JPS60127347A - Phenolic resin molding material - Google Patents

Abstract

PURPOSE:A material, obtained by incorporating a phenolic resin having a constant chlorine ion concentration or below with a filler, having improved resistance to electrolytic corrosion, heat and hydrolysis, and suitable for electronic apparatuses and computers, etc. CONSTITUTION:A phenolic resin molding material obtained by incorporating a phenolic resin having <=10ppm chlorine ion concentration with a filler having <=20ppm chlorine ion concentration in an amount of 50-80wt% based on the total weight. A phenolic resin having <=0.5wt% free phenol content is preferred for the phenolic resin.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a phenol resin molding material used for electronic equipment, electrical equipment, computers, etc.

[Background technology]

Recent electronic equipment, electric equipment, convenience stores, etc. are highly oriented toward higher performance and smaller size.As a result, the synthetic resin parts used are required to have improved heat resistance and longer service life to cope with the rise in ambient air temperature. There were requests for improvements in the electrical corrosion resistance and hydrolysis resistance of the rounded parts. Traditionally commonly used
General-purpose phenolic resin molding materials have excellent heat resistance and hydrolysis resistance, but poor galvanic corrosion resistance, polybutylene terephthalate molding materials have excellent galvanic corrosion resistance, but poor heat resistance and hydrolysis resistance, and polypropylene molding materials have It has advantages and disadvantages, such as excellent galvanic corrosion resistance and hydrolysis resistance, but poor heat resistance, and there has been no molding material that satisfies all of them.

[Purpose of the invention]

The object of the present invention is to provide a phenolic resin molding material having excellent electrolytic corrosion resistance, heat resistance, and hydrolysis resistance in order to meet the above-mentioned needs.

[Disclosure of the invention]

The present invention provides pheno-A with a chloride ion concentration of 10 ppm or less.
The present invention will be described in detail below using a pheno-y@fat molding material, which is characterized in that it is made by adding a filler having a chloride ion content of 20 ppmJg or less to a resin.

The phenolic resin used in the present invention is chloride ion astringent skin 10p
If it is below pm, novolac type pheno-1v resin,
It may be any of the resol type phenol/l/@j fats, and may be used singly, as a mixture, or as a modified product. However, in the case of novolak type pheno-JV resin, the use of a chlorine-containing catalyst such as hydrochloric acid increases the concentration of chlorine-containing ions in the phenol resin, so it cannot be used in the present invention for h0 or pheno-M resin. Free phenol wax inside is 0.
It is desirable that the weight ratio be 5 or less (hereinafter simply referred to as "weight ratio") as this tends to improve electrolytic corrosion resistance, heat resistance, and hydrolysis resistance. As a filler, the chloride ion concentration is 20
There is no particular limitation as long as there is a filler of ppm or less, but it is preferable to include an inorganic filler that facilitates the removal of chlorine ions. The amount of filler is not particularly limited, but is preferably 50 to 50% of the total amount.
A thickness of 80 yen is desirable in order to maintain a balance between heat resistance and moldability. Additives other than the above pheno-IV resin and filler include mold release agents and coloring agents that are commonly used in phenolic resin molding materials, as well as curing agents as needed, kneaded, and pulverized. Grain and pheno-
1v resin molding material.

The present invention will be explained below based on examples.

〔Example〕

To 1 mole of phenol, 0.85 mole of hopal redehyde was added with 37% formalin, and the mixture was heated at reflux temperature at 60% using an oxalic acid catalyst.
The reaction was carried out for a minute to obtain a novolak type pheno-tV@fat with a chloride ion concentration of 7 ppm (2). Next, 0 parts of calcium carbonate with a chloride ion concentration of 15 ppm, 4 parts of hexamic acid, 1 part of stearic acid, and 1 part of carbon black were added to 34 parts by weight of the phenol resin (hereinafter simply referred to as "parts"), mixed, and pulverized. A phenolic resin molding material was obtained.

[Comparative Example 1] The same procedure as in Example was carried out except that the oxalic acid catalyst was used as a hydrochloric acid catalyst.
A Pheno/I/ resin molding material was obtained by processing in the same manner as in Example except that the Pheno-7 resin was used.

[Comparative Example 2] A phenol resin molding material was prepared in the same manner as in the example except that the same pheno-M resin as in the example was used and glass fiber powder with a chloride ion concentration of 260 ppm was used instead of calcium carbonate. Obtained.

[Comparative Example 3] A phenol resin molding material was obtained in the same manner as in Example except that wood flour with a chloride ion concentration of 1600 was used instead of calcium carbonate.

[Comparative Example 4] A phenolic resin molding material was obtained in the same manner as in the example except that pulp with a chloride ion concentration of 200 was used instead of carbonate.

〔Effect of the invention〕

The phenolic resin molding materials of Examples and Comparative Examples 1 to 4 were molded at a molding pressure of 100'q/c in a condenser cap mold.
4. A molded product was obtained by molding at 150℃ for 3 minutes, and the results of evaluating the electrolytic corrosion resistance, heat resistance, and hydrolysis resistance of the molded product were the first.
As is clear from the table, the performance of molded articles obtained from the phenolic resin molding material of the present invention was well confirmed to be superior to that of the present invention.

Table 1 patent applicant Matsushita Electric Works Co., Ltd. Representative Patent Attorney Toshimaru Takemoto (and 2 others)

Claims (2)

[Claims] (1) A pheno-V resin molding material characterized by being made by adding a filler with a chloride ion concentration of 20 ppm AJ or less to a phenol resin with a chloride ion concentration of 10 ppm or less. (2) The phenol according to claim 1, characterized in that the amount of the filler is from % to % by weight of the total amount.
/I/Resin molding material.