JPS60131438A - Manufacture of pressure detector - Google Patents
Manufacture of pressure detectorInfo
- Publication number
- JPS60131438A JPS60131438A JP23984783A JP23984783A JPS60131438A JP S60131438 A JPS60131438 A JP S60131438A JP 23984783 A JP23984783 A JP 23984783A JP 23984783 A JP23984783 A JP 23984783A JP S60131438 A JPS60131438 A JP S60131438A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- welding
- diaphragm
- base
- casings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は半導体感圧素子を有する圧力検知部分及び付設
する電気部品に被測定流体が直接触れないようにケーシ
ングに設けた受圧シール部材で該検知部分等をシール１
、該受圧シール部材と等圧力検知部分間に圧力伝達用の
液体を充填して構成する圧力検出器の製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention uses a pressure receiving seal member provided in a casing to prevent a pressure sensing portion having a semiconductor pressure sensitive element and attached electrical components from coming into direct contact with the fluid to be measured.
The present invention relates to a method of manufacturing a pressure sensor, which is constructed by filling a pressure transmitting liquid between the pressure receiving seal member and the equal pressure sensing portion.
上記した如くに、圧力検出器は半導体感圧素子と受圧シ
ール部材とケーシングを主要構成部品として成り・立う
ており、これらの王者を一体に溶接してシールするのは
困難であり、特に半導体感圧素子は熱に対して極度に弱
くて変質し易いという技術的隘路を有する。As mentioned above, a pressure sensor consists of a semiconductor pressure-sensitive element, a pressure-receiving seal member, and a casing as its main components, and it is difficult to weld and seal these kings together, especially when using semiconductors. Pressure-sensitive elements have a technical bottleneck in that they are extremely sensitive to heat and easily deteriorate.
また他方においては、圧力検出器である以上、被測定流
体の圧力上昇時において破壊されないだけの強度を保□
持しなければならないという技術的要請が存する。On the other hand, since it is a pressure detector, it must be strong enough not to be destroyed when the pressure of the fluid to be measured increases.
There is a technical requirement that it must be maintained.
本発明は上記した点に着目して為されたものであり、先
づ一対めケーシング間に金属製ダイアフラムを挾持した
状態で該一対のケーシングの接合部を比較的に強い溶接
手段により強固に接合し、次にケーシングの一方に対し
て半導体感圧素子を支持するベースを比較的に弱い溶接
手段により小範囲において溶接することにより、前記の
技術的要請を満足しつつ前記の技術的隘路を克服するよ
うにしたものである。The present invention has been made by focusing on the above-mentioned points, and first, a metal diaphragm is sandwiched between the pair of casings, and the joints of the pair of casings are firmly joined by relatively strong welding means. Then, by welding the base supporting the semiconductor pressure-sensitive element to one side of the casing in a small area using relatively weak welding means, the above-mentioned technical bottleneck is overcome while satisfying the above-mentioned technical requirements. It was designed to do so.
以下本発明の製造工程を図面について説明すれば、相互
に接合される金属製の円筒状ケーシングＡ、Ｂの外周に
おける接合端１，２間にて金属製のダイアフラム３の周
縁を挾持しつつ位置させ、その接合端１，２の外周縁を
アルゴン・アーク溶接Ｗｌにより強力に接合する（第１
図）。The manufacturing process of the present invention will be explained below with reference to the drawings. The periphery of the metal diaphragm 3 is held between the joint ends 1 and 2 on the outer periphery of the metal cylindrical casings A and B that are joined to each other. and the outer peripheral edges of the joint ends 1 and 2 are strongly joined by argon arc welding Wl (first
figure).
而して、ダイアフラム３は両ケーシングＡ、Ｂ１によっ
て形成される室４内において可動自在であり、室４は下
側において被測定流体の導入口５に連通している。The diaphragm 3 is movable within a chamber 4 formed by both the casings A and B1, and the chamber 4 communicates with an inlet 5 for the fluid to be measured at its lower side.
次に室４の上側に圧力伝達用の液体としてのシリコンオ
イルＬを充満しく第２図）、ベースＣにより密閉する（
第３図）。Next, the upper side of the chamber 4 is filled with silicone oil L as a liquid for pressure transmission (Fig. 2), and sealed with the base C (Fig. 2).
Figure 3).
