossible to wash with water. However, it has disadvantages such as being unsuitable for electronic equipment parts.
このため、ステンレス鋼、アルミニウム鍍金あるいはク
ロメート処理鋼等の難はんだ付は母材用の非腐食性フラ
ックスを開発することが強く要望され、既に数種の樹脂
系フラックスが公知となっている。しかしながら、この
ような樹脂系フラックスは、必ずしも前記要望を十分満
足し得るものではなかった。すなわち、樹脂系フラック
スに要求される条件は、第1にフラックスの活性剤が樹
脂に容易に相溶することであり、第2にはんだ付けが十
分に行われることであり、第3に残渣に腐食性がないこ
とであり、さらに第4に製法が容易であることなどであ
る。°ところが、前記従来の樹脂系フラックスでは、そ
の成分であるフラックス基剤としてのロジンとフラック
ス活性剤との相溶あるいは混和を計ることができず、ロ
ジンにフラックス活性剤が著しく偏在して、やに人はん
だ状にしたときに、ある個所ではんだ付けが可能である
が、他の個所では、はんだ付けが困難となるなどのバラ
ツキを生じたり、はんだ付は後の残渣に腐食が発生する
ものもあり、品質的には、必ずしも満足し得るものでは
なかった。これらの主原因は、フラックス活性剤がフラ
ックス基剤であるロジンに完全に相溶されていないこと
に基づくものである。For this reason, there is a strong demand for the development of non-corrosive fluxes for base metals that are difficult to solder such as stainless steel, aluminum plated or chromate-treated steel, and several types of resin-based fluxes are already known. However, such resin-based fluxes have not necessarily been able to fully satisfy the above requirements. In other words, the conditions required for resin-based fluxes are: firstly, the activator of the flux must be easily compatible with the resin, secondly, soldering can be carried out satisfactorily, and thirdly, there must be no residue. It is non-corrosive, and fourthly, it is easy to manufacture. However, in the conventional resin-based flux, it is not possible to ensure compatibility or miscibility of the flux activator with the rosin as a flux base component, and the flux activator is extremely unevenly distributed in the rosin. When it is soldered manually, it may be possible to solder in some places, but it may be difficult to solder in other places, or the soldering may cause corrosion in the residue after soldering. However, the quality was not necessarily satisfactory. The main reason for this is that the flux activator is not completely dissolved in the rosin, which is the flux base.
このため、本発明者等は、フラックス基剤例えばロジン
に相溶する安定したフラックス活性剤を得るために、種
々の実験を行った結果、前記能はんだ付は母材の表面に
、有機アミンの弗化水素酸塩を介在せしめてはんだ付け
を行うと、極めて迅速に母材表面の酸化膜を除去して良
好なはんだ付けを行うことができることを見いだした。For this reason, the present inventors conducted various experiments in order to obtain a stable flux activator that is compatible with a flux base such as rosin. It has been found that when soldering is performed with a hydrofluoride salt present, the oxide film on the surface of the base material can be removed extremely quickly and good soldering can be achieved.
しかも、この有機アミン弗化水素酸塩は、加熱溶融して
WWロジンに添加することによって容易に相溶し、これ
を冷却してロジンが固化した後にも析出することがなく
、その外観は、褐色透明の安定した状態を示すことが判
明し、ここにこの発明を提供するに至ったものである。Moreover, this organic amine hydrofluoride is easily compatible with WW rosin by heating and melting it and adding it to WW rosin, and does not precipitate even after cooling and solidifying the rosin, and its appearance is It was found that it exhibits a stable brown-transparent state, which led to the provision of the present invention.
したがって、この発明によれば、シクロヘキシルアミン
弗化水素酸塩、イソプロピルアミン弗化水素酸塩等の有
機アミン弗化水素酸塩を活性剤として使用してはんだ付
は用フラックスを製造することにより、ステンレス鋼、
アルミニウム鍍金鋼等の難はんだ付は母材に対するはん
だ付けを容易に行うことができると共に、残渣に腐食性
が無く、しかも、製法が容易である難はんだ付は母材用
フラックスを提供することができるものである。Therefore, according to the present invention, by producing a soldering flux using an organic amine hydrofluoride such as cyclohexylamine hydrofluoride or isopropylamine hydrofluoride as an activator, stainless steel,
For difficult-to-solder materials such as aluminum-plated steel, it is possible to easily solder to the base material, and the residue is not corrosive, and the manufacturing method is easy. It is possible.
以下、この発明の詳細な説明する。The present invention will be explained in detail below.
