JPS6014523U - surface acoustic wave device - Google Patents

surface acoustic wave device

Info

Publication number
JPS6014523U
JPS6014523U JP10542983U JP10542983U JPS6014523U JP S6014523 U JPS6014523 U JP S6014523U JP 10542983 U JP10542983 U JP 10542983U JP 10542983 U JP10542983 U JP 10542983U JP S6014523 U JPS6014523 U JP S6014523U
Authority
JP
Japan
Prior art keywords
surface acoustic
acoustic wave
wave device
substrate
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10542983U
Other languages
Japanese (ja)
Inventor
小貫 光太
弘 小島
Original Assignee
日本電信電話株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電信電話株式会社 filed Critical 日本電信電話株式会社
Priority to JP10542983U priority Critical patent/JPS6014523U/en
Publication of JPS6014523U publication Critical patent/JPS6014523U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図はそれぞれ本考案を適用した一実施
例を示す断面図である。 1・・・基板、2・・・ケース、3・・・接着部、4・
・・空隙部、5・・・接触部。
FIG. 1 and FIG. 2 are sectional views each showing an embodiment to which the present invention is applied. 1... Board, 2... Case, 3... Adhesive part, 4...
...Void part, 5...Contact part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 弾性表面波が伝播する基板と、該基板の少くとも一部を
固着材により固着して収納するケースとを具備した弾性
表面波装置において、前記基板を接触支持する前記ケー
スの少くとも一部を切除して空隙部を設けたことを特徴
とする弾性表面波装置。
In a surface acoustic wave device comprising a substrate on which surface acoustic waves propagate, and a case in which at least a part of the substrate is fixed and housed with an adhesive material, at least a part of the case that contacts and supports the substrate is provided. A surface acoustic wave device characterized in that a cavity is provided by cutting.
JP10542983U 1983-07-08 1983-07-08 surface acoustic wave device Pending JPS6014523U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10542983U JPS6014523U (en) 1983-07-08 1983-07-08 surface acoustic wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10542983U JPS6014523U (en) 1983-07-08 1983-07-08 surface acoustic wave device

Publications (1)

Publication Number Publication Date
JPS6014523U true JPS6014523U (en) 1985-01-31

Family

ID=30247122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10542983U Pending JPS6014523U (en) 1983-07-08 1983-07-08 surface acoustic wave device

Country Status (1)

Country Link
JP (1) JPS6014523U (en)

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