JPS60136226A - Photoresist coating device - Google Patents

Abstract

PURPOSE:To prevent the generation of flaws of the surface of a wafer and adhesion of rubber by rotating a transportation arm for supplying wafers onto a spinner wafer chuck to reverse the front and back surface of the wafer in an automatic back surface photoresist coating device for semiconductor wafers. CONSTITUTION:A transportation arm 2 for which a wafer is supplied from a transportation belt 1 attracts the back surface of the wafer by vacuum. And it is rotated by 180 deg. by a motor 3 and is stopped by a stopper 5. A spinner wafer chuck 6 rises to attract the wafer 9 by vacuum. Vacuum attraction of the transportation arm 2 is released and the chuck 6 is lowered and a sequence of photoresist coating is performed. Holding of the wafer is performed through a back surface of the wafer wholly except the part on the spinner wafer chuck 6 and it becomes possible to spread photoresist over the back surface of wafer without influencing the front surface of wafer thereby offering good condition of the front surface of wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to improvements in automatic backside photoresist coating machines for semiconductor wafers that are widely used in the semiconductor manufacturing industry.

[Background of the invention]

Conventionally, when applying photoresist to the back surface of a semiconductor wafer (hereinafter referred to as wafer), the wafer was also held by a wafer transport mechanism on the wafer surface because it was necessary to use the wafer surface as a spinner chuck suction surface. For this reason, problems have arisen in that the wafer surface is easily scratched and dust generated in the wafer transport mechanism is likely to adhere.

[Purpose of the invention]

[Structure of the Invention] The present invention aims to provide a backside resist coating device that prevents scratch-causing dust from adhering to the wafer surface. , the wafer is turned over from front to back.

〔Example〕

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, and in particular, what is shown in FIG. 1 shows a still state. In this state, the wafer is fed from the conveyor belt 1 onto the conveyor arm 2. At the time of transfer, the wafer is held on the back side. The transfer arm 2 to which the wafer has been supplied vacuum-chucks the back surface of the wafer, and then is rotated by a motor 3 180 degrees around a rotation shaft 4 in the direction indicated by an arrow 7 in the figure, and stopped by a stopper 5 . This state is shown in FIG.

That is, the wafer is inverted at this point. In this state, the spinner wafer chuck 6 starts to rise and vacuum-chucks the wafer 9. After the vacuum suction of the transport arm 2 is released, the chuck 6 is lowered, and the transport arm 2 is reversed by 180 degrees by the reversal of the motor 3, returning to the state shown in FIG. After this, a normal photoresist application sequence is performed. After completing the coating sequence, reverse the procedure of feeding the wafer onto the spinner wafer chuck 6 using the same transfer arm 2 used to feed the wafer onto the spinner wafer chuck 6 using the same transfer arm 2 used to feed the wafer onto the Spear f-II) Everchuck 6. Then, the wafer is taken out onto the conveyor belt 1. That is, after the transfer arm 2 is rotated 180 degrees and placed on the spinner wafer chuck 6, the wafer chuck 6 is raised and the transfer arm 2 is vacuum-adsorbed. The vacuum suction of the spinner wafer chuck 6 is released, the spinner wafer chuck 6 is lowered, and after this,
The transport arm 2 reverses the original by 180 degrees. The vacuum suction sound is canceled and the wafer is fed onto the conveyor belt 1. According to this embodiment, the wafer is held entirely through the back surface of the wafer except on the spinner wafer chuck 6. Therefore, it is possible to apply photoresist on the back surface of the wafer without affecting the surface of the wafer, and a good wafer surface condition can be obtained.

Although not specifically mentioned in this description, it goes without saying that this embodiment includes all the components of an automatic photoresist coating machine, such as a carrier loader, an unloader, and a photoresist dispensing mechanism.

[Brief explanation of drawings]

FIGS. 1 and 2 are block diagrams showing an embodiment of the present invention. FIG. 1 shows a stopped state, and FIG. 2 shows an operating state. 1... Conveyance belt, 2... Conveyance arm, 3... Motor, 4... Rotating shaft, 5
... Stopper, 6 ... Spinner wafer chuck, 7 ... Arrow indicating the direction of movement of the transfer arm, 8 ... Drain cup, 9"°° °°
°wafer 0

Claims (1)

[Claims] Semiconductor wafers can be fed onto a spinner wafer chuck or taken out from a spinner wafer chuck by rotating the semiconductor wafer by half a rotation using a transfer arm with a rotation axis parallel to the semiconductor wafer transfer surface and perpendicular to the direction of movement. Features of photoresist coating machine.