JPS60124945A - Pellet bonder - Google Patents
Pellet bonderInfo
- Publication number
- JPS60124945A JPS60124945A JP23397683A JP23397683A JPS60124945A JP S60124945 A JPS60124945 A JP S60124945A JP 23397683 A JP23397683 A JP 23397683A JP 23397683 A JP23397683 A JP 23397683A JP S60124945 A JPS60124945 A JP S60124945A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- stem
- camera
- center
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、例えば光通信用受光素子等に用いられている
べVットとステム(基台)とをろう材によって固着する
ペレットボンダに関し、特にペレットとステムとの位置
を補正する機構の改良に関するものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a pellet bonder that uses a brazing material to bond a V-bet and a stem (base), which are used for example in light receiving elements for optical communication, etc. In particular, the present invention relates to improvements in a mechanism for correcting the positions of pellets and stems.
一般に、光通信用受光素子はその性質去、ペレットがス
テムに高精度に位置合せして固着されていることが要求
されるが、従来、この位置合せは顕微鏡を用いた目視に
よって位置ずれを検出し、その位置ずれを手作業によっ
て補正する方法がとられている。このため、位置決め精
度に限度があり、これ管補うために両者の位置が正確か
否かを判別する選別工程が必要になって工数が大きくな
るという問題点があった。一方、ペレットの位置を機械
的に決定して両者を固着する自動ペレットボンダがある
が、ここで得られる位置精度は±50〜1100tt程
度であり、機械的な精度を向上させるだけでは近時に″
要求されている例えば±20μm程度の位置精度は実現
し得ないという問題点があった。Generally, due to the nature of the light receiving element for optical communication, it is required that the pellet is aligned and fixed to the stem with high precision, but conventionally, this alignment has been done by detecting misalignment by visual inspection using a microscope. However, a method is used to manually correct the positional deviation. For this reason, there is a limit to the positioning accuracy, and to compensate for this, a screening process is required to determine whether or not the positions of both are accurate, which increases the number of man-hours. On the other hand, there is an automatic pellet bonder that mechanically determines the position of the pellets and fixes them together, but the positioning accuracy obtained here is about ±50 to 1100 tt, and it is difficult to improve the mechanical accuracy alone.
There is a problem in that the required positional accuracy of, for example, about ±20 μm cannot be achieved.
本発明の目的は、ペレットとステムとを高精度で位置決
めすることができ、製造工数を削減できるペレットボン
ダを提供することにある。An object of the present invention is to provide a pellet bonder that can position pellets and stems with high precision and reduce the number of manufacturing steps.
本発明は、ペレットとステムの間のろう材が溶融状態の
時にペレットに外力を与えるとステム上を移動すること
に着目し、ペレットのパターンを認識するカメラをきむ
画像処理部と、核部で認識したペレットのパターンに基
づきペレットがステムの中心に位1〜.付け−られでい
るか否かを判定する演算部と、この演算部の判定出力に
よりステム上のペレットの位置を修正する修正機構を設
け、ペレットの位@を常時認識しながら修正機構により
ペレットに外力を与えてその位置がステムの中心になる
ように修正するように構成したものである。The present invention focuses on the fact that when the brazing material between the pellet and the stem is in a molten state, when an external force is applied to the pellet, the pellet moves on the stem. Based on the recognized pellet pattern, the pellet is placed at the center of the stem. A calculation unit that determines whether the pellet is attached or not is provided, and a correction mechanism that corrects the position of the pellet on the stem based on the judgment output of this calculation unit.The correction mechanism applies external force to the pellet while constantly recognizing the position of the pellet. is given and the position is corrected so that it becomes the center of the stem.
以下、本発明を実施例に基づいて詳細に説明する。 Hereinafter, the present invention will be explained in detail based on examples.
第1図は本発明の一実施例を示す全体構成図、第2図は
ペレット、ステムおよび位屓補正爪の関係を拡大した図
である。これらの図においてペレット1はろう材13を
介しステム2の上に置かれている。ステム2はステム位
置決め機構3にょシ正確に保持され、かつヒータ4によ
り適度に加熱されている。このステム2に対するペレッ
ト1の供給、仮付けはコレット5により行われる。FIG. 1 is an overall configuration diagram showing one embodiment of the present invention, and FIG. 2 is an enlarged view of the relationship among the pellet, stem, and deformation correction claw. In these figures, pellet 1 is placed on stem 2 via brazing material 13. The stem 2 is accurately held by a stem positioning mechanism 3 and appropriately heated by a heater 4. The pellets 1 are supplied and temporarily attached to the stem 2 by a collet 5.
