JPS60130899A - Taping electronic part series - Google Patents
Taping electronic part seriesInfo
- Publication number
- JPS60130899A JPS60130899A JP24034983A JP24034983A JPS60130899A JP S60130899 A JPS60130899 A JP S60130899A JP 24034983 A JP24034983 A JP 24034983A JP 24034983 A JP24034983 A JP 24034983A JP S60130899 A JPS60130899 A JP S60130899A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- resin film
- film
- electronic component
- taping electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は、テーピング電子部品を取４”Ｊ Ｇ−Ｊる
保持帯の構造に係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a retaining band for taping electronic components.
第１図は従来のテーピング電子部品）ルを小している。FIG. 1 shows a smaller version of the conventional taped electronic component.
同図においで保持体１は、デー／４人の１’；４１４（
を用いた台紙２と、この台紙２上に１居合わける粘着テ
ープ３とで構成され、例えばセラミック二１ンデンザの
ような電子部品４の多数を一定間隔で並べ（そのリード
線５を台紙２上に当ズがい、での上を粘着テープ３によ
り押えて台紙２」−に接盾し、保持帯１に一定の間隔ぐ
送り孔６を設りで７−−ピング電子部品連を形成してい
る。In the figure, the holder 1 is 1'; 414 (
It consists of a mount 2 using When there is a problem, press the top of the plate with adhesive tape 3 and attach it to the mount 2'', and make feed holes 6 at regular intervals in the holding band 1 to form a series of pin electronic parts 7. There is.
ところで、上記のようなテーピング電ｒ部品連は自動挿
入機を用いて電子部品をプリンｌ−ｕ ｔｌＱに自動挿
入リ−るＩＩ係士、非常に厳格な１１法箱反や耐引張強
度及び耐熱耐寒性が必要である。。By the way, the above-mentioned series of taping electronic parts requires a second person who automatically inserts the electronic parts into the printer using an automatic insertion machine, and has to comply with very strict 11 method box resistance, tensile strength and heat resistance. Cold resistance is required. .
ところで、この従来例のように、保１．′Ｊ体１にＩ’
〕紙を使用覆るものにあっては、装造１１゛１あるいは
プリンｌ−３１板等ｌ＼の自り」挿入１１：ｊ ニＪ３
ＬＪ ルＩＩＭ ’） ４１ｋ イｌＬ’＋、例えば厚
紙への送り孔のパンチング」−程、保持体の自動機内に
おける移送時などに、Ｊ３い（、特に多くの塵埃が発生
し、飛散し、機械内（−自動ｌｔ制御のために使用され
ている光Ｕンーリーなどにこの１小埃か１１着したりし
て、モＴ〔実な動作に大なる支障を与えることになっＣ
いた。By the way, as in this conventional example, protection 1. 'J body 1 to I'
] For coverings using paper, insert 11:j d J3
For example, when punching holes in cardboard, a lot of dust is generated and scattered, and the machine (-) If this dust gets on the optical unit used for automatic LT control, it may cause a major hindrance to the actual operation of the motor.
there was.
また従来から、−保持体１の厚紙の代りに樹脂テープを
使用したしのも案出されている。ところがこの樹脂テー
プを使用Ｊる−しのにあっては、１９紙の揚ｄのにうな
塵埃による支障【よ解消できるものの、以下に示り−よ
うな問題が新に生じる。Also, in the past, a method has been devised in which resin tape is used instead of cardboard for the holder 1. However, when using this resin tape, although the problems caused by the large amount of dust caused by paper lifting can be solved, new problems as shown below arise.
（１） 樹脂テープの台紙は耐引張強度が弱く、製造時
や自動挿入の高速化にどもない大きな引張力が作用する
と切断が発生する。(1) Resin tape mounts have low tensile strength, and breakage occurs when a large tensile force is applied during manufacturing or during high-speed automatic insertion.
（１１）樹脂テープの台紙は伸縮率が人さく、＼Ｊ’
７Ａ ｆｉ’ｊ腹が悪いため、電子部品の自動挿入が困
難になる。(11) The resin tape mount has a low expansion and contraction rate,\J'
7A fi'j It is difficult to automatically insert electronic parts because of the poor stomach.
