JPS60137590A - Method and device for laser working - Google Patents

Abstract

PURPOSE:To form efficiently a groove, etc. on the surface to be worked with one unit of laser oscillator by splitting a beam of laser light to plural beams, controlling the quantity of the split light by a shutter means and irradiating the light to the surface to be worked at prescribed intervals. CONSTITUTION:The laser light from a laser iscollator 1 is split to plural beams of laser light 20-20'' in a splitter 4 via a collimater 2 and a mirror 3. The split light 20-20'' are made incident to an irradiating part 22 constituted into an array via a half mirror 5 and are irradiated to a surface 11 to be worked via a shutter part 21 and a condenser lens 7 thus forming groove or worked parts. On the other hand, the light from a light source 14 is irradiated to the surface 11 via half mirrors 15, 5, a mirror 6, a shutter 21 and the lens 7 and the light reflected therefrom arrives at a CCD camera 16 through the same optical path. The positional information thereof is inputted to a microcomputer 17 which compares said information with the input information of a memory 18 and operates the part 22 via an X-Y constrol system 9 by the quantity thereof, thereby controlling the position and operating speed of the irradiating part 22 and controlling the opening and shutting of the shutter 21.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing method and a laser processing apparatus.

The first laser beam emitted from one laser oscillator is split into multiple laser beams, and the multiple laser beams are irradiated at a predetermined position on a workpiece surface having a shank means. The purpose is to form an open groove or a processed portion on the surface to be processed.

This invention provides an irradiation unit having a shutter means arranged in an array so that the laser beam divided into a plurality of parts is irradiated at regular intervals, and the laser beam or the surface to be processed is directed in the X direction or the Y direction. By scanning the machine, it is possible to form open grooves or processed parts on the workpiece surface in a predetermined position and shape in accordance with the design specifications in both the X and Y directions. It is.

Conventionally, a laser processing method using a laser processing device to split one laser beam (parent laser beam) into multiple laser beams (child laser beams) to simultaneously create open grooves has been proposed in the application filed by the present inventor. Patent application (Laser processing method patent application 1987-14526)
5 5'58.8.8)). However, by simultaneously irradiating these multiple laser beams onto the surface to be machined, a plurality of straight or broken line open grooves or tabular processing sections (hereinafter simply referred to as open grooves) are formed in the X direction and in the Y direction += 7, the method and processing equipment for scanning according to its design specifications are unknown.

On the other hand, in order to increase productivity by forming multiple grooves on both surfaces within a certain amount of time, lining up 4 to 16 laser processing machines requires high equipment costs and is completely unnecessary. It wasn't practical.

Based on these facts, only one laser oscillator is required, and the laser beam from the laser oscillator is divided into 4 to 16 laser beams, and the laser beams are turned on and off by sheet-tuck means. control and follow its design specifications.
A method and an apparatus for forming an open groove at a predetermined position and shape in both the X direction and the Y direction under automatic control using a microcomputer have been proposed.

The present invention was carried out for this purpose.

FIG. 1 shows a laser processing apparatus used to implement the present invention.

In the drawing, a laser processing device (50), a laser oscillator (1), a coriometer (2-input mirror (3)) and a 2-way divider (4) are shown.
), a half mirror (5), a mirror (6), shutter means (21) similar to mechanical photography, and a quartz condenser lens for focusing (also referred to as an objective lens or processing lens) (7). Means for irradiating the surface to be processed (11) (
22X and below simply consist of an irradiation section (22), a substrate holding table (8), and an XY coordinate control system (9).

The laser oscillator is a YAG laser that emits a waveform of 1.06μ or 0.53μ (frequency 1 to 50KIIz, beam diameter 10 to 100μφ, e.g. 50μφ, average output 0.1
~50W For example, the average output of each laser beam on the processed surface is 0.
5 ~ 几) was used. The laser beam (1) is
) to the mirror (3). Further, the splitter (4) is provided with means for splitting the main laser beam into 2 to 16 beams, for example, 4 beams, using a half mirror or a prism in combination.

As a result, the laser beam (20>, <20')... (
26') and multiple pieces This is divided into four pieces. As a result, the actual processing capacity could be increased by 2 to 16 times, for example, 4 times.

The further divided child laser beams pass through a half mirror (selective reflection mirror) and reach the irradiation section with an array configuration (Fig. 2 (40)).The irradiation section of this array (hereinafter represented by (22)) (22) is irradiated onto the surface to be processed (11) by the shack means (21) connected to the microcomputer (17), and then by the condenser lens (7).
After passing through step 1), the energy is brought to a condenser lens (7), where the energy density is increased by a factor of 102 to 10''.

