JPS60133647U - Chippukiyariya - Google Patents

Chippukiyariya

Info

Publication number
JPS60133647U
JPS60133647U JP1995384U JP1995384U JPS60133647U JP S60133647 U JPS60133647 U JP S60133647U JP 1995384 U JP1995384 U JP 1995384U JP 1995384 U JP1995384 U JP 1995384U JP S60133647 U JPS60133647 U JP S60133647U
Authority
JP
Japan
Prior art keywords
side wall
base
electrode films
inclined side
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1995384U
Other languages
Japanese (ja)
Inventor
小川　廣光
谷中　定雄
佐藤　憲雄
長沼　理市
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1995384U priority Critical patent/JPS60133647U/en
Publication of JPS60133647U publication Critical patent/JPS60133647U/en
Pending legal-status Critical Current

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  • Ceramic Capacitors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のチップキャリアのカバーを除去したとこ
ろを示す斜視図、第２図は本考案の一実施例のイは斜視
図、口は要部の断面図である。 図中１は基板、２は導体パターン、３．１０は　　　　
・チップキャリア、４はセラミック基台、５は凹部、６
は角孔、７は電極パターン、８，１２？よ端　　　。FIG. 1 is a perspective view of a conventional chip carrier with the cover removed, FIG. 2 is a perspective view of an embodiment of the present invention, and the opening is a cross-sectional view of the main parts. In the figure, 1 is the board, 2 is the conductor pattern, and 3.10 is
・Chip carrier, 4 is ceramic base, 5 is recess, 6
is a square hole, 7 is an electrode pattern, 8, 12? End of the story.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 中央部に電子部品が収容される凹部が設けられた合成樹
脂あるいはセラミックよりなる基台は台形に形成され、
該基台の傾斜した側−には電極膜が形成された端子部が
並設され、該電極膜は該電子部品のそれぞれの電極に接
続されてなり、該端子部のそれぞれは該基台の傾斜した
側壁に該側壁面に並行する垂直方向の深さで、正面視で
上部が狭い截頭半円錐形の凹溝に形成されてなることを
特徴とするチップキャリア。The base is made of synthetic resin or ceramic and has a trapezoidal shape with a recess in the center for housing electronic components.
Terminal portions on which electrode films are formed are arranged in parallel on the inclined side of the base, and the electrode films are connected to respective electrodes of the electronic component. A chip carrier characterized in that a concave groove having a truncated semi-conical shape with a narrow upper part when viewed from the front is formed in an inclined side wall at a depth in a vertical direction parallel to the side wall surface.
JP1995384U 1984-02-15 1984-02-15 Chippukiyariya Pending JPS60133647U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1995384U JPS60133647U (en) 1984-02-15 1984-02-15 Chippukiyariya

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1995384U JPS60133647U (en) 1984-02-15 1984-02-15 Chippukiyariya

Publications (1)

Publication Number Publication Date
JPS60133647U true JPS60133647U (en) 1985-09-06

Family

ID=30509999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1995384U Pending JPS60133647U (en) 1984-02-15 1984-02-15 Chippukiyariya

Country Status (1)

Country Link
JP (1) JPS60133647U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621251U (en) * 1992-08-18 1994-03-18 株式会社住友金属セラミックス Ceramic package with castellation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621251U (en) * 1992-08-18 1994-03-18 株式会社住友金属セラミックス Ceramic package with castellation

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