ｔｉｌｌ） 樹脂テープの台紙は耐熱耐寒性に劣り、＾
湿や低温の作業環境での使用時には僅かな引張力で＼Ｊ
法のズレや切断が生じる。till) Resin tape mount has poor heat and cold resistance,
When used in a humid or low-temperature work environment, it can be easily tightened with a slight tensile force.
Misalignment and disconnection of laws will occur.
この発明は上記のような従来のテーピング電子部品連の
問題を解消り−るためになされたものであり、寸法精度
と耐引張強度及び耐熱耐寒性に優れ、製遁萌ヤ自動挿入
機での取り扱い時の高速化及び取り扱い性の信頼性を向
上させることができるデーピング電子部品連を１２供す
ることを［１的とりる。This invention was made to solve the above-mentioned problems associated with conventional taping electronic components. The first objective is to provide a series of 12 taped electronic components that can increase handling speed and improve handling reliability.
以下、この発明のテーピング電子部品連の実施例を第２
図ないし第６図にもとづいζ説明Ｊる。Hereinafter, a second embodiment of a series of taped electronic parts according to the present invention will be described.
ζ will be explained based on FIGS.
この発明のテーピング電子１ＱｌＩ品連Ａは、電子部品
４を取付ける保持帯１１が熱可塑１’１合成樹１１（１
フイルム１２を含み、適宜間隔（・配置した多数の電子
部品４のリード線５をこの保持帯１１に固定し、この保
持帯１１に一定の間隔で送り孔１３を設Ｕ″Ｃ形成され
ている。In the taping electronic 1QlI product series A of the present invention, the retaining band 11 for attaching the electronic component 4 is made of thermoplastic 1'1 synthetic wood 11 (1
The lead wires 5 of a large number of electronic components 4, including the film 12 and arranged at appropriate intervals, are fixed to this holding band 11, and feed holes 13 are formed at regular intervals in this holding band 11. .
上記保持帯１１の第２図に示′ｔｌ第１の例は、−ノー
ブ状の延伸合成樹脂フィルム１２に粘着へ−−］゛１４
を０１用して形成し、電子部品４のリード線５を合成樹
脂フィルム１２上に重ね、その上から粘着シ“−ブ１４
で押え貼合ｌるＪ：うにしｉｃものＣある。The first example of the retaining band 11 shown in FIG.
The lead wire 5 of the electronic component 4 is placed on the synthetic resin film 12, and the adhesive shield 14 is placed on top of it.
Press and paste J: There is sea urchin ic material C.
第３図と第４図に示す保持帯１１の第２の例は、テープ
状の合成樹脂フィルム１２を’ｌｉ Ｊｌ−！Ｊること
によって形成した場合であり、電子部品４のリード線５
をこの合成樹脂フィルム１２上に重ね、加熱加圧ににす
、リード線５を合成樹脂フィルム１２に直接部名するこ
とにｊ：す、電子部品４の取（＝１１Ｊを（ｉなうよう
にしたものである。A second example of the retaining band 11 shown in FIGS. 3 and 4 uses a tape-shaped synthetic resin film 12. This is the case where the lead wire 5 of the electronic component 4 is formed by
is placed on this synthetic resin film 12, heated and pressurized, and the lead wire 5 is directly attached to the synthetic resin film 12. This is what I did.
第５図と第６図は保持帯１１に合成樹脂フィルム１２を
１４１用した第２の例において、電子部品４の取（’Ｊ
’ ｔｊ椙造の異なる例を示してＪｌす、第５図は合成
樹脂フィルム１２上にリード線５を重ね、このり一ド線
５からフィルム１２上にわたって接着剤１５を塗イＩｉ
ツることにより、取（ｌ＆ノを行なうようにしたｂの（
゛ある。5 and 6 show a second example in which the synthetic resin film 12 is used as the retaining band 11, and the electronic component 4 is removed ('J').
Figure 5 shows a different example of the lead wire 5 on the synthetic resin film 12, and then the adhesive 15 is applied from the lead wire 5 onto the film 12.
By tsu, b's ((
There is.
