JPS60120756U - Copper-clad laminate surface leveling device - Google Patents
Copper-clad laminate surface leveling deviceInfo
- Publication number
- JPS60120756U JPS60120756U JP948384U JP948384U JPS60120756U JP S60120756 U JPS60120756 U JP S60120756U JP 948384 U JP948384 U JP 948384U JP 948384 U JP948384 U JP 948384U JP S60120756 U JPS60120756 U JP S60120756U
- Authority
- JP
- Japan
- Prior art keywords
- copper
- clad laminate
- rotating brush
- leveling device
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図〜第３図は本考案の一実施例を示し、第１図は斜
視図、第２図は一部を断面にした側面図、第３図は第２
図の■−■線に沿う矢視図、第４図は本考案の他の実施
例を示す斜視図である。
１・・・固定台、２・・・支持面、３・・・回転ブラシ
、４．１７・・・平行移動機構、５，１６・・・回動機
構、 □Ｌ・・・銅張積層板。Figures 1 to 3 show one embodiment of the present invention, with Figure 1 being a perspective view, Figure 2 being a partially sectional side view, and Figure 3 being a second embodiment of the present invention.
FIG. 4 is a perspective view showing another embodiment of the present invention. 1... Fixed base, 2... Support surface, 3... Rotating brush, 4.17... Parallel movement mechanism, 5, 16... Rotating mechanism, □L... Copper clad laminate .
Claims (1)
定台１と、前記支持面と平行に配されて銅張積層板に接
触しながらその表面状態を整えるロール状の回転ブラシ
３と、該回転ブラシをその転勤方向に支持面に沿って移
動させる平行移動機構４，１７と、前記回転ブラシと銅
張積層板とを離間させた状態で回転ブラシを支持面と平
行に旋回させてその向きを変える回動機構５，１６とを
具備した銅張積層板の整面装置。A fixing base 1 having a planar support surface 2 for receiving a copper plate laminate, and a roll-shaped rotating brush 3 disposed parallel to the support surface to adjust the surface condition of the copper clad laminate while contacting the same. , a parallel movement mechanism 4, 17 for moving the rotating brush along the supporting surface in the transfer direction; and rotating the rotating brush parallel to the supporting surface with the rotating brush and the copper-clad laminate separated from each other. A surface leveling device for copper-clad laminates, which includes rotating mechanisms 5 and 16 for changing the direction of the copper-clad laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP948384U JPS60120756U (en) | 1984-01-26 | 1984-01-26 | Copper-clad laminate surface leveling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP948384U JPS60120756U (en) | 1984-01-26 | 1984-01-26 | Copper-clad laminate surface leveling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60120756U true JPS60120756U (en) | 1985-08-15 |
Family
ID=30489744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP948384U Pending JPS60120756U (en) | 1984-01-26 | 1984-01-26 | Copper-clad laminate surface leveling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60120756U (en) |
-
1984
- 1984-01-26 JP JP948384U patent/JPS60120756U/en active Pending
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