〔実施例1〕
フラックス基剤としてのWWロジン95重量%に対して
、活性剤としてのシクロヘキシルアミン弗化水素酸塩(
CHA HF)を5重量%添加して難はんだ付は母材用
フラックスを製造した。この実施例1によると、表1に
示すように、ステンレス鋼及びアルミニウム鍍金鋼に対
しては普通にはんだ付けを行うことができるが、クロメ
ート処理鋼に対してはその表面酸化物を有機アミン系弗
化水素酸塩では除去することができず、はんだ付けを行
うことができない。[Example 1] Cyclohexylamine hydrofluoride (as an activator) was added to 95% by weight of WW rosin as a flux base.
A flux for a base material that is difficult to solder was manufactured by adding 5% by weight of CHA HF). According to this Example 1, as shown in Table 1, stainless steel and aluminum-plated steel can be soldered normally, but chromate-treated steel can be soldered with organic amine-based oxides on the surface. It cannot be removed with hydrofluoride and cannot be soldered.
なお、この実施例1において、WWロジンに対するシク
ロヘキシルアミン弗化水素酸塩の割合を変化させたとき
のステンレス鋼、アルミニウム鍍金鋼及びクロメート処
理鋼についてのはんだ付は性を下記表2に示す。In this Example 1, the soldering properties of stainless steel, aluminum plated steel, and chromate-treated steel are shown in Table 2 below when the ratio of cyclohexylamine hydrofluoride to WW rosin was varied.
ここで、記号×は、はんだ付は不能
記号△は、はんだ付は可能
記号Oは、はんだ付は良好
を夫々示す。この表2から明らかなように、ロジンに対
するシクロヘキシルアミン弗化水素酸塩の添加量を増加
させることにより、クロメート処理鋼に対してもはんだ
付けが可能になることが理解される。Here, the symbol x indicates that soldering is impossible, the symbol Δ indicates that soldering is possible, and the symbol O indicates that soldering is good. As is clear from Table 2, it is understood that by increasing the amount of cyclohexylamine hydrofluoride added to the rosin, it becomes possible to solder even chromate-treated steel.
〔実施例2〕
フラックス基剤としてのWWロジン95重量%に対して
、活性剤としてのイソプロピルアミン弗化水素酸塩(I
PA 1(F)を5重量%添加して蝋はんだ付は母材用
フラックスを製造した。この実施例2によると、表1に
示すように、実施例1と全く同様のはんだ付は性を得る
ことができた。[Example 2] Isopropylamine hydrofluoride (I) as an activator was added to 95% by weight of WW rosin as a flux base.
A flux for base material for wax soldering was manufactured by adding 5% by weight of PA 1(F). According to this Example 2, as shown in Table 1, it was possible to obtain exactly the same soldering properties as in Example 1.
〔実施例3〕
フラックス基剤としてのWWロジン95重量%に対して
、活性剤としてのシクロヘキシルアミン弗化水素酸塩を
4重量%、モノエタノールアミン(MEA )を1重量
%添加して難はんだ付は用フラー ックスを製造した。[Example 3] To 95% by weight of WW rosin as a flux base, 4% by weight of cyclohexylamine hydrofluoride as an activator and 1% by weight of monoethanolamine (MEA) were added to make it difficult to solder. At the same time, we manufactured flux for use.
この実施例3によると、表1に示すように、ステンレス
鋼、アルミニウム鍍金鋼及びクロメート処理鋼具に比較
的良好なはんだ付けを行うことができた。According to this Example 3, as shown in Table 1, relatively good soldering could be performed on stainless steel, aluminum-plated steel, and chromate-treated steel fittings.
なお、実施例3において、WWロジンに対するシクロヘ
キシルアミン弗化水素酸塩(CHA HF)及びモノエ
タノ−名ア1ミン(MEA )の割合を変化させたとき
のステンレス鋼、アルミニウム鍍金鋼及びクロメート処
理鋼のはんだ付は性とロジンの状態を下記表3に示す。In addition, in Example 3, when the ratio of cyclohexylamine hydrofluoride (CHAHF) and monoethanolamine (MEA) to WW rosin was changed, the results of stainless steel, aluminum-plated steel, and chromate-treated steel were The soldering properties and rosin conditions are shown in Table 3 below.
紅
ここで、記号○は、はんだ付は良好
記号◎は、はんだ付は極めて良好
を夫々示す。これらの例がら明らかなようにシクロヘキ
シルアミン弗化水素酸塩の添加量を増加し、さらにモノ
エタノールアミン(MRA )を添加することにより、
フラックスによるはんだ付は効果をより向上させること
ができる。Here, the symbol ○ indicates that the soldering is good, and the symbol ◎ indicates that the soldering is extremely good. As is clear from these examples, by increasing the amount of cyclohexylamine hydrofluoride and further adding monoethanolamine (MRA),
Soldering with flux can further improve the effect.
