JPS6013082A - Transferring and surface treating apparatus - Google Patents

Abstract

PURPOSE:To treat uniformly both sides of a substrate by setting a mechanism for rotating a conveyor round a line connecting the center of the inlet side of conveyor rollers in the lateral direction to the center of the outlet side of the rollers in the lateral direction at the height of a line passing through the conveyor as the imaginary axis of rotation and by arranging nozzles around the conveyor. CONSTITUTION:In a transferring and surface treating apparatus, the surfaces of a plate 2 to be treated are treated by driving plural conveyor rollers 1 composed of pairs of upper and under sending rollers so as to pass the plate 2 through the chemical soln. spray chamber 3. Rotating disks 14a, 14b, 14c for rotating the whole conveyor round a line connecting the center of the inlet side of the rollers 1 in the lateral direction to the center of the outlet side of the rollers 1 in the lateral direction at the height of a line passing through the conveyor as the imaginary axis of rotation are set in the apparatus, and chemical soln. spray nozzles 4, 5 are arranged around the conveyor.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conveyance surface treatment apparatus, and more particularly to an improved IVJ apparatus for etching the surface of a printed wiring board (hereinafter referred to as an "F-board") while conveying it.

A first example of a conventional conveyance surface treatment apparatus is shown in a side sectional view in FIG. In the manufacturing process of a board that has copper foil layers on both the top and bottom sides, in order to obtain a wiring path at a desired position on an insulating board,
There is an etching device used to form a circuit by coating a desired circuit with an etching resist on the copper foil layer on both sides of a substrate and then etching away the copper foil other than the coated desired circuit.

Next, the operation of this etching apparatus will be explained.

When the substrate 2 is placed on the right end of the conveyor roller 1.

The substrate 2 is sent to the etching chamber 3 by the conveyor roller 1 rotating in the advancing direction, and as it moves from right to left, the etching solution 6 sprayed from the upper nozzle 4 and lower nozzle 5 repairs the copper foil. All exposed parts are etched. Thereafter, the substrate 2 is sent to the next washing chamber 7. Regarding the finishing quality of the substrate by etching in such a conventional transport surface treatment apparatus, the etching action is completed on the upper surface side when the etching liquid is sprayed.

The degraded etching solution tends to remain on the upper surface of the substrate 2 without falling onto the upper surface of the substrate 2, which slows down the etching speed.

Since the etching solution that has deteriorated even more remains in a non-uniform state over the entire upper surface, variations in the etching rate occur even within the upper surface, resulting in non-uniform etching.

On the other hand, the deteriorated etching solution can be removed from the bottom side.

After the etching process is completed, the etching solution drops immediately and fresh etching solution always comes into contact with the lower surface, so that the etching speed is faster than on the upper surface.

For this reason, a uniform etching finish cannot be obtained between both the upper surface side and the lower surface side, and in the case of a high-density substrate requiring a circuit with a circuit width Q of 3 nm or less.

This had the drawback of poor production yields and defective substrates. Therefore, in order to improve the above-mentioned drawbacks even slightly, in conventional equipment, the entire conveyor axis is tilted by about 1 to 3 degrees to make the liquid on the upper surface flow down as quickly as possible.
The equipment became complicated and the cost was high, but the effectiveness was low.

In addition, a second example of highly accurate processing of all substrates is shown in the perspective view of FIG. The etching solution is sprayed with the nozzle 9 for a certain period of time. After that, the door 10 was fully opened and the board 2 was taken out. Since the substrate 2 is etched while standing upright, the etching solution does not stay on the substrate 2, and both sides of the substrate 2 have the same finish.

Although the accuracy is the same as that of the first example of the conventional device.

The lower side of the substrate 2 in an upright state has a deteriorated flow of liquid compared to the upper side, and the spray of etching liquid is completely blocked, so uniform etching cannot be performed, and the unit form of the process is Since it is a batch process (sequential batch process), it has the disadvantage that it is not suitable for mass production and requires a large number of man-hours.

The object of the invention is to provide a conveying surface treatment device that solves the drawbacks of the conventional devices.According to the present invention, a plurality of continuous hair rollers consisting of a pair of upper and lower feed rollers are driven to pass through a chemical spray chamber. In a conveying surface treatment device that processes the surface of a plate to be treated, a line connecting the widthwise center of the above-mentioned conveyor roller on the artificial side and the widthwise center of the outlet side of the conveyor roller at the height of the entire conveyor passage line is rotated. A conveying surface treatment device is obtained, which is characterized by having a mechanism for fully rotating the entire conveyor as an imaginary axis, and a chemical spray nozzle arranged around the conveyor.

Hereinafter, an embodiment of the conveying surface treatment apparatus according to the invention applied to an etching apparatus for all substrates will be described with reference to all of FIGS. 3 to 8. Figures 3 and 4 are side sectional views of non-embodiments, and Figure 5 is a front view from the conveyor entrance side.
FIG. 6 is a front sectional view of the etching chamber, FIG. 7 is a square view from the exit side of the conveyor, and FIG. 8 is a perspective view of the driving principle of the conveyor rollers. First, I will explain the entire configuration. From the etching chamber 3 on the right to the washing chamber 7 on the left, there are an upper nozzle 4, a lower nozzle 5, and left and right nozzles 1 vertically installed on both sides.
A conveyor frame 12 is connected between the conveyor frames 1 and 1. The conveyor frame 12 includes rotating disks 14a and 14b held by pulleys 13 arranged radially in the etching chamber 3 and the washing chamber 7, respectively.