一方、ステム2の上方には照明系6、光学系7およびカ
メラ8が配置され、カメラ8で受Fjたペレット1の画
像信号は画像処理部9に送り込まれてそのパターンが認
識され、更に演算部lOでステム2の中心に対する位置
ずれ世が算出される。On the other hand, an illumination system 6, an optical system 7, and a camera 8 are arranged above the stem 2, and the image signal of the pellet 1 received by the camera 8 is sent to an image processing section 9 where its pattern is recognized and further processed by calculation. In part 1O, the positional deviation of the stem 2 with respect to the center is calculated.
そして、その演算結果は位置修正機構11に与えられ、
この機構11の動きは位置補正爪12に伝えられる構成
となっている。Then, the calculation result is given to the position correction mechanism 11,
The movement of this mechanism 11 is transmitted to the position correction claw 12.
次に全体の動作を説明する。Next, the overall operation will be explained.
まず、ステム2は予めヒータ4によって適度に加熱され
、かつステム位置決め機構3によりその中心が正確な位
置に保持されている。この時、ろう材13は既にステム
2の上に載せられている。First, the stem 2 is heated appropriately by the heater 4 in advance, and its center is held at an accurate position by the stem positioning mechanism 3. At this time, the brazing material 13 is already placed on the stem 2.
このような状態で、ペレット1がコレット(ペレットを
真空吸着する治具)5によりろう材13の上に置かれ、
場合によってはペレット1を数回往復動させてこす9つ
ける形で置かれ、これが終るとコレット5は退去される
。In this state, the pellet 1 is placed on the brazing material 13 by the collet (a jig that vacuum-adsorbs the pellet) 5,
Depending on the case, the pellet 1 is moved back and forth several times and placed in a manner of being rubbed 9, and when this is finished, the collet 5 is removed.
一方、この間において、照明系6はペレット1のパター
ンが良好に8識できるよりその上方から光を照射してい
る。これにより、ペレット1の映像が必要範囲だけ光学
系7でとらえられてカメラ8に与えられる。そして、カ
メラ8でとらえられたペレット1の映像は映像信号に変
換されて画像処理部9に人力され、ここでペレット1の
パターンが14識される。この認識結果は演算部1oに
与えられる。すると、演算部1oはペレット1がステム
2の中心からどの程度ずれているがを演算し、そのff
iを位置修正機構11に対して現在のずれ量よりも少な
目に与え位置補正爪12を駆動してベレン)IK外力を
与えて移動させる。この後、位置修正機構1工および補
正爪12は一定耐4退去する。そして再び同様にしてベ
レットエの位置が認識され、その中心が必要精度の範囲
から外れていれば再び同様の認識・修正がくり返され、
所定の精度が得られた場合に全体の動作が終了する。On the other hand, during this time, the illumination system 6 irradiates light from above the pellet 1 so that the pattern can be clearly discerned. As a result, an image of the pellet 1 is captured by the optical system 7 within a necessary range and is provided to the camera 8. The image of the pellet 1 captured by the camera 8 is converted into a video signal and input to the image processing section 9, where the patterns of the pellet 1 are recognized. This recognition result is given to the calculation unit 1o. Then, the calculation unit 1o calculates how far the pellet 1 is deviated from the center of the stem 2, and calculates the ff
i is applied to the position correction mechanism 11 to a value smaller than the current amount of deviation, the position correction claw 12 is driven, and external force IK is applied to move the position correction mechanism 11. After this, the position correction mechanism 1 and the correction claw 12 are withdrawn for a certain period of time. Then, the position of the beret is recognized again in the same way, and if the center is outside the required accuracy range, the same recognition and correction is repeated again.
The entire operation ends when a predetermined accuracy is achieved.
ところで、カメラ8は例えば水平走査方向に対し384
個、垂直走査方向に対し489個の合計187776個
の画素から成る撮像素子を備えており、ペレット1のパ
ターンをその濃度に応じて2値化し、この2値化信号を
ペレットパターン映像信号として出力するように構成さ
れている。従っこれに伴って演算部lOにおけるペレッ
ト1の位置ずれ量の算出単位もこの分解能に対応したも
のとなり、結果的にペレソ)1の位置決め精度を±2.
ト吐2,6μmとすることができる。By the way, the camera 8 has, for example, 384 points in the horizontal scanning direction.
It is equipped with an image sensor consisting of a total of 187,776 pixels (489 pixels in the vertical scanning direction), which binarizes the pattern of pellet 1 according to its density, and outputs this binarized signal as a pellet pattern video signal. is configured to do so. Accordingly, the calculation unit for the amount of positional deviation of the pellet 1 in the calculation unit IO also corresponds to this resolution, and as a result, the positioning accuracy of the pellet 1 can be adjusted to ±2.