〔実施例4〕
フラックス基剤としてのWWロジン94重量%に対して
、シクロヘキシルアミン弗化水素酸塩を4重量%、ジェ
タノールアミンを2重量%を添加して難はんだ付は用フ
ラックスを製造した。この実施例4によると、表1に示
すように、前記実施例3と全く同様のはんだ付は性を得
ることができた。[Example 4] A flux for difficult soldering was produced by adding 4% by weight of cyclohexylamine hydrofluoride and 2% by weight of jetanolamine to 94% by weight of WW rosin as a flux base. did. According to this Example 4, as shown in Table 1, exactly the same soldering properties as in Example 3 could be obtained.
〔実施例5〕
フラックス基剤としてのWWロジン91重量%に対して
、シクロヘキシルアミン弗化水素酸塩を4重量%、モノ
エタノールアミンを5重量%添加して難はんだ付は用フ
ラックスを製造した。この実施例5によると、表1に示
すように、ステンレス鋼、アルミニウム鍍金鋼及びクロ
メート処理鋼の全てについて極めて良好なはんだ付けを
行うことができた。[Example 5] A flux for difficult soldering was produced by adding 4% by weight of cyclohexylamine hydrofluoride and 5% by weight of monoethanolamine to 91% by weight of WW rosin as a flux base. . According to this Example 5, as shown in Table 1, extremely good soldering could be performed on all stainless steel, aluminum plated steel, and chromate treated steel.
〔実施例6〕
フラックス基剤としてのWWロジン90重量%に対して
、シクロヘキシルアミン弗化水素酸塩を4重量%1.モ
ノエタノールアミンを2重量%、トリエチルアミン臭化
水素酸塩(TEA Her )を4重量%添加して難は
んだ付はフラックスを製造した。[Example 6] 4% by weight of cyclohexylamine hydrofluoride was added to 90% by weight of WW rosin as a flux base. A difficult-to-solder flux was prepared by adding 2% by weight of monoethanolamine and 4% by weight of triethylamine hydrobromide (TEA Her).
この実施例?によると、表1に示すように、ステンレス
鋼、アルミニウム鍍金鋼及びクロメート処理鋼の全てに
ついて極めて良好なはんだ付けを行うことができた。こ
の場合、有機アミン系弗化水素酸塩は、分解点が低いた
め、はんだ付は温度によっては、はんだの拡がりが持続
しないことがある。このため、この実施例のように、有
機アミンの塩酸塩又は臭化水素酸塩を添加することによ
り、これら添加物と弗化水素酸塩との相乗効果によって
、難はんだ付は母材のはんだ付けを最良の状態で行うこ
とができる。This example? According to Table 1, very good soldering was possible for all stainless steel, aluminum plated steel, and chromate-treated steel. In this case, organic amine hydrofluoride salts have a low decomposition point, so depending on the temperature, the solder may not continue to spread during soldering. Therefore, by adding organic amine hydrochloride or hydrobromide as in this example, the synergistic effect of these additives and hydrofluoride makes it difficult to solder the base material. The attachment can be done in the best condition.
〔実施例7〕 フラックス基剤としてのWWロジン63重量% 。[Example 7] 63% by weight of WW rosin as flux base.
に対して、変性ロジンを27重量%、シクロヘキシルア
ミン弗化水素酸塩を4重量%、モノエタノールアミンを
2重量%及びトリエチルアミン臭化水素塩を4重量%添
加して難はんだ付は用フランクスを製造した。この実施
例7によると、前記実施例6と同様に難はんだ付は母材
に対して極めて良好なはんだ付けを行うことができた。To this, 27% by weight of modified rosin, 4% by weight of cyclohexylamine hydrofluoride, 2% by weight of monoethanolamine, and 4% by weight of triethylamine hydrobromide were added to make Franks for difficult soldering. Manufactured. According to this Example 7, as in Example 6, extremely good soldering to the base material could be performed even though it was difficult to solder.