第６図に示す例は、合成樹脂フィルム１２の上面に接着
剤１６を塗布し、この接着剤１６上にリード線５を重ね
て接着したしのである。In the example shown in FIG. 6, an adhesive 16 is applied to the upper surface of a synthetic resin film 12, and a lead wire 5 is overlapped and bonded onto the adhesive 16.
前記、合成樹脂フィルム１２は、熱可塑性合成樹脂に各
種充ＩｒＡ祠を添加して延伸加工を施すことにより形成
されており、熱可塑性合成樹脂として、ポリ」〕ヂレン
、ボリプＯピレン、ポリアミド等を例示することができ
る。The synthetic resin film 12 is formed by adding various types of IrA to a thermoplastic synthetic resin and subjecting it to stretching processing.As the thermoplastic synthetic resin, polyethylene, polyethylene, pyrene, polyamide, etc. are used. I can give an example.
また、充填材１１としては、炭酸カルシウム、ガラスパ
ウダー、シリカ等の粉末やｓｉｎ状の無機質材料を用い
、合成樹脂に対する添加量は５〜８０％好ましくは１０
〜６０に設定されている。Further, as the filler 11, a powder or sin-like inorganic material such as calcium carbonate, glass powder, or silica is used, and the amount added to the synthetic resin is 5 to 80%, preferably 10
~60.
また合成樹脂フィルム１２に対する延伸加］−は、テー
プ状フィルムの長手方向（第３１ａ Ｘ ＞の強度を向
上させる一軸延伸と、長手方向と幅方向（第３図Ｘ−Ｙ
）の強度を向上ざ「る二軸延伸の１ｉｉＪれを採用しく
もよい。Stretching of the synthetic resin film 12] - is uniaxial stretching to improve the strength of the tape-like film in the longitudinal direction (Fig. 31a
) Biaxial stretching may be employed to improve the strength of the film.
なお、」：記の実施例Ｃは合成樹脂フィルムに充填材を
充ｖＡ−Ｓｌるものを示したが、この発明ぐは必ずしも
充填Ｉは必要ではなく、少くとし延伸フィルムが使用さ
れていればよい。In addition, Example C described in ``:'' shows a synthetic resin film filled with filler vA-Sl, but this invention does not necessarily require filling I, and if it is reduced and a stretched film is used. good.
上記のように１．延伸加工を施しＩＣ合成樹脂フィルム
１２は、寸法精度、引張強庶宿の性能面で、；１（１、
延伸の合成樹脂フィルムよりもはるかに優れ、電子部品
連の高速製造や高速自動挿入を実現で・きる。As mentioned above 1. The stretched IC synthetic resin film 12 has the following characteristics in terms of dimensional accuracy and tensile strength performance:
It is far superior to stretched synthetic resin film and can realize high-speed manufacturing and high-speed automatic insertion of electronic components.
特に合成樹脂フィルムに無機充Ｉｆｆ ＃Ａ ？！−ｉ
ｌＮ人さμたちのであれば、耐熱性、耐寒性にムリぐれ
たものとなる。Especially if the synthetic resin film is filled with inorganic materials.If #A? ! -i
For humans, it has poor heat resistance and cold resistance.
以上のように、この発明にＪ：ると、電子部品のリード
線を取付ける保持帯が合成４ｉｉ４脂フイルムを含み、
この合成樹脂フィルムを延伸加Ｔノイルムで形成したの
（・、保持帯の寸法精度及び耐引張強度が従来の樹脂テ
ープに比べて大幅に向上し、製造時あるいは自動挿入機
での取り扱い時の高速化や電子部品の自動挿入の信頼性
が向上する。As described above, according to the present invention, the holding band for attaching the lead wire of an electronic component includes a synthetic 4ii4 resin film,
By forming this synthetic resin film with stretched T-noilm, the dimensional accuracy and tensile strength of the retaining band are significantly improved compared to conventional resin tapes, allowing for high-speed handling during manufacturing or automatic insertion machines. This improves the reliability of automatic insertion of electronic components.
まｌ〔、無機質月利を混入さＵると、保［，１帯の耐熱
性、耐寒性が向上するので、高温または低温の作２環境
にａ３いてもテーピング電子部品の自動挿入が支障なく
行なえる。Mixing inorganic materials improves the heat resistance and cold resistance of the protective layer, so automatic insertion of taped electronic components is not affected even in high or low temperature environments. I can do it.
