JPS60136138U - ボンデイングワイヤ−用スプ−ル - Google Patents

ボンデイングワイヤ−用スプ−ル

Info

Publication number
JPS60136138U
JPS60136138U JP2373484U JP2373484U JPS60136138U JP S60136138 U JPS60136138 U JP S60136138U JP 2373484 U JP2373484 U JP 2373484U JP 2373484 U JP2373484 U JP 2373484U JP S60136138 U JPS60136138 U JP S60136138U
Authority
JP
Japan
Prior art keywords
spool
bonding wire
flanges
discontinuously
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2373484U
Other languages
English (en)
Japanese (ja)
Other versions
JPH023624Y2 (enrdf_load_stackoverflow
Inventor
伸一 阿部
時田　正憲
健次 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP2373484U priority Critical patent/JPS60136138U/ja
Publication of JPS60136138U publication Critical patent/JPS60136138U/ja
Application granted granted Critical
Publication of JPH023624Y2 publication Critical patent/JPH023624Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2373484U 1984-02-20 1984-02-20 ボンデイングワイヤ−用スプ−ル Granted JPS60136138U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2373484U JPS60136138U (ja) 1984-02-20 1984-02-20 ボンデイングワイヤ−用スプ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2373484U JPS60136138U (ja) 1984-02-20 1984-02-20 ボンデイングワイヤ−用スプ−ル

Publications (2)

Publication Number Publication Date
JPS60136138U true JPS60136138U (ja) 1985-09-10
JPH023624Y2 JPH023624Y2 (enrdf_load_stackoverflow) 1990-01-29

Family

ID=30517234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2373484U Granted JPS60136138U (ja) 1984-02-20 1984-02-20 ボンデイングワイヤ−用スプ−ル

Country Status (1)

Country Link
JP (1) JPS60136138U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH023624Y2 (enrdf_load_stackoverflow) 1990-01-29

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