JPS60125055U - Copper-clad laminate surface leveling device - Google Patents
Copper-clad laminate surface leveling deviceInfo
- Publication number
- JPS60125055U JPS60125055U JP1280684U JP1280684U JPS60125055U JP S60125055 U JPS60125055 U JP S60125055U JP 1280684 U JP1280684 U JP 1280684U JP 1280684 U JP1280684 U JP 1280684U JP S60125055 U JPS60125055 U JP S60125055U
- Authority
- JP
- Japan
- Prior art keywords
- copper
- clad laminate
- leveling device
- surface leveling
- laminate surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図〜第3図は、本考案の一実施例を示すもので、第
1図は斜視図、第2図は一部を断面にした側面図、第3
図は第2図の■−■線に沿う矢視図である。
1・・・ターンテーブル、2・・・支持面、3・・・回
動機構、4・・・回転ブラシ、5・・・平行移動機構、
L・・・銅張積層板。Figures 1 to 3 show an embodiment of the present invention, in which Figure 1 is a perspective view, Figure 2 is a partially sectional side view, and Figure 3 is a partially sectional side view.
The figure is a view taken along the line ■-■ in FIG. 2. DESCRIPTION OF SYMBOLS 1... Turntable, 2... Support surface, 3... Rotation mechanism, 4... Rotating brush, 5... Parallel movement mechanism,
L...Copper clad laminate.
Claims (1)
ーンテーブル1と、該ターンテーブルを回動させて銅張
積層板の面方向の向きを変える回動機構3と、前記支持
面と平行に配されて銅張積層板の表面状態を整えるロー
ル状の回転ブラシ4と、該回転ブラシと銅張積層板とを
接触させた状態で回転ブラシをその転勤方向に支持面に
沿って移動させる平行移動機構5とを具備した銅張積層
板の整面装置。A turntable 1 on which a planar support surface 2 for receiving a copper-clad laminate is formed; a rotation mechanism 3 for rotating the turntable to change the surface direction of the copper-clad laminate; and the support surface. A roll-shaped rotating brush 4 is arranged parallel to the copper-clad laminate to adjust the surface condition of the copper-clad laminate, and with the rotating brush and the copper-clad laminate in contact with each other, the rotating brush is moved along the support surface in the transfer direction. A surface leveling device for copper-clad laminates, which is equipped with a parallel movement mechanism 5 for moving.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1280684U JPS60125055U (en) | 1984-02-01 | 1984-02-01 | Copper-clad laminate surface leveling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1280684U JPS60125055U (en) | 1984-02-01 | 1984-02-01 | Copper-clad laminate surface leveling device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60125055U true JPS60125055U (en) | 1985-08-23 |
Family
ID=30496216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1280684U Pending JPS60125055U (en) | 1984-02-01 | 1984-02-01 | Copper-clad laminate surface leveling device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60125055U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0752020A (en) * | 1993-08-05 | 1995-02-28 | B B F Yamate:Kk | Wet type abrasive method and its device |
-
1984
- 1984-02-01 JP JP1280684U patent/JPS60125055U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0752020A (en) * | 1993-08-05 | 1995-02-28 | B B F Yamate:Kk | Wet type abrasive method and its device |
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