ざらに、保持帯が合成樹脂フィルムで形成されているの
で、厚紙製台紙を使用した場合のように塵埃が発生りる
というようなことがなくなり、自動挿入ｉＪｌ笠のヒン
ザ−による制御が確実に行なえるため、自動製造、自動
挿入の実現が可能になる。In addition, since the retaining band is made of synthetic resin film, there is no dust generated when using a cardboard mount, and the automatic insertion iJl shade can be controlled reliably by the hinge. This makes it possible to realize automatic manufacturing and automatic insertion.
第１図は従来のテーピング電子部品連を示り平面図、第
２図はこの発明を示Ｖ電子部品連の第１の例を承り縦断
側面図、第３図は同上の第２の例を承り平面図、第４図
は同上の拡大断面図、第５図と第６図の各々は同上にお
りるリード線取り付けの異なった例を示す縦断面図であ
る。
４・・・電子部品 ５・・・リード線
１１・・・保持帯 １２・・・合成樹脂フィル１＼１３
・・・送り孔 １４・・・粘着テープ特Ｗ［出願人 株
式会ン１ 杓田製作所代 理 人 弁理士 和 １）
昭Fig. 1 is a plan view showing a conventional taped electronic parts series, Fig. 2 is a longitudinal sectional side view of the first example of the V electronic parts series according to the present invention, and Fig. 3 is a longitudinal side view of the first example of the V electronic parts series. FIG. 4 is an enlarged sectional view of the same, and FIGS. 5 and 6 are longitudinal sectional views showing different examples of lead wire attachment to the same. 4...Electronic component 5...Lead wire 11...Retention band 12...Synthetic resin fill 1\13
...Feeding hole 14...Adhesive tape special W [Applicant: Kazuta Seisakusho Co., Ltd. 1]
Akira
Claims (4)
ド線を取（Ｊ Ｇ）る保持帯が合成樹脂フィルムを含み
、この合成樹脂フィルムが延伸フィルムで形成されでい
るテーピング電子部品連。(1) A taping electronic component chain arranged at appropriate intervals, where the holding band for holding the lead wires of a large number of electronic components contains a synthetic resin film, and this synthetic resin film is formed of a stretched film. .
請求の範囲第１項記載のテーピング電子部品連。(2) The taped electronic component series according to claim 1, wherein the synthetic resin film is a uniaxially stretched film.
請求の範囲第１項記載のテーピング電子部品連。(3) The taped electronic component series according to claim 1, wherein the synthetic resin film is an axially stretched film.
別室充填材を添加したものである特許請求の範み１第１
項記載のテーピング電子Ｂｉ１配達。(4) Synthetic resin film is 11 (1
Claim 1 No. 1 in which a separate chamber filler is added
Taping electronic Bi1 delivery as described in section.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24034983A JPS60130899A (en) | 1983-12-19 | 1983-12-19 | Taping electronic part series |
| US06/680,648 US4600116A (en) | 1983-12-19 | 1984-12-11 | Tape-mounted electronic components assembly |
| DE19843446142 DE3446142A1 (en) | 1983-12-19 | 1984-12-18 | ARRANGEMENT OF ELECTRONIC COMPONENTS FASTENABLE ON A TAPE |
| GB08431960A GB2151578A (en) | 1983-12-19 | 1984-12-18 | Tape-mounted electronic components assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24034983A JPS60130899A (en) | 1983-12-19 | 1983-12-19 | Taping electronic part series |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60130899A true JPS60130899A (en) | 1985-07-12 |
Family
ID=17058160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24034983A Pending JPS60130899A (en) | 1983-12-19 | 1983-12-19 | Taping electronic part series |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130899A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719991U (en) * | 1993-09-22 | 1995-04-07 | 理研電線株式会社 | Conveying sheet for processed wire products |
-
1983
- 1983-12-19 JP JP24034983A patent/JPS60130899A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719991U (en) * | 1993-09-22 | 1995-04-07 | 理研電線株式会社 | Conveying sheet for processed wire products |
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