The discharge thickness can be set to 2.6 μm.
なお、ろう材13の種類によっては冷却パイプ14によ
りN2ガスまたは空気でブ’ −シ、Mi度を若干下降
させてペレッ)1を固定する補助手段を用いてもよい。Depending on the type of brazing filler metal 13, auxiliary means may be used to fix the pellets 1 by blowing with N2 gas or air through the cooling pipe 14 to lower the Mi degree slightly.
この方法を用いればコレット5の機械精度だけでは得ら
れない高精度の位置精度が得られる。If this method is used, high positional accuracy that cannot be obtained by the mechanical accuracy of the collet 5 alone can be obtained.
以上の説明から明らかなように本発明によれば、ペレッ
トの位置認識および修正を自動で行うため従来の手作業
の数倍の能率があがり、さらに良品、不良品を選別する
工程を無くすことができ、さらにまた中心精度の保証レ
ベルを向上させることができる。従って、高精度の位置
決めが要求される光通信用受光素子の製造に用いれば極
めて有益である。As is clear from the above description, according to the present invention, the position recognition and correction of pellets is automatically performed, which increases efficiency several times that of conventional manual work, and furthermore eliminates the process of sorting good and defective products. Furthermore, it is possible to improve the guarantee level of center accuracy. Therefore, it is extremely useful if used in the manufacture of light-receiving elements for optical communications, which require highly accurate positioning.
第1図は本発明の一実施例を示す全体構成図、第2図は
ベレット、ステム、位置補正爪の関係を拡大した図であ
る。
1・・・ペレット、2・・・ステム、3・・・ステム位
置決メ機構、4・・・ヒータ、5・・・コレット、6・
・・照明系、7・・・光学系、8・・・カメラ、9・・
・画像処理部、lO・・・演算部、11・・・位置修正
機構、12・・・位置補正爪、13・・・ろう材、14
・・・冷却パイプ。
代理人 弁理士 鵜沼辰之FIG. 1 is an overall configuration diagram showing one embodiment of the present invention, and FIG. 2 is an enlarged diagram showing the relationship among the pellet, stem, and position correction claw. DESCRIPTION OF SYMBOLS 1... Pellet, 2... Stem, 3... Stem positioning mechanism, 4... Heater, 5... Collet, 6...
...Lighting system, 7...Optical system, 8...Camera, 9...
・Image processing unit, lO... calculation unit, 11... position correction mechanism, 12... position correction claw, 13... brazing material, 14
...cooling pipe. Agent Patent Attorney Tatsuyuki Unuma
Claims (1)
上にろう材を介して載置されたペレットのパターンを認
識するカメラを含む画像処理部と、画像処理部で認識し
たペレットのパターンに基づきペレットがステムの中心
に位置付けられているか否かを判定する演算部と、この
演算部の判定出力によりステム上のペレットの位置をろ
う材が溶融状態にあることを用いて修正する修正機構と
を備えてなるペレットボンダ。1. An image processing section including a camera that recognizes the pattern of the pellets placed on the stem via the brazing material on the stem installed in the positioning mechanism having heating means; A calculation unit that determines whether or not the pellet is positioned at the center of the stem, and a correction mechanism that uses the determination output of the calculation unit to correct the position of the pellet on the stem based on the fact that the brazing material is in a molten state. Tenaru Pellet Bonder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23397683A JPS60124945A (en) | 1983-12-12 | 1983-12-12 | Pellet bonder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23397683A JPS60124945A (en) | 1983-12-12 | 1983-12-12 | Pellet bonder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60124945A true JPS60124945A (en) | 1985-07-04 |
Family
ID=16963582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23397683A Pending JPS60124945A (en) | 1983-12-12 | 1983-12-12 | Pellet bonder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60124945A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0239545A (en) * | 1988-07-29 | 1990-02-08 | Sharp Corp | Die-bonder |
WO2001091174A1 (en) * | 2000-05-26 | 2001-11-29 | Nidec Tosok Corporation | Die bonding device |
-
1983
- 1983-12-12 JP JP23397683A patent/JPS60124945A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0239545A (en) * | 1988-07-29 | 1990-02-08 | Sharp Corp | Die-bonder |
WO2001091174A1 (en) * | 2000-05-26 | 2001-11-29 | Nidec Tosok Corporation | Die bonding device |
US6581817B2 (en) | 2000-05-26 | 2003-06-24 | Nidec Tosok Corporation | Die bonding device |
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