For this reason, it is effective to control the opening and closing of the laser beam to be irradiated onto the surface to be processed using a shutter before condensing the laser beam so that the shack does not become Lm.

On the other hand, the position detection system (51) uses a halogen lamp or a helium neon laser (14) as a light source.

The light source is half mirror (15), (5), mirror (6)
.

The shutter <21> illuminates the surface to be processed 11) through the condensing lens (7) (23) L, and the reflected light reaches the CCD camera (16) through the same optical path. Furthermore, this position information is input into the microcomputer (17).

Compare the information input to the memory (18) of this computer (17) and determine the amount of information input to the XY control system (9)4.
means for irradiating the surface to be processed, comprising a condensing lens (7);
22X (hereinafter simply referred to as the irradiation section) was operated to control its position and operating speed.

The irradiation section (22) had an array configuration and was also equipped with a shutter (21), which was opened and closed to control the laser beam to be irradiated only to necessary positions.

FIG. 2 shows the irradiation part (22) and the processed surface (11) in FIG. 1.

In other words, a spot (23), <23'(23'') is formed by irradiating the surface to be processed with the laser beam of the irradiation part (40).
Regarding multiple laser beams, diagonally (in the drawing, 4
It is arranged in an array configuration with 5 degrees (4 pieces).

This array of spots or the surface to be processed is moved in the X direction (25
), or by selectively scanning in the Y direction (24), an open groove can be formed at a predetermined position.

Furthermore, the shutter (21) of the irradiation section of the present invention in FIG.
), by controlling the number of irradiations or the irradiation position of each beam using the shank corresponding to each laser beam, the start and end positions are aligned instead of diagonal opening grooves.
For example, it was possible to form an open groove downward from FIG. 2 (26). In addition, by intermittently controlling the opening and closing of this shutter by a microcomputer (17), it has become possible to create a flower or a broken groove.

As is clear from the explanation of these figures 1 and 2,
Even if the scanning speed of one laser beam was 1 m/min, as shown in this example, it was possible to beat the speed of 4Ill1 min in 4 divisions, and the productivity could be improved up to 4 times. . Furthermore, considering the scanning speed of the shutter, a shank speed of I/100 seconds was sufficient.

Furthermore, by adjusting the distance (27) and angle (28) of the spots shown in FIG. .

As a result, each distance (27) is not changed each time the open grooves in both the X direction and the Y direction are scanned using the irradiation unit (40) having the same array configuration, and the angle is simply one parameter. (28) could be made arbitrarily without changing it.

In the present invention, the surface to be processed is vertical (parallel direction along gravity) to prevent scattered objects created by laser beam irradiation from adhering to the surface to be processed. This was effective in preventing the surface table (8) from deforming on a micro level due to its own weight.

In the examples of the present invention, a YAG laser was used as the laser beam. However, as the laser light, an excimer laser, nitrogen laser, carbon dioxide laser, etc. may be used depending on the purpose.

Furthermore, in the present invention, laser processing is only 1.06
The case where an open groove is made using μ YAG laser light is shown.

However, in the present invention, the surface of the workpiece is irradiated and a reactive gas is blown onto the surface to perform laser etching or laser CV.
It goes without saying that this method can also be applied to a method of performing D (gas phase reaction). That is, the laser etching method of the present invention is effective for increasing the productivity of etching ('#) and selectively forming predetermined patterns by laser CVD in the production of semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 shows an outline of the laser processing apparatus of the present invention. FIG. 2 shows an arrangement when a plurality of laser beams according to the present invention are irradiated obliquely and simultaneously. patent applicant

Claims (1)

[Claims] 1. means for dividing one laser beam into a plurality of laser beams, and a shutter means arranged so that the plurality of laser beams are irradiated at predetermined intervals; A laser machining force method characterized in that an open groove or a processed portion is formed on the surface to be processed through a condensing lens. 2. Claim 1: A cicada laser processing method, characterized in that a plurality of laser beams pass through a shutter means, pass through a post-tinting lens, and are irradiated onto a surface to be processed. 3. A laser oscillator that emits one laser beam, a means for dividing the laser beam into a plurality of laser beams, and an irradiation unit that is arranged at a predetermined interval to transmit the plurality of laser beams. A laser processing apparatus comprising a means for irradiating liquid onto two surfaces through a liquid application process, and a means for scanning the means or the surface to be processed in the X direction or the Y direction, wherein the irradiation section is provided with a jack means and a condenser lens. A laser processing device comprising: