JPS60140798A - Electronic device containing unit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to an electronic device unit that integrates electronic devices such as electronic exchanges and large computers with cable wiring, cooling equipment, and the like.

<Technical Background> An electronic exchange is constructed by combining a plurality of Mo-Zola units, which constitute a modular unit having a predetermined function by a plurality of electronic circuit packages (printed boards) equipped with various electronic elements. Such electronic exchanges are installed outdoors, in factories, offices, indoors, etc. under various environmental conditions, but in order to effectively utilize the functions of each modular unit, each modular unit must be operated in the optimal environment. is necessary. When installing such an electronic exchange, it is desirable that it be easy to install without adding indoor air conditioning equipment or modifying the installation floor.

<Prior art and problems> When installing a conventional N1 slave switch, a free access floor is formed in advance on the floor of the installation location for arranging cables and cooling air ducts, etc. Since the electronic exchange machine was installed on the floor, installation work on site was troublesome. Furthermore, the cooling capacity of the electronic exchange must be adjusted according to the surrounding environment, making setting work time-consuming.

<Objective of the Invention> The present invention has been made in view of the drawbacks of the prior art described above, and an object of the present invention is to provide an electronic equipment housing unit that is easy to install and that allows electronic equipment to always operate in an optimal state regardless of environmental conditions. purpose.

<Structure of the Invention> In order to achieve this object, in the present invention, a casing is constructed with a heat insulating and shielding tunnel, and an electronic device is housed in the casing, and the electronic device is cooled inside the casing. To provide an electronic device housing unit that houses an air duct and a cable duct for circulating air for use, and integrates the housing with a cooling device.

<Embodiments of the Invention> FIG. 1 is a perspective view of an electronic device housing unit according to the present invention;
Figure 2 is a diagram of the air conditioning system.

A plurality of electronic circuit packages 1 loaded with various electronic elements are accommodated in parallel, and further stacked vertically in multiple stages to form a modular unit 2 having a predetermined function. A plurality of modular units 2 are arranged in parallel. Openings 10 for cooling air passage are provided on the upper and lower surfaces of each modular unit 2. An air duct 3 for supplying cooling air is arranged on the lower side of the modular unit 2, and an air duct 4 for return air is arranged on the upper side. A cable duct 5 is provided adjacent to the return air duct. 6 is a cable. The air supply and return air ducts 3 and 4 are each connected to a cooling device 9, and each duct is provided with a supply air fan 8 and a return air fan 7, respectively. The modular unit 2, the air supply and return air ducts 3, 4, and the cable duct 5 are surrounded by side/f panels 11 and ceiling panels 12.

The side panel 11 and the ceiling tunnel 12 constitute a casing that accommodates a modular unit, etc., and each panel is constructed by combining a metal plate having an electromagnetic shielding effect and a heat insulating material.

13 is an operation panel. In order to effectively utilize the cooling capacity of the cooling device 9 according to the amount of heat generated by each modular unit, as shown in Fig. 2, wind and snow adjustment bumps 1° 14 are provided in the air duct 3a on the bottom of each modular unit. Good too. A temperature sensor 15 is provided at an appropriate position in each modular unit 2, and the control circuit 1
6, the opening degree of the opening 14 of each modular unit 2 is adjusted.

In this way, electronic equipment that is surrounded by a housing-shaped panel and that houses modular units, air ducts, and cable ducts is assembled at the factory as a unit with a cooling device and shipped to the site. Ru.

<Effects of the Invention> As explained above, in the electronic equipment housing unit according to the present invention, the housing is constituted by a panel having a heat insulating effect and a heat shielding effect, and the electronic equipment is housed inside with cooling air ducts and cables. It is housed together with the duct and is integrally constructed with the cooling device as one unit. Therefore, there is no need to provide a free access floor at the installation site, and the device can be installed directly on the floor, making installation work easier. Furthermore, the optimum air conditioning condition can be set in advance according to the electronic device, and the capabilities of the electronic device can be effectively demonstrated regardless of the surrounding environmental conditions at the installation location. In addition, since the cooling equipment such as air ducts is integrally sealed within the housing, the environmental temperature of one electronic device can be made sufficiently lower than the room temperature, and therefore it is possible to cope with the increase in heat generation of the electronic device. High output is achieved. Furthermore, by providing a temperature sensor and an air volume adjustment dunk for each modular unit, it is possible to optimally adjust the temperature according to each modular unit with a different calorific value, and it is possible to effectively utilize the cooling capacity of the cooling device.

[Brief explanation of drawings]

FIG. 1 and FIG. 2 are a perspective view and an air conditioning system diagram, respectively, of an electronic device housing unit according to the present invention. 1...Sub circuit + cage, 2...Modular unit, 3+3a...Air duct for supply air, 4...Air duct for return air, 5...Cable duct, 9...Cooling device, 11...Side wall, 12...Ceiling panel.

Claims (1)

[Claims] 1 A casing is constructed of a heat insulating and shielding panel, and the casing houses an electronic device and an air duct and a cable duct for circulating air for cooling the electronic device inside the casing. An electronic equipment storage unit that integrates a cooling device with a cooling device.