JPS60142036U - wafer jacket plate - Google Patents

wafer jacket plate

Info

Publication number
JPS60142036U
JPS60142036U JP1984029864U JP2986484U JPS60142036U JP S60142036 U JPS60142036 U JP S60142036U JP 1984029864 U JP1984029864 U JP 1984029864U JP 2986484 U JP2986484 U JP 2986484U JP S60142036 U JPS60142036 U JP S60142036U
Authority
JP
Japan
Prior art keywords
groove
jacket plate
intake
wafer
spiral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984029864U
Other languages
Japanese (ja)
Inventor
定夫 杉山
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP1984029864U priority Critical patent/JPS60142036U/en
Publication of JPS60142036U publication Critical patent/JPS60142036U/en
Pending legal-status Critical Current

Links

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案にかかるウェハチャックプレートの一例
を示す平面図、第2図は第1図中A−A線に沿う断面図
、第3図は第1図の中央部拡大図、第4図は従来例を示
す平面図である。 1・・・・・・プレート本体、2・・・・・・吸引溝、
3・・・・・・排気溝、4・・・・・・通気孔、5・・
・・・・吸気口。
FIG. 1 is a plan view showing an example of a wafer chuck plate according to the present invention, FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1, FIG. 3 is an enlarged view of the center of FIG. The figure is a plan view showing a conventional example. 1...Plate body, 2...Suction groove,
3...Exhaust groove, 4...Vent hole, 5...
...Intake port.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プレート本体の表面に、略中央部を吸気口に連通した螺
旋状吸気溝と、吸気溝に対し溝条間を平行して旋回し外
周端を本体外側面に開口させた螺旋状排気溝とを形成し
てなるウエハチャックプレート。
On the surface of the plate body, there are provided a spiral intake groove whose approximately central portion communicates with the intake port, and a spiral exhaust groove whose outer circumferential end is opened on the outer surface of the main body by turning parallel to the groove between the grooves with respect to the intake groove. Wafer chuck plate made by forming.
JP1984029864U 1984-02-29 1984-02-29 wafer jacket plate Pending JPS60142036U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984029864U JPS60142036U (en) 1984-02-29 1984-02-29 wafer jacket plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984029864U JPS60142036U (en) 1984-02-29 1984-02-29 wafer jacket plate

Publications (1)

Publication Number Publication Date
JPS60142036U true JPS60142036U (en) 1985-09-20

Family

ID=30529052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984029864U Pending JPS60142036U (en) 1984-02-29 1984-02-29 wafer jacket plate

Country Status (1)

Country Link
JP (1) JPS60142036U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0788761A (en) * 1993-09-21 1995-04-04 Sumitomo Sitix Corp Holding plate for polishing semiconductor substrate
JP2011044474A (en) * 2009-08-19 2011-03-03 Disco Abrasive Syst Ltd Grinding device for wafer
JP2020181871A (en) * 2019-04-24 2020-11-05 キヤノン株式会社 Substrate holding apparatus, lithography apparatus, and manufacturing method of article

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0788761A (en) * 1993-09-21 1995-04-04 Sumitomo Sitix Corp Holding plate for polishing semiconductor substrate
JP2011044474A (en) * 2009-08-19 2011-03-03 Disco Abrasive Syst Ltd Grinding device for wafer
JP2020181871A (en) * 2019-04-24 2020-11-05 キヤノン株式会社 Substrate holding apparatus, lithography apparatus, and manufacturing method of article

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