この場合、シクロヘキシルアミン、イソプロピルアミン
等の有機アミン系弗化水素酸塩とアルカノールアミンの
配合によって製造された難はんだ付は用フラックスは、
難はんだ付は母材に対して良好なはんだの「ぬれ性」を
呈するが、アルカノールアミンが液体であるために、そ
の重量%を増加させると、難はんだ付は用フラックスの
性状が軟化して被はんだ母材に対する塗布性能を低下さ
せることになるが、この実施例のように、WWロジンよ
り軟化点の高い変性ロジンを添加することにより、適度
の硬度の雛はんだつけ用フラックスを得ることができる
。In this case, a difficult-to-solder flux manufactured by combining an organic amine hydrofluoride such as cyclohexylamine or isopropylamine with an alkanolamine is
For difficult soldering, the solder exhibits good "wettability" to the base material, but since alkanolamine is a liquid, increasing its weight percentage softens the properties of the flux used for difficult soldering. Although this will reduce the coating performance on the base material to be soldered, as in this example, by adding a modified rosin with a higher softening point than WW rosin, it is possible to obtain a flux for chick soldering with appropriate hardness. can.
〔実施例8〕
フラックス基剤としてエチルセロソルブ25g1カルピ
トール25gを相溶させた有機溶剤に対してシクロヘキ
シルアミン弗化水素酸塩5g及びモノエタノールアミン
5gを添加して難はんだ付は母材用フラックスを製造し
た。この実施例によると、WWロジンをフラックス基剤
としたときの実施例3と同様に各難はんだ付は母材に対
するはんだ付は性が極めて良好であった。この場合、フ
ラックスの性状は非水溶性を有する。また、エチルセロ
ソルブは沸点が低いため、単独でフラックス基剤として
使用することができないが、カルビト、−−ルは沸点が
高いので、単独でフラックス基剤として使用することが
できる。この他、フラックス基剤としては、イソプロピ
ルアルコール等の有機溶剤を適用することができる。[Example 8] As a flux base, 5 g of cyclohexylamine hydrofluoride and 5 g of monoethanolamine were added to an organic solvent in which 25 g of ethyl cellosolve and 25 g of calpitol were dissolved, and a flux for the base material was used for difficult soldering. Manufactured. According to this example, similar to Example 3 when WW rosin was used as the flux base, each difficult-to-solder case had extremely good soldering properties to the base material. In this case, the flux has water-insoluble properties. Further, since ethyl cellosolve has a low boiling point, it cannot be used alone as a flux base, whereas carbitol has a high boiling point, so it can be used alone as a flux base. In addition, organic solvents such as isopropyl alcohol can be used as the flux base.
〔実施例9〕
フラックス基剤としてグリセリン25g1ポリエチレン
グリコール25gを相溶させた水溶性溶剤に対してシク
ロヘキシルアミン弗化水素酸塩5g及びモノエタノール
アミン5gを添加し、これらを混和させて難はんだ付は
母材用フラックスを製造した。この実施例によると、前
記実施例8と同様に各難はんだ付は母材に対するはんだ
付は性が極めて良好であった。[Example 9] 5 g of cyclohexylamine hydrofluoride and 5 g of monoethanolamine were added to a water-soluble solvent in which 25 g of glycerin and 25 g of polyethylene glycol were mixed as a flux base, and these were mixed to make it difficult to solder. manufactured flux for base metal. According to this example, as in Example 8, the soldering properties of each difficult-to-solder material to the base material were extremely good.
なお、各実施例において、はんだ付は後の残液は非腐食
性を呈する。In each example, the residual liquid after soldering exhibits non-corrosive properties.
l土 ここで、記号×は、はんだ付は不能 記号○は、はんだ付は良好 記号◎は、はんだ付は極めて良好 を夫々示す。l soil Here, the symbol × means that soldering is not possible. Symbol ○ indicates good soldering. Symbol ◎ indicates extremely good soldering. are shown respectively.
以上説明したように、この発明によれば、活性剤として
シクロヘキシルアミン弗化水素酸塩、プロピルアミン弗
化水素酸塩等の有機アミン弗化水・ 素酸塩を使用して
雌はんだ付は用フラックスを得るようにしたので、ロジ
ン等のフラックス基剤と有機アミン弗化水素酸塩でなる
活性剤とが相溶して有機アミン弗化水素酸塩が偏在する
ことがなく、したがって、ステンレス鋼、アルミニウム
鍍金鋼、クロメート処理鋼等の難はんだ付は母材に対す
るはんだ付けを良好に行うことができると共に、はんだ
付は後の残渣が腐食性を有することがなく、しかも、製
造が容易であり、難はんだ付は用フラックスとして要求
される条件を全て満足し得る難−はんだ付は母材用フラ
ックスを得ることができる効果を有する。As explained above, according to the present invention, female soldering can be performed using organic amine fluoride/hydrochloride such as cyclohexylamine hydrofluoride or propylamine hydrofluoride as an activator. Since the flux is obtained, the flux base such as rosin and the activator made of organic amine hydrofluoride are compatible with each other, and the organic amine hydrofluoride is not unevenly distributed. Difficult-to-solder materials such as aluminum plated steel, chromate-treated steel, etc. can be soldered well to the base metal, and the residue after soldering does not have corrosive properties, and it is easy to manufacture. Difficult soldering has the effect of being able to obtain a base metal flux that satisfies all the requirements for a flux for use in difficult soldering.
