JPS60145007U - Synthetic resin chip manufacturing equipment - Google Patents
Synthetic resin chip manufacturing equipmentInfo
- Publication number
- JPS60145007U JPS60145007U JP3242784U JP3242784U JPS60145007U JP S60145007 U JPS60145007 U JP S60145007U JP 3242784 U JP3242784 U JP 3242784U JP 3242784 U JP3242784 U JP 3242784U JP S60145007 U JPS60145007 U JP S60145007U
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- space
- nozzle
- heat insulating
- chip manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案にかかるチップ製造装置の一実施例を示
す正面図、第２図は同装置のダイスとカッタボックスの
一実施例を示す部分拡大断面図、第３図は同装置のダイ
スとカッタボックスとを分離した状態を示す部分拡大断
面図、第４図は同装置のダイスとカッタボックスの連結
部分の拡大斜′親図、第５図は第２図の■−Ｖ線断面図
、゛第６図は押し出された合成樹脂を切断量る状態の説
明図、第７図は同装置のシール部の他の実施例を示す部
分拡大断面図、第８図は同装置の基準突合面の他の実施
例を示す部分拡大断面図である。
１：ホッパ、２：押出棒、３：ダイス、４；カッタボッ
クス、５：駆動機構、６：給水パイプ、７：排出パイプ
、８：分離機、１０：ノズル、１１．４１：基準突合面
、１２：シール部、３０：カッタ、３１：空間部、３３
：空洞部、３４：給 ゛水孔、３５：排出孔、３
６：シール部、３７：断熱弾性シール材。FIG. 1 is a front view showing an embodiment of a chip manufacturing apparatus according to the present invention, FIG. 2 is a partially enlarged cross-sectional view showing an embodiment of the die and cutter box of the same apparatus, and FIG. 3 is a die of the same apparatus. FIG. 4 is an enlarged oblique view of the connecting portion of the die and cutter box of the same device, and FIG. 5 is a cross-sectional view taken along the line ■-V in FIG. 2. , ゛Figure 6 is an explanatory diagram of the state in which the extruded synthetic resin is cut and weighed, Figure 7 is a partially enlarged sectional view showing another embodiment of the sealing part of the same device, and Figure 8 is a reference butt of the same device. FIG. 7 is a partially enlarged sectional view showing another example of the surface. 1: Hopper, 2: Extrusion rod, 3: Die, 4: Cutter box, 5: Drive mechanism, 6: Water supply pipe, 7: Discharge pipe, 8: Separator, 10: Nozzle, 11.41: Reference abutment surface, 12: Seal part, 30: Cutter, 31: Space part, 33
: Cavity, 34: Water supply hole, 35: Discharge hole, 3
6: Seal portion, 37: Heat insulating elastic sealing material.
Claims (1)
と、前記ノズル１０が開口する側の端面１５に形成した
断熱層１６とを備えたダイス３と、 よ品み霊！＝＝詰τに て形成される空間部３１と、この空間部３１内に刃部が
前記断熱層１６に近接して設けられ前記ノズル１０から
押し出された棒状の合成樹脂を連続してチップに切断す
るカッタ３０と、前記空間部３１に水を供給する給水部
３４と、前記空間部３１からチップとともに水を排出す
る排出部３５とを備えたカッタボックス４とから成り、
前記ダイス３とカッタボックス４は、相互に突き合され
て相対的な位置決めをする基準突き合せ−面１１．４１
を有するとともに、両者間の水密性を維持するシール部
１２．３６を前記基準突合面１１．４１とは別個の個所
に有し、前記シール部１２．３６に断熱弾性シール材３
７を設けたことを特徴とする合成樹脂チップの製造装置
。[Claims for Utility Model Registration] Nozzle 10 that continuously extrudes molten synthetic resin into a rod shape
and a heat insulating layer 16 formed on the end face 15 on the side where the nozzle 10 opens, and the die 3. ==A space 31 is formed by the thread τ, and a blade is provided in this space 31 close to the heat insulating layer 16, and the rod-shaped synthetic resin extruded from the nozzle 10 is continuously formed into chips. It consists of a cutter 30 for cutting, a water supply section 34 for supplying water to the space 31, and a cutter box 4 equipped with a discharge section 35 for discharging water together with chips from the space 31,
The die 3 and the cutter box 4 are butted against each other to determine their relative position at a reference abutment surface 11.41.
and a seal portion 12.36 for maintaining watertightness between the two at a location separate from the reference abutting surface 11.41, and a heat insulating elastic sealing material 3 is provided in the seal portion 12.36.
7. A synthetic resin chip manufacturing apparatus characterized by being provided with 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3242784U JPS60145007U (en) | 1984-03-07 | 1984-03-07 | Synthetic resin chip manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3242784U JPS60145007U (en) | 1984-03-07 | 1984-03-07 | Synthetic resin chip manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60145007U true JPS60145007U (en) | 1985-09-26 |
| JPS6350087Y2 JPS6350087Y2 (en) | 1988-12-22 |
Family
ID=30533930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3242784U Granted JPS60145007U (en) | 1984-03-07 | 1984-03-07 | Synthetic resin chip manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60145007U (en) |
-
1984
- 1984-03-07 JP JP3242784U patent/JPS60145007U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350087Y2 (en) | 1988-12-22 |
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