JPS60130643U - ノズル位置出し機構 - Google Patents

ノズル位置出し機構

Info

Publication number
JPS60130643U
JPS60130643U JP1904984U JP1904984U JPS60130643U JP S60130643 U JPS60130643 U JP S60130643U JP 1904984 U JP1904984 U JP 1904984U JP 1904984 U JP1904984 U JP 1904984U JP S60130643 U JPS60130643 U JP S60130643U
Authority
JP
Japan
Prior art keywords
nozzle
tape
lever
holding block
positioning mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1904984U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0249711Y2 (enrdf_load_stackoverflow
Inventor
手嶋　實
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1904984U priority Critical patent/JPS60130643U/ja
Publication of JPS60130643U publication Critical patent/JPS60130643U/ja
Application granted granted Critical
Publication of JPH0249711Y2 publication Critical patent/JPH0249711Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1904984U 1984-02-13 1984-02-13 ノズル位置出し機構 Granted JPS60130643U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1904984U JPS60130643U (ja) 1984-02-13 1984-02-13 ノズル位置出し機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1904984U JPS60130643U (ja) 1984-02-13 1984-02-13 ノズル位置出し機構

Publications (2)

Publication Number Publication Date
JPS60130643U true JPS60130643U (ja) 1985-09-02
JPH0249711Y2 JPH0249711Y2 (enrdf_load_stackoverflow) 1990-12-27

Family

ID=30508259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1904984U Granted JPS60130643U (ja) 1984-02-13 1984-02-13 ノズル位置出し機構

Country Status (1)

Country Link
JP (1) JPS60130643U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021199440A1 (enrdf_load_stackoverflow) * 2020-04-03 2021-10-07

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021199440A1 (enrdf_load_stackoverflow) * 2020-04-03 2021-10-07
EP4101573A4 (en) * 2020-04-03 2023-03-29 Hirata Corporation SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, COMPONENT ASSEMBLY DEVICE AND MANUFACTURING SYSTEM

Also Published As

Publication number Publication date
JPH0249711Y2 (enrdf_load_stackoverflow) 1990-12-27

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