Claims (1)
処理鋼等の難はんだ付は母材のはんだ付けに使用する難
はんだ付は母材用フラックスにおいて、活性剤として、
イソプロピルアミン弗化水素酸塩、シクロヘキシルアミ
ン弗化水素酸塩等の有機アミン弗化水素酸塩を使用した
ことを特徴とする難はんだ付は母材用フラックス。 (2)第111項記載のフラックスに、モノエタノール
アミン、ジェタノールアミン、トリエタノールアミンの
1種又は2種以上を添加して相溶してなる特許請求の範
囲第+11項記載の難はんだ付は母材用フラックス。 (3)第(1)項又は第(2)項記載のフラックスに、
エチルアミン、イソプロピルアミン、シクロヘキシルア
ミン等の有機アミンの塩化水素酸塩又は臭化水素酸塩の
1種又は2種以上を添加して相溶させてなる特許請求の
範囲第(11項又は第(2)項記載の難はんだ付は母材
用フラックス。[Claims] (11) As an activator in a flux for difficult-to-solder base materials such as stainless steel, aluminum-plated steel, and chromate-treated steel,
A flux for base materials that is difficult to solder and is characterized by the use of organic amine hydrofluorides such as isopropylamine hydrofluoride and cyclohexylamine hydrofluoride. (2) Difficult-soldering according to claim 11, which is obtained by adding one or more of monoethanolamine, jetanolamine, and triethanolamine to the flux according to claim 111 and making them compatible with each other. is a flux for the base material. (3) The flux described in paragraph (1) or (2),
Claim No. 11 or (2) wherein one or more hydrochlorides or hydrobromides of organic amines such as ethylamine, isopropylamine, and cyclohexylamine are added and dissolved. Difficult soldering described in ) is for base metal flux.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25070883A JPS60145298A (en) | 1983-12-29 | 1983-12-29 | Flux for hardly solderable base metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25070883A JPS60145298A (en) | 1983-12-29 | 1983-12-29 | Flux for hardly solderable base metal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60145298A true JPS60145298A (en) | 1985-07-31 |
Family
ID=17211862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25070883A Pending JPS60145298A (en) | 1983-12-29 | 1983-12-29 | Flux for hardly solderable base metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60145298A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102366861A (en) * | 2011-06-27 | 2012-03-07 | 吴江市精工铝字制造厂 | Soldering flux for welding aluminum alloy |
CN107009052A (en) * | 2012-06-11 | 2017-08-04 | 千住金属工业株式会社 | Solder flux composition, liquid soldering flux, rosin core slicken solder and soldering paste |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4879745A (en) * | 1972-01-14 | 1973-10-25 | ||
JPS4978655A (en) * | 1972-12-04 | 1974-07-29 | ||
JPS5020957A (en) * | 1973-06-27 | 1975-03-05 | ||
JPS52128860A (en) * | 1976-04-22 | 1977-10-28 | Senju Metal Industry Co | Activator for soldering flux |
JPS54109048A (en) * | 1978-02-16 | 1979-08-27 | Nippon Almit Kk | Solder flux for fe*ni*cr and alloy thereof |
-
1983
- 1983-12-29 JP JP25070883A patent/JPS60145298A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4879745A (en) * | 1972-01-14 | 1973-10-25 | ||
JPS4978655A (en) * | 1972-12-04 | 1974-07-29 | ||
JPS5020957A (en) * | 1973-06-27 | 1975-03-05 | ||
JPS52128860A (en) * | 1976-04-22 | 1977-10-28 | Senju Metal Industry Co | Activator for soldering flux |
JPS54109048A (en) * | 1978-02-16 | 1979-08-27 | Nippon Almit Kk | Solder flux for fe*ni*cr and alloy thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102366861A (en) * | 2011-06-27 | 2012-03-07 | 吴江市精工铝字制造厂 | Soldering flux for welding aluminum alloy |
CN107009052A (en) * | 2012-06-11 | 2017-08-04 | 千住金属工业株式会社 | Solder flux composition, liquid soldering flux, rosin core slicken solder and soldering paste |
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