14C, and the J rotating disks 14a, 14b, 14C are fixed to the substrate passing line P of the conveyor roller 1.
, L is the center point of the width of the conveyor roller 10, which is the center of full rotation. As shown in FIG. 5, a timing belt 17 is hung between a timing spur gear 15a attached to a rotating disk 14a and a timing spur gear 15b on the motor 16 side. The shape of the conveyor roller 1 is a round conveyor roller 1 as shown in FIG. 8 so as not to interfere with spraying. As shown in FIG. 3, of the pair of upper and lower conveyor rollers 1, the upper conveyor roller 1 in a freely rotating state is pushed by the spring 18 to the lower shaft-driven conveyor roller 1 and receives a driving force. The spring 18 also holds the substrate 2 during transportation.

Next, the configuration of the drive system of the conveyor roller 1 will be explained. As shown in FIG. 8, an internal gear 19 is provided on the rotary disk 14C, and a driven small gear 20 is meshed with the internal gear. The conveyor main 1 drive shaft 21 has a small gear 20. A driving bevel gear 23 is disposed at a position where it meshes with a driven bevel gear 22 attached to the shaft end of each conveyor roller 1. The relationship with L (see Figure 3) is that when the substrate 2 passes through the etching chamber 3, the inclination (including horizontal and vertical) of the substrate 2 when it enters the etching chamber 3 and the The conveyor frame 12 is rotated at an integral number of revolutions so that the surface position remains the same when exiting the etching chamber 3'f.

To satisfy this condition, each gear is selected using the following formula.

Internal gear19. NhN, the number of revolutions of the small gear is 200.

The pitch circle diameter is D! , D2. Letting the number of teeth 'i'' be Zt and Zz, then N2/N!=Dt/Dt=Zx/Z2.

If Nt'rl, then N z == D 1 / ])
It becomes z. Driven bevel gear 22. and prime mover gear 23
If the number of teeth is 1:1, the number of rotations of the conveyor roller 1 will be equal to N2. As the diameter kDs of the conveyor roller 1, set the diameter of each gear so that the answer to the quadratic equation is an integer. Determine the number of lli and conveyor row 2-10Kl.

At this time, the rotation speed of the competition frame 120 is set such that the substrate 2 can be easily thrown into the conveyor roller 1.

N, XD3 X□=integer The calculated integer value is the value at which the substrate 2 rotates in the etching chamber 3. The etching time (to avoid insufficient etching or excessive etching) must be changed depending on the thickness of the copper foil on the substrate 2, but since the conveyor roll 1 is rotating at 120 revolutions per conveyor 7 frame, no Even at the conveyor speed, the substrate 2 always rotates in the etching chamber 3 at the calculated integer value.

Next, the etching process will be explained.

The motor 16 is fully rotated to rotate the conveyor frame 12 and the conveyor roller 1 is fully rotated so as to achieve a predetermined conveyor speed. Insert the substrate 2 into the input port 24, and insert the upper nozzle 4 as shown in FIG. Etching liquid 6 is sprayed from the lower nozzle 5 and the nozzles on both sides, and the substrate 2 is moved into the etching chamber 3 by rotation of the conveyor roller 1. The substrate 2 is transported to the washing chamber 7 while being rotated, and the substrate 2 is taken out from the take-out port 25 to complete the etching process.

The above two inventions have the following effects.

(1) The same and uniform etching finish can be obtained on both sides of the substrate.

(1i) The etching process can be reliably performed on a substrate carrying a high-precision circuit, and the production yield v can be improved.

((10 mafi- Mass production processing can be performed and the number of man-hours can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 2 are side sectional views of the first and @2 parts of a conventional conveying surface treatment device, respectively. 3 and 4 are side cross sections of an embodiment of the invention, showing the processing state when the conveyor is horizontal and the processing state when the conveyor is vertical, respectively. FIG. 5 is a front view from the entrance side of the conveyor, and FIG. Figure 6 is a front sectional view of the etching chamber, Figure 7 is a front view from the conveyor exit side, and Figure 8 is a perspective view showing the driving principle of the conveyor rollers.・・・・Basic L
3...Etching chamber, 4...Upper nozzle, 5...Lower nozzle. 6...Engine, tinging liquid, 7...Washing room,
8...booth, 9...nozzles on both sides,
10...door, 11...left and right nozzles,
12... Conveyor frame, 13...
Pulley Th 14a, 14b, 14C...Rotating disk h 15a. 15b... Timing spur gear, 16...
・Motor, 17...Taiimi/Gubert, 18
······spring. 19... Internal gear, 20... Small gear, 21
...Main drive shaft, 22...Driver bevel gear, 23...Main mover gear, 24...Input port %25...Take out mouth.

Claims (1)

[Claims] In a conveying surface treatment device that treats the surface of a plate to be treated by passing through a chemical spray chamber by driving a plurality of conveyor rollers consisting of a pair of upper and lower feed rollers, the center of the width direction of the artificial side of the conveyor roller and the conveyor The present invention is characterized by a mechanism for rotating the entire conveyor using a line connecting the widthwise centers of the exit side of the rollers at the height of the conveyor passage line as a rotating aerial axis, and a mechanism in which the entire conveyor is rotated, and chemical spray nozzles are all disposed around the conveyor. Conveyance surface treatment equipment.