JPS60125620A - Detecting method for clamping force - Google Patents

Detecting method for clamping force

Info

Publication number
JPS60125620A
JPS60125620A JP23354283A JP23354283A JPS60125620A JP S60125620 A JPS60125620 A JP S60125620A JP 23354283 A JP23354283 A JP 23354283A JP 23354283 A JP23354283 A JP 23354283A JP S60125620 A JPS60125620 A JP S60125620A
Authority
JP
Japan
Prior art keywords
clamping force
mold clamping
fixed
elongation
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23354283A
Other languages
Japanese (ja)
Inventor
Zenji Inaba
善治 稲葉
Hiromasa Ootake
大竹 弘真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Priority to JP23354283A priority Critical patent/JPS60125620A/en
Publication of JPS60125620A publication Critical patent/JPS60125620A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/7653Measuring, controlling or regulating mould clamping forces

Abstract

PURPOSE:To detect clamping force, by detecting extension of a tie bar between stationary plates. CONSTITUTION:As a tie bar 10 is fixed to stationary plates 1, 2, molds 7, 7' are fixed to a movable plate 3 and the stationary plate 2 and a servomotor M are actuated, it becomes that the movable plate 3 and the mold 7 are moved and clamping of the mold is performed through a nut 5 and a ball screw 4. Resistance wire 8 fixed respectively to the stationary plate 1, 2 is stretched between the stationary plate 1, 2 and a bridge circuit is constituted with a variable resistor R1, resistors R2, R3, an electric power source E and a galvanometer A. Then clamping force becomes detectable as extension of the tie bars 9, 10 is detected due to a fact that when a distance between the stationary plate 1, 2 is displaced, a resistance value of the resistance wire 8 is varied also and this variation is detected by the galvanometer A when clamping of the mold is started.

Description

【発明の詳細な説明】 産業上の利用分野と従来技術 本1発明は、射出成形機における型締装置の型締力検出
方法に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application and Prior Art The present invention relates to a method for detecting mold clamping force of a mold clamping device in an injection molding machine.

射出成形機の型締装置において、型締力を測定する場合
、油圧で型締を行う直圧式型締装置であれば、その油圧
シリンダの油圧を測定し型締力を検出することができる
が、トグル式型締装置においては、現在締付けている力
はどの程度のものか単純には検出できない。トグル式型
締装置を使用した射出成形機において、射出力を大きく
していくと、射出力に応じて型締力も増大し、特に、設
計以上の射出力で射出すると型締力が極端に増大し、タ
イバーやナツト等を破損する等の事故も生じる。そこで
、従来は、ロードセル等を挿入し、型締力を測定する方
法が取られていた。
When measuring the mold clamping force in the mold clamping device of an injection molding machine, if it is a direct pressure mold clamping device that clamps the mold using hydraulic pressure, it is possible to measure the hydraulic pressure of the hydraulic cylinder and detect the mold clamping force. In a toggle type mold clamping device, it is not possible to simply detect the current clamping force. In an injection molding machine that uses a toggle type mold clamping device, as the injection force is increased, the mold clamping force also increases in proportion to the injection force, and in particular, when the injection force is higher than the design, the mold clamping force increases extremely. However, accidents such as damage to tie bars and nuts may also occur. Therefore, a conventional method has been to insert a load cell or the like and measure the mold clamping force.

発明の目的 本発明は、型締装置の固定盤の変位、すなわち、タイバ
ーの伸びを検出し、それから型締力を検出する型締力検
出方法を提供することを目的としている。
OBJECTS OF THE INVENTION An object of the present invention is to provide a mold clamping force detection method that detects displacement of a fixed plate of a mold clamping device, that is, elongation of tie bars, and then detects mold clamping force.

発明の構成 本発明は、射出成形機の型締装置において、固定盤間の
タイバーの伸びを検出して型締力を検出する型締力検出
方法である。
Structure of the Invention The present invention is a mold clamping force detection method for detecting mold clamping force by detecting elongation of tie bars between fixed plates in a mold clamping device of an injection molding machine.

実施例 第1図は、本発明の第1の実施例を示す図で、1及び2
は射出成形機の型締装置の固定盤、3は可動盤で、該可
動盤3は、本実施例では1ナ一ボモータM、伝導装置6
.ナツト5.ボールネジ4により、第1図中左右方向に
移動できるようになっている。7及び7′は金型で、可
動盤3及び固定盤2に固着されている。9,10は一1
ニ記固定盤1゜2に固着されたタイバーである。また、
8は上記固定盤1,2間に張られ、固定盤1,2にぞれ
ぞれ固着された抵抗線であり、該抵抗線8と可変抵抗R
+、抵抗R2,R3でブリッジ回路を構成している。な
お、Eは電源、Aは検流計である。
Embodiment FIG. 1 is a diagram showing a first embodiment of the present invention.
3 is a fixed plate of the mold clamping device of an injection molding machine, and 3 is a movable plate. In this embodiment, the movable plate 3 includes a 1-stroke motor M and a transmission device 6.
.. Natsu 5. A ball screw 4 allows movement in the left and right directions in FIG. 7 and 7' are molds, which are fixed to the movable platen 3 and the fixed platen 2. 9, 10 is one one
D. This is a tie bar fixed to the fixed plate 1°2. Also,
Reference numeral 8 denotes a resistance wire stretched between the fixed plates 1 and 2 and fixed to the fixed plates 1 and 2, respectively, and the resistance wire 8 and the variable resistance R
+, resistors R2 and R3 constitute a bridge circuit. Note that E is a power source and A is a galvanometer.