ベースＣは鍔部６ａを有する金属製の円筒状リング６内
にシリコン材による絶縁基盤７を設けたものであり、該
絶縁基盤７の内面に半導体感圧素子８が固定される。９
は該半導体感圧素子８に接続されるリード線である。ベ
ースＣは、シリコンオイル■７に接触した状態において
鍔部６ａを介してケーシングＡにおける室４の外端縁に
対し短時間のリングプロジェクション溶接ｗ２により前
記した溶接ｗ１よりも弱い強度で接合する。The base C is a metal cylindrical ring 6 having a flange 6a and an insulating base 7 made of a silicon material provided therein, and a semiconductor pressure-sensitive element 8 is fixed to the inner surface of the insulating base 7. 9
is a lead wire connected to the semiconductor pressure sensitive element 8. The base C is joined to the outer edge of the chamber 4 in the casing A via the flange 6a by ring projection welding w2 for a short time with a strength weaker than the welding w1 described above while in contact with the silicone oil 7.
本発明は上記した如くに、一対のケーシングの外周にお
ける接合端にて金属製のダイアフラムの周縁を挾持しつ
つその外周縁を溶接してダイアフラムを両ケーシングに
よって形成される室内において可動自在に設けると共に
ダイアフラムの一例の室を被測定流体の導入口に連通さ
せ、次にダイアフラムの他側の室に圧力伝達用液体を充
満し、更に半導体感圧素子を支持するベースを該圧力伝
達用液体と接触した状態においてケーシングにおける該
室の外端縁に溶接して成るものであるから、一対のケー
シング乃至は両者の接合部間におけるダイアフラムのシ
ール構造を強固にすることができ、圧力伝達用液体が熱
を吸収するので半導体感圧素子の溶接時における変質を
防止することができる特長を有する。As described above, the present invention provides a diaphragm that is movable within the chamber formed by both casings by sandwiching the periphery of a metal diaphragm at the joint ends on the outer periphery of a pair of casings and welding the outer periphery. The chamber of one example of the diaphragm is communicated with the inlet of the fluid to be measured, then the chamber on the other side of the diaphragm is filled with a pressure transmitting liquid, and the base supporting the semiconductor pressure sensitive element is brought into contact with the pressure transmitting liquid. Since it is welded to the outer edge of the chamber in the casing in the state of It has the feature of being able to prevent deterioration during welding of semiconductor pressure-sensitive elements.
第１図乃至第３図は本発明の製造工程を示す断面図であ
る。
Ａ、Ｂ・・・一対のケーシング、１，２・・・接合端、
３・・・ダイアフラム、４・・・室、５・・・被測定流
体の導入口、Ｌ・・・圧力伝達用液体、Ｃ・・・ベース
、８・・・半導体感圧素子。
特許出願人 株式会社鷺宮製作所
第３図1 to 3 are cross-sectional views showing the manufacturing process of the present invention. A, B... A pair of casings, 1, 2... Joint ends,
3... Diaphragm, 4... Chamber, 5... Inlet for fluid to be measured, L... Liquid for pressure transmission, C... Base, 8... Semiconductor pressure sensitive element. Patent applicant: Saginomiya Seisakusho Co., Ltd. Figure 3
Claims (1)
ｌのダイアフラムの周縁を挾持しつつその外周縁を溶接
してダイアフラムを両ケーシングによって形成される室
内において可動自在に設けると共にダイアフラムの一側
の室を被測定流体の導入口に連通させ、次にダイアフラ
ムの他側の室に圧力伝達用液体を充満し、更に半導体感
圧素子を支持するベースを該圧力伝達用液体と接触した
状態においてケーシングにおける該室の外端縁に溶接す
ることを特徴とする圧力検出器の製造方法。Gold B at the joint end on the outer periphery of the pair of casings! !
The diaphragm is provided movably within the chamber formed by both casings by holding the periphery of the diaphragm and welding its outer periphery, and the chamber on one side of the diaphragm is communicated with the inlet of the fluid to be measured. The chamber on the other side of the diaphragm is filled with a pressure transmitting liquid, and the base supporting the semiconductor pressure sensitive element is welded to the outer edge of the chamber in the casing while in contact with the pressure transmitting liquid. A method for manufacturing a pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23984783A JPS60131438A (en) | 1983-12-21 | 1983-12-21 | Manufacture of pressure detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23984783A JPS60131438A (en) | 1983-12-21 | 1983-12-21 | Manufacture of pressure detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60131438A true JPS60131438A (en) | 1985-07-13 |
Family
ID=17050751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23984783A Pending JPS60131438A (en) | 1983-12-21 | 1983-12-21 | Manufacture of pressure detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60131438A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7727612B2 (en) | 2000-09-12 | 2010-06-01 | Honda Access Corp. | Automotive floor mat and automotive floor mat fastener |
-
1983
- 1983-12-21 JP JP23984783A patent/JPS60131438A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7727612B2 (en) | 2000-09-12 | 2010-06-01 | Honda Access Corp. | Automotive floor mat and automotive floor mat fastener |
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