JPS60124038U - Semiconductor device manufacturing equipment - Google Patents

Semiconductor device manufacturing equipment

Info

Publication number
JPS60124038U
JPS60124038U JP1984012937U JP1293784U JPS60124038U JP S60124038 U JPS60124038 U JP S60124038U JP 1984012937 U JP1984012937 U JP 1984012937U JP 1293784 U JP1293784 U JP 1293784U JP S60124038 U JPS60124038 U JP S60124038U
Authority
JP
Japan
Prior art keywords
semiconductor device
bonding
device manufacturing
bonding tool
manufacturing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984012937U
Other languages
Japanese (ja)
Inventor
小関　隆之
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1984012937U priority Critical patent/JPS60124038U/en
Publication of JPS60124038U publication Critical patent/JPS60124038U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図〜第２図は本案のそれぞれ異った実施例を示す要
部断面図である。 図中、２はボンディングツール（キャピラリー）、４は
金属細線、５，５１はエアブロ−装置、６ａは開口部で
ある。FIGS. 1 and 2 are sectional views of essential parts showing different embodiments of the present invention. In the figure, 2 is a bonding tool (capillary), 4 is a thin metal wire, 5 and 51 are air blowers, and 6a is an opening.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）半導体素子の電極及びリードに金属細線をボンデ
ィングするボンディングツールと、ボンディングツール
の周辺に配設したエアブロ−装置とを具備し、上記ボン
ディングツールによる金属細線のボンディングの際に、
ボンディング部分にエアブロ−装置によりエアを吹き付
けることを特徴とする半導体装置の製造装置。(1) Equipped with a bonding tool for bonding thin metal wires to electrodes and leads of semiconductor elements, and an air blower disposed around the bonding tool, when bonding the thin metal wires with the bonding tool,
A semiconductor device manufacturing apparatus characterized by blowing air onto a bonding part using an air blower. （２）ボンディングツールに筒状のエアブロ−装置を、
下端に開口部が形成されるようにほぼ同軸的に装着した
ことを特徴とする実用新案登録請求の範囲第１項に記載
の半導体装置の製造装置。(2) A cylindrical air blow device is attached to the bonding tool.
The semiconductor device manufacturing apparatus according to claim 1, which is mounted substantially coaxially so that an opening is formed at the lower end.
JP1984012937U 1984-01-30 1984-01-30 Semiconductor device manufacturing equipment Pending JPS60124038U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984012937U JPS60124038U (en) 1984-01-30 1984-01-30 Semiconductor device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984012937U JPS60124038U (en) 1984-01-30 1984-01-30 Semiconductor device manufacturing equipment

Publications (1)

Publication Number Publication Date
JPS60124038U true JPS60124038U (en) 1985-08-21

Family

ID=30496475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984012937U Pending JPS60124038U (en) 1984-01-30 1984-01-30 Semiconductor device manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS60124038U (en)

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