上記構成において、サーボモータMが回転し、伝導装置
6を介してナツト5を回転さぜ、ボールネジ4を第1図
右方に移動させ、可動盤3及び金型7を移動させ、金型
7.7′を閉じ、型の締付けが始まるど、固定盤2は金
型7,7′を介して可1PII盤3から押圧され、タイ
バー9.10は伸び、固定盤1,2間の距姻は変位し、
抵抗線8も伸びる。そのため、抵抗線8の抵抗値も変化
し、イの変化を検流計Aににつで検出し、抵抗線8の伸
び、すなわち、タイバー9,10の伸びを検出すること
ができる。イして、金型7,7′への型締力はタイバー
9,10の伸びによって生じるものであるから、抵抗線
8の伸びによって生じた検流計Aの変化値によって型締
力を検出1−ることかできることとなる。
In the above configuration, the servo motor M rotates, rotates the nut 5 via the transmission device 6, moves the ball screw 4 to the right in FIG. 1, moves the movable platen 3 and the mold 7, and 7' is closed and the mold tightening begins, the fixed platen 2 is pressed from the PII plate 3 via the molds 7 and 7', the tie bars 9 and 10 are extended, and the distance between the fixed plates 1 and 2 is increased. is displaced;
Resistance line 8 also stretches. Therefore, the resistance value of the resistance wire 8 also changes, and the change in A can be detected by the galvanometer A, and the elongation of the resistance wire 8, that is, the elongation of the tie bars 9 and 10 can be detected. Since the mold clamping force on the molds 7 and 7' is generated by the elongation of the tie bars 9 and 10, the mold clamping force is detected by the change in galvanometer A caused by the elongation of the resistance wire 8. 1- It becomes possible to do something.

第2図は第2の実施例で、第1の実施例と相違する点は
、抵抗線8の代わりに型締力検出用バー11を設(プた
貞である。なお、第1の実施例と同一のちのは同じ符号
を付して表わしている。覆なわち、上記型締力検出用バ
ー11は固定盤2に一端を固着され、可動盤3上のカイ
ト片13を貫通し、固定盤1に設(プられた伸び検出部
14に支持されている。また、該伸び検出部1/1は、
第3図に示すJ:うに、固定盤1上に固定された抵抗素
子15ど上記型締力検出用バー11に設けられた摺動子
Cで構成され、上記摺動子Cが抵抗素子15上を摺動づ
るようになっている。そして、上記抵抗素子15の端子
a、b間に電圧を印加し、一方の端子aまたはbど摺動
子C間の電圧を測定することによってタイバー9及び1
0の伸びをを測定し、締付力を測定できるようになって
いる。
FIG. 2 shows a second embodiment, which differs from the first embodiment in that a clamping force detection bar 11 is provided instead of the resistance wire 8. Items that are the same as those in the example are denoted by the same reference numerals.In other words, the mold clamping force detection bar 11 has one end fixed to the fixed platen 2, passes through the kite piece 13 on the movable platen 3, It is supported by an elongation detecting section 14 installed on the fixed platen 1. Also, the elongation detecting section 1/1 is
J as shown in FIG. It is designed to slide on the top. Then, by applying a voltage between the terminals a and b of the resistance element 15 and measuring the voltage between one terminal a or b and the slider C, tie bars 9 and 1
It is possible to measure the elongation at zero and the tightening force.

第1の実施例で説明したように、サーボモータMにより
型締が行われ、タイバー9,10が伸び、型の締付(]
が行なわれるど、該タイバー9,10の伸び、すなわち
、固定盤1.2間の距離の変化により型締力検出用バー
11に設けられた摺動子Cは抵抗素子15上を摺動し、
そのため、摺動子Cと抵抗素子15の一方の端子aまた
は6間の電位は変化する。この変化から、タイバーの伸
び、すなわち、型締力を検出するものである。
As explained in the first embodiment, the mold is clamped by the servo motor M, the tie bars 9 and 10 are extended, and the mold is clamped (]
When this is performed, the slider C provided on the mold clamping force detection bar 11 slides on the resistance element 15 due to the elongation of the tie bars 9 and 10, that is, the change in the distance between the fixed plates 1 and 2. ,
Therefore, the potential between the slider C and one terminal a or 6 of the resistance element 15 changes. From this change, the elongation of the tie bar, that is, the mold clamping force is detected.

なお、上記実施例では、タイバーの伸び、すなわち、締
付力を抵抗値の変化によって検出したが、固定盤間の距
離を測定する他の方法、例えばレーザービーム等によっ
て固定盤の距離を測定したり、一方の固定盤にビニオン
を有する回転検出器を設5− Gノ、使方の固定盤に上記ビニA−ンと噛み合うラック
を固着して、タイバーの伸びを検出器によって検出して
締付力を検出してもよい。
In the above embodiment, the elongation of the tie bar, that is, the tightening force, was detected by the change in resistance value, but the distance between the fixed plates could be measured using other methods such as a laser beam, etc. Alternatively, install a rotation detector with a pinion on one of the fixed plates.Fix a rack that engages with the pinion on the fixed plate in use, and use the detector to detect the elongation of the tie bar and tighten it. The applied force may also be detected.

発明の効果 本発明は、固定盤の距離、すなわち、タイバーの伸びを
測定し、締付力を検出するようにしたから、簡単な行為
で締付力が検出でき、かつ、締付力を発生するタイバー
の伸びを検出するものであるから、正確な締付力を検出
することができるものである。
Effects of the Invention The present invention detects the tightening force by measuring the distance of the fixed plate, that is, the elongation of the tie bar, so the tightening force can be detected with a simple action and the tightening force can be generated. Since this method detects the elongation of the tie bar, it is possible to accurately detect the tightening force.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の第1の実施例を示す図、第2図は、
同第2の実施例を示す図、第3図は、第2の実施例にお
ける伸び検出部の詳細図である。 1.2・・・固定盤、3・・・可動盤、7.7′・・・
金型、8・・・抵抗線、9,10・・・タイバー、11
・・・型締力検出用バー、14・・・伸び検出部。 −〇−
FIG. 1 is a diagram showing a first embodiment of the present invention, and FIG. 2 is a diagram showing a first embodiment of the present invention.
FIG. 3, a diagram showing the second embodiment, is a detailed diagram of the elongation detection section in the second embodiment. 1.2...Fixed plate, 3...Movable plate, 7.7'...
Mold, 8... Resistance wire, 9, 10... Tie bar, 11
... Mold clamping force detection bar, 14... Elongation detection section. −〇−

Claims (3)

【特許請求の範囲】[Claims] (1)射出成形機の型締装置において、固定盤間のタイ
バ〜の伸びを検出して型締力を検出する型締力検出方法
(1) A mold clamping force detection method for detecting mold clamping force by detecting the elongation of tie bars between fixed plates in a mold clamping device of an injection molding machine.
(2)上記固定盤間に張られた抵抗線の伸びによる抵抗
値の変化により型締力を検出する特許請求の範囲第1項
記載の型締力検出方法。
(2) The mold clamping force detection method according to claim 1, wherein the mold clamping force is detected by a change in resistance value due to elongation of a resistance wire stretched between the fixed plates.
(3)一方の固定盤に抵抗素子を固定し、他方の固定盤
に検出棒を固定し、該検出棒に固定されたワイパーが上
記抵抗素子上を摺動するようにし、該ワイパーから得ら
れる抵抗値の変化からタイバーの伸びを検出し、型締力
を検出する特許請求の範囲第1項記載の型締力検出方法
(3) A resistance element is fixed to one fixed plate, a detection rod is fixed to the other fixed plate, and the wiper fixed to the detection rod slides on the resistance element, so that the wiper can be obtained from the wiper. The method for detecting mold clamping force according to claim 1, wherein elongation of the tie bar is detected from a change in resistance value to detect mold clamping force.
JP23354283A 1983-12-13 1983-12-13 Detecting method for clamping force Pending JPS60125620A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23354283A JPS60125620A (en) 1983-12-13 1983-12-13 Detecting method for clamping force

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23354283A JPS60125620A (en) 1983-12-13 1983-12-13 Detecting method for clamping force

Publications (1)

Publication Number Publication Date
JPS60125620A true JPS60125620A (en) 1985-07-04

Family

ID=16956682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23354283A Pending JPS60125620A (en) 1983-12-13 1983-12-13 Detecting method for clamping force

Country Status (1)

Country Link
JP (1) JPS60125620A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278833A (en) * 1985-09-30 1987-04-11 Mitsubishi Electric Corp Resin sealing device for semiconductor element
US6402497B1 (en) 1992-03-24 2002-06-11 Toshinobu Banjyo Mold clamping device with improved clamping force transmission mechanism
JP2008006651A (en) * 2006-06-28 2008-01-17 Sumitomo Heavy Ind Ltd Mold clamping force setting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5024158B1 (en) * 1973-08-20 1975-08-13
JPS5130580B2 (en) * 1972-06-29 1976-09-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130580B2 (en) * 1972-06-29 1976-09-01
JPS5024158B1 (en) * 1973-08-20 1975-08-13

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278833A (en) * 1985-09-30 1987-04-11 Mitsubishi Electric Corp Resin sealing device for semiconductor element
JPH0449253B2 (en) * 1985-09-30 1992-08-11 Mitsubishi Electric Corp
US6402497B1 (en) 1992-03-24 2002-06-11 Toshinobu Banjyo Mold clamping device with improved clamping force transmission mechanism
JP2008006651A (en) * 2006-06-28 2008-01-17 Sumitomo Heavy Ind Ltd Mold